{"id":"https://openalex.org/W2168642835","doi":"https://doi.org/10.1145/2483028.2483049","title":"A novel statistical and circuit-based technique for counterfeit detection in existing ICs","display_name":"A novel statistical and circuit-based technique for counterfeit detection in existing ICs","publication_year":2013,"publication_date":"2013-05-02","ids":{"openalex":"https://openalex.org/W2168642835","doi":"https://doi.org/10.1145/2483028.2483049","mag":"2168642835"},"language":"en","primary_location":{"id":"doi:10.1145/2483028.2483049","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2483028.2483049","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 23rd ACM international conference on Great lakes symposium on VLSI","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5028133513","display_name":"Rashmi Moudgil","orcid":null},"institutions":[{"id":"https://openalex.org/I859038795","display_name":"Virginia Tech","ror":"https://ror.org/02smfhw86","country_code":"US","type":"education","lineage":["https://openalex.org/I859038795"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Rashmi Moudgil","raw_affiliation_strings":["Virginia Tech, Blacksburg, VA, USA"],"affiliations":[{"raw_affiliation_string":"Virginia Tech, Blacksburg, VA, USA","institution_ids":["https://openalex.org/I859038795"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5016789555","display_name":"Dinesh Ganta","orcid":null},"institutions":[{"id":"https://openalex.org/I859038795","display_name":"Virginia Tech","ror":"https://ror.org/02smfhw86","country_code":"US","type":"education","lineage":["https://openalex.org/I859038795"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Dinesh Ganta","raw_affiliation_strings":["Virginia Tech, Blacksburg, VA, USA"],"affiliations":[{"raw_affiliation_string":"Virginia Tech, Blacksburg, VA, USA","institution_ids":["https://openalex.org/I859038795"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055219256","display_name":"Leyla Nazhandali","orcid":"https://orcid.org/0000-0002-3267-6465"},"institutions":[{"id":"https://openalex.org/I859038795","display_name":"Virginia Tech","ror":"https://ror.org/02smfhw86","country_code":"US","type":"education","lineage":["https://openalex.org/I859038795"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Leyla Nazhandali","raw_affiliation_strings":["Virginia Tech, Blacksburg, VA, USA"],"affiliations":[{"raw_affiliation_string":"Virginia Tech, Blacksburg, VA, USA","institution_ids":["https://openalex.org/I859038795"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108516165","display_name":"Michael S. Hsiao","orcid":null},"institutions":[{"id":"https://openalex.org/I859038795","display_name":"Virginia Tech","ror":"https://ror.org/02smfhw86","country_code":"US","type":"education","lineage":["https://openalex.org/I859038795"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Michael Hsiao","raw_affiliation_strings":["Virginia Tech, Blacksburg, VA, USA"],"affiliations":[{"raw_affiliation_string":"Virginia Tech, Blacksburg, VA, USA","institution_ids":["https://openalex.org/I859038795"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100406931","display_name":"Chao Wang","orcid":"https://orcid.org/0000-0002-0567-6945"},"institutions":[{"id":"https://openalex.org/I859038795","display_name":"Virginia Tech","ror":"https://ror.org/02smfhw86","country_code":"US","type":"education","lineage":["https://openalex.org/I859038795"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Chao Wang","raw_affiliation_strings":["Virginia Tech, Blacksburg, VA, USA"],"affiliations":[{"raw_affiliation_string":"Virginia Tech, Blacksburg, VA, USA","institution_ids":["https://openalex.org/I859038795"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5077048234","display_name":"Simin Hall","orcid":null},"institutions":[{"id":"https://openalex.org/I859038795","display_name":"Virginia Tech","ror":"https://ror.org/02smfhw86","country_code":"US","type":"education","lineage":["https://openalex.org/I859038795"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Simin Hall","raw_affiliation_strings":["Virginia Tech, Blacksburg, VA, USA"],"affiliations":[{"raw_affiliation_string":"Virginia Tech, Blacksburg, VA, USA","institution_ids":["https://openalex.org/I859038795"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5028133513"],"corresponding_institution_ids":["https://openalex.org/I859038795"],"apc_list":null,"apc_paid":null,"fwci":1.8916,"has_fulltext":false,"cited_by_count":15,"citation_normalized_percentile":{"value":0.87647522,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12122","display_name":"Physical Unclonable Functions (PUFs) and Hardware Security","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/counterfeit","display_name":"Counterfeit","score":0.838263750076294},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5813573598861694},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5729061961174011},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4861759543418884},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.43183642625808716},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.3687397241592407},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3505438566207886},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.34396791458129883},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.30629193782806396},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.14220595359802246}],"concepts":[{"id":"https://openalex.org/C2779356469","wikidata":"https://www.wikidata.org/wiki/Q502918","display_name":"Counterfeit","level":2,"score":0.838263750076294},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5813573598861694},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5729061961174011},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4861759543418884},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.43183642625808716},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.3687397241592407},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3505438566207886},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.34396791458129883},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.30629193782806396},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.14220595359802246},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C17744445","wikidata":"https://www.wikidata.org/wiki/Q36442","display_name":"Political science","level":0,"score":0.0},{"id":"https://openalex.org/C199539241","wikidata":"https://www.wikidata.org/wiki/Q7748","display_name":"Law","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/2483028.2483049","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2483028.2483049","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 23rd ACM international conference on Great lakes symposium on VLSI","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":20,"referenced_works":["https://openalex.org/W649475307","https://openalex.org/W1991891926","https://openalex.org/W1992413325","https://openalex.org/W2003105949","https://openalex.org/W2040599684","https://openalex.org/W2041424982","https://openalex.org/W2059408092","https://openalex.org/W2069345435","https://openalex.org/W2097579272","https://openalex.org/W2106409910","https://openalex.org/W2110062156","https://openalex.org/W2112414127","https://openalex.org/W2122757690","https://openalex.org/W2123891574","https://openalex.org/W2124458446","https://openalex.org/W2134111163","https://openalex.org/W2134615643","https://openalex.org/W2151987239","https://openalex.org/W2156770737","https://openalex.org/W2293877751"],"related_works":["https://openalex.org/W3191226418","https://openalex.org/W2357749344","https://openalex.org/W4323356230","https://openalex.org/W2362200800","https://openalex.org/W1539823648","https://openalex.org/W4290078996","https://openalex.org/W3113783116","https://openalex.org/W4372352523","https://openalex.org/W1579156572","https://openalex.org/W4233184255"],"abstract_inverted_index":{"Previously":[0],"used":[1],"ICs,":[2],"which":[3],"are":[4,31],"resold":[5],"as":[6,67],"new,":[7],"result":[8],"in":[9],"undue":[10],"lost":[11],"revenue,":[12],"cause":[13],"lower":[14],"performance,":[15],"reduced":[16],"life":[17],"span,":[18],"and":[19,25,28,103],"even":[20],"catastrophic":[21],"failure":[22],"of":[23,37,52,64,96,112],"platforms":[24],"systems.":[26],"Non-invasive":[27],"inexpensive":[29],"techniques":[30],"needed":[32],"to":[33],"establish":[34],"the":[35,62,65,82,90,100],"authenticity":[36],"such":[38],"ICs":[39],"that":[40,81],"do":[41],"not":[42],"have":[43],"special":[44],"in-built":[45],"structures":[46],"for":[47],"counterfeit":[48],"detection.":[49],"Although":[50],"delay":[51],"circuit":[53],"increases":[54],"with":[55],"its":[56,97],"age,":[57],"it":[58,68],"cannot":[59],"directly":[60],"reveal":[61],"age":[63],"chip,":[66],"is":[69,92],"also":[70],"greatly":[71],"influenced":[72],"by":[73],"process":[74],"variation.":[75],"In":[76],"this":[77],"work,":[78],"we":[79,106],"show":[80],"relationship":[83],"between":[84],"two":[85],"or":[86],"more":[87],"paths":[88],"within":[89],"chip":[91],"a":[93,117],"great":[94],"indicator":[95],"age.":[98],"Using":[99],"proposed":[101],"statistical":[102],"circuit-level":[104],"technique,":[105],"observe":[107],"over":[108],"97%":[109],"correct":[110],"detection":[111],"an":[113],"aged":[114],"IC":[115],"from":[116],"new":[118],"IC.":[119]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":2},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":2},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":3},{"year":2014,"cited_by_count":3},{"year":2013,"cited_by_count":1}],"updated_date":"2026-02-25T23:00:34.991745","created_date":"2025-10-10T00:00:00"}