{"id":"https://openalex.org/W2075959051","doi":"https://doi.org/10.1145/2451916.2451936","title":"Optical lithography extension with double patterning","display_name":"Optical lithography extension with double patterning","publication_year":2013,"publication_date":"2013-03-24","ids":{"openalex":"https://openalex.org/W2075959051","doi":"https://doi.org/10.1145/2451916.2451936","mag":"2075959051"},"language":"en","primary_location":{"id":"doi:10.1145/2451916.2451936","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2451916.2451936","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2013 ACM International symposium on Physical Design","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5037815960","display_name":"Shigeki Nojima","orcid":null},"institutions":[{"id":"https://openalex.org/I1292669757","display_name":"Toshiba (Japan)","ror":"https://ror.org/0326v3z14","country_code":"JP","type":"company","lineage":["https://openalex.org/I1292669757"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Shigeki Nojima","raw_affiliation_strings":["Toshiba, Yokohama, Japan"],"affiliations":[{"raw_affiliation_string":"Toshiba, Yokohama, Japan","institution_ids":["https://openalex.org/I1292669757"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5037815960"],"corresponding_institution_ids":["https://openalex.org/I1292669757"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.12941401,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"68","last_page":"68"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9987000226974487,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9987000226974487,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11723","display_name":"Optical Coatings and Gratings","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.9930999875068665,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/multiple-patterning","display_name":"Multiple patterning","score":0.9492207765579224},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.8291553258895874},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.6567208170890808},{"id":"https://openalex.org/keywords/next-generation-lithography","display_name":"Next-generation lithography","score":0.6547876000404358},{"id":"https://openalex.org/keywords/extreme-ultraviolet-lithography","display_name":"Extreme ultraviolet lithography","score":0.6186222434043884},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5670581459999084},{"id":"https://openalex.org/keywords/computational-lithography","display_name":"Computational lithography","score":0.5475382804870605},{"id":"https://openalex.org/keywords/photolithography","display_name":"Photolithography","score":0.5438241958618164},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4859867990016937},{"id":"https://openalex.org/keywords/immersion-lithography","display_name":"Immersion lithography","score":0.4666469097137451},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.44507020711898804},{"id":"https://openalex.org/keywords/semiconductor-industry","display_name":"Semiconductor industry","score":0.43939799070358276},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.4208480715751648},{"id":"https://openalex.org/keywords/resist","display_name":"Resist","score":0.37354058027267456},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.32892000675201416},{"id":"https://openalex.org/keywords/electron-beam-lithography","display_name":"Electron-beam lithography","score":0.2798655927181244},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.2658880949020386},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.15570977330207825},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.15086254477500916},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.055192381143569946}],"concepts":[{"id":"https://openalex.org/C177409738","wikidata":"https://www.wikidata.org/wiki/Q1917460","display_name":"Multiple patterning","level":4,"score":0.9492207765579224},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.8291553258895874},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.6567208170890808},{"id":"https://openalex.org/C163581340","wikidata":"https://www.wikidata.org/wiki/Q1983848","display_name":"Next-generation lithography","level":5,"score":0.6547876000404358},{"id":"https://openalex.org/C162996421","wikidata":"https://www.wikidata.org/wiki/Q371965","display_name":"Extreme ultraviolet lithography","level":2,"score":0.6186222434043884},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5670581459999084},{"id":"https://openalex.org/C182873914","wikidata":"https://www.wikidata.org/wiki/Q5157329","display_name":"Computational lithography","level":5,"score":0.5475382804870605},{"id":"https://openalex.org/C105487726","wikidata":"https://www.wikidata.org/wiki/Q622938","display_name":"Photolithography","level":2,"score":0.5438241958618164},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4859867990016937},{"id":"https://openalex.org/C94263209","wikidata":"https://www.wikidata.org/wiki/Q1076175","display_name":"Immersion lithography","level":4,"score":0.4666469097137451},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.44507020711898804},{"id":"https://openalex.org/C2987888538","wikidata":"https://www.wikidata.org/wiki/Q2986369","display_name":"Semiconductor industry","level":2,"score":0.43939799070358276},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.4208480715751648},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.37354058027267456},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.32892000675201416},{"id":"https://openalex.org/C200274948","wikidata":"https://www.wikidata.org/wiki/Q256845","display_name":"Electron-beam lithography","level":4,"score":0.2798655927181244},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.2658880949020386},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.15570977330207825},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.15086254477500916},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.055192381143569946},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/2451916.2451936","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2451916.2451936","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2013 ACM International symposium on Physical Design","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6000000238418579,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W1991236041","https://openalex.org/W2115795789","https://openalex.org/W1967752359","https://openalex.org/W1975854055","https://openalex.org/W2606576291","https://openalex.org/W2025251804","https://openalex.org/W2032413298","https://openalex.org/W1988961408","https://openalex.org/W1973384065","https://openalex.org/W1977820409"],"abstract_inverted_index":{"Design":[0],"shrinking":[1],"beyond":[2],"the":[3,12,20],"resolution":[4],"limits":[5],"of":[6,14,42],"193":[7],"nm":[8],"optical":[9],"lithography":[10,25],"requires":[11],"introduction":[13],"double":[15,34],"patterning":[16,35],"technology":[17],"(DPT)":[18],"for":[19],"semiconductor":[21],"industry.":[22],"Two":[23],"consecutive":[24],"and":[26,31],"etching":[27],"process":[28,37],"(LELE;":[29],"Litho-Etch-Litho-Etch)":[30],"self":[32],"aligned":[33],"(SADP)":[36],"are":[38],"major":[39],"two":[40],"options":[41],"DPT.":[43]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}