{"id":"https://openalex.org/W1973902800","doi":"https://doi.org/10.1145/2429384.2429489","title":"Co-simulations of electromagnetic and thermal effects in electronic circuits using non-conformal numerical methods","display_name":"Co-simulations of electromagnetic and thermal effects in electronic circuits using non-conformal numerical methods","publication_year":2012,"publication_date":"2012-11-05","ids":{"openalex":"https://openalex.org/W1973902800","doi":"https://doi.org/10.1145/2429384.2429489","mag":"1973902800"},"language":"en","primary_location":{"id":"doi:10.1145/2429384.2429489","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2429384.2429489","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the International Conference on Computer-Aided Design","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5006353283","display_name":"Jin\u2010Fa Lee","orcid":"https://orcid.org/0000-0002-4328-8783"},"institutions":[{"id":"https://openalex.org/I52357470","display_name":"The Ohio State University","ror":"https://ror.org/00rs6vg23","country_code":"US","type":"education","lineage":["https://openalex.org/I52357470"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Jin-Fa Lee","raw_affiliation_strings":["The Ohio State University, Columbus, OH","The Ohio State University, ElectroScience Lab., ECE Dept., 1320 Kinnear Rd., Columbus, OH 43212"],"affiliations":[{"raw_affiliation_string":"The Ohio State University, Columbus, OH","institution_ids":["https://openalex.org/I52357470"]},{"raw_affiliation_string":"The Ohio State University, ElectroScience Lab., ECE Dept., 1320 Kinnear Rd., Columbus, OH 43212","institution_ids":["https://openalex.org/I52357470"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079984408","display_name":"Yang Shao","orcid":"https://orcid.org/0000-0002-4870-7406"},"institutions":[{"id":"https://openalex.org/I52357470","display_name":"The Ohio State University","ror":"https://ror.org/00rs6vg23","country_code":"US","type":"education","lineage":["https://openalex.org/I52357470"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yang Shao","raw_affiliation_strings":["The Ohio State University, Columbus, OH","The Ohio State University, ElectroScience Lab., ECE Dept., 1320 Kinnear Rd., Columbus, OH 43212"],"affiliations":[{"raw_affiliation_string":"The Ohio State University, Columbus, OH","institution_ids":["https://openalex.org/I52357470"]},{"raw_affiliation_string":"The Ohio State University, ElectroScience Lab., ECE Dept., 1320 Kinnear Rd., Columbus, OH 43212","institution_ids":["https://openalex.org/I52357470"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5081275530","display_name":"Zhen Peng","orcid":"https://orcid.org/0000-0001-9907-017X"},"institutions":[{"id":"https://openalex.org/I52357470","display_name":"The Ohio State University","ror":"https://ror.org/00rs6vg23","country_code":"US","type":"education","lineage":["https://openalex.org/I52357470"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Zhen Peng","raw_affiliation_strings":["The Ohio State University, Columbus, OH","The Ohio State University, ElectroScience Lab., ECE Dept., 1320 Kinnear Rd., Columbus, OH 43212"],"affiliations":[{"raw_affiliation_string":"The Ohio State University, Columbus, OH","institution_ids":["https://openalex.org/I52357470"]},{"raw_affiliation_string":"The Ohio State University, ElectroScience Lab., ECE Dept., 1320 Kinnear Rd., Columbus, OH 43212","institution_ids":["https://openalex.org/I52357470"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5006353283"],"corresponding_institution_ids":["https://openalex.org/I52357470"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.05077233,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"499","last_page":"499"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11263","display_name":"Electromagnetic Simulation and Numerical Methods","score":0.9987000226974487,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11263","display_name":"Electromagnetic Simulation and Numerical Methods","score":0.9987000226974487,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9927999973297119,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12898","display_name":"Induction Heating and Inverter Technology","score":0.9923999905586243,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6824181079864502},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.6138120293617249},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.585424542427063},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.5805659294128418},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4404706656932831},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.43848109245300293},{"id":"https://openalex.org/keywords/attenuation","display_name":"Attenuation","score":0.43251392245292664},{"id":"https://openalex.org/keywords/clock-rate","display_name":"Clock rate","score":0.41422832012176514},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3429225981235504},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.24696406722068787},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.1403331160545349},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.11239954829216003},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.11217251420021057}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6824181079864502},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.6138120293617249},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.585424542427063},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.5805659294128418},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4404706656932831},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.43848109245300293},{"id":"https://openalex.org/C184652730","wikidata":"https://www.wikidata.org/wiki/Q2357982","display_name":"Attenuation","level":2,"score":0.43251392245292664},{"id":"https://openalex.org/C178693496","wikidata":"https://www.wikidata.org/wiki/Q911691","display_name":"Clock rate","level":3,"score":0.41422832012176514},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3429225981235504},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.24696406722068787},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.1403331160545349},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.11239954829216003},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.11217251420021057}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/2429384.2429489","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2429384.2429489","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the International Conference on Computer-Aided Design","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.800000011920929}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2062605435","https://openalex.org/W2273182195","https://openalex.org/W2186374051","https://openalex.org/W3014521742","https://openalex.org/W2377963109","https://openalex.org/W2022279172","https://openalex.org/W2352247021","https://openalex.org/W2059332403","https://openalex.org/W2501578203","https://openalex.org/W2113108952"],"abstract_inverted_index":{"Advances":[0],"in":[1,34,63,86],"interconnect":[2,61],"technologies,":[3],"such":[4,70],"as":[5,50,52,71],"the":[6,9,20,42,53,83],"increase":[7,43],"of":[8,11,44,56,82,95],"number":[10],"metal":[12],"layers":[13],"and":[14,25,32,38,47,59,77],"3-D":[15,60],"stacking":[16],"technique,":[17],"have":[18,79],"paved":[19],"way":[21],"for":[22],"higher":[23],"functionality":[24],"superior":[26],"performance":[27,94],"while":[28],"reducing":[29],"size,":[30],"power,":[31],"cost":[33],"today's":[35],"integrated":[36],"circuits":[37],"package":[39],"products.":[40],"With":[41],"clock":[45],"frequency":[46],"edge":[48],"rates":[49],"well":[51],"continuously":[54],"downscaling":[55],"feature":[57],"size":[58],"technologies":[62,91],"high-speed":[64,96],"systems,":[65],"signal":[66,72],"integrity":[67],"(SI)":[68],"effects":[69],"delay,":[73],"reflection,":[74],"attenuation,":[75],"dispersion":[76],"crosstalk":[78],"become":[80],"one":[81],"dominant":[84],"factors":[85],"current":[87],"deep":[88],"sub-micrometer":[89],"CMOS":[90],"limiting":[92],"overall":[93],"systems.":[97]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}