{"id":"https://openalex.org/W1993181199","doi":"https://doi.org/10.1145/2429384.2429395","title":"A methodology for the early exploration of design rules for multiple-patterning technologies","display_name":"A methodology for the early exploration of design rules for multiple-patterning technologies","publication_year":2012,"publication_date":"2012-11-05","ids":{"openalex":"https://openalex.org/W1993181199","doi":"https://doi.org/10.1145/2429384.2429395","mag":"1993181199"},"language":"en","primary_location":{"id":"doi:10.1145/2429384.2429395","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2429384.2429395","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the International Conference on Computer-Aided Design","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5080344547","display_name":"Rani S. Ghaida","orcid":null},"institutions":[{"id":"https://openalex.org/I2799798094","display_name":"UCLA Health","ror":"https://ror.org/01d88se56","country_code":"US","type":"funder","lineage":["https://openalex.org/I2799798094"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Rani S. Ghaida","raw_affiliation_strings":["UCLA","[UCLA Electrical Engineering Dept.]"],"affiliations":[{"raw_affiliation_string":"UCLA","institution_ids":["https://openalex.org/I2799798094"]},{"raw_affiliation_string":"[UCLA Electrical Engineering Dept.]","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067247092","display_name":"Tanaya Sahu","orcid":null},"institutions":[{"id":"https://openalex.org/I2799798094","display_name":"UCLA Health","ror":"https://ror.org/01d88se56","country_code":"US","type":"funder","lineage":["https://openalex.org/I2799798094"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Tanaya Sahu","raw_affiliation_strings":["UCLA","[UCLA Electrical Engineering Dept.]"],"affiliations":[{"raw_affiliation_string":"UCLA","institution_ids":["https://openalex.org/I2799798094"]},{"raw_affiliation_string":"[UCLA Electrical Engineering Dept.]","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5007347603","display_name":"Parag Kulkarni","orcid":"https://orcid.org/0000-0001-9350-4889"},"institutions":[{"id":"https://openalex.org/I2799798094","display_name":"UCLA Health","ror":"https://ror.org/01d88se56","country_code":"US","type":"funder","lineage":["https://openalex.org/I2799798094"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Parag Kulkarni","raw_affiliation_strings":["UCLA","[UCLA Electrical Engineering Dept.]"],"affiliations":[{"raw_affiliation_string":"UCLA","institution_ids":["https://openalex.org/I2799798094"]},{"raw_affiliation_string":"[UCLA Electrical Engineering Dept.]","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5084229134","display_name":"Puneet Gupta","orcid":"https://orcid.org/0000-0002-6188-1134"},"institutions":[{"id":"https://openalex.org/I2799798094","display_name":"UCLA Health","ror":"https://ror.org/01d88se56","country_code":"US","type":"funder","lineage":["https://openalex.org/I2799798094"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Puneet Gupta","raw_affiliation_strings":["UCLA","[UCLA Electrical Engineering Dept.]"],"affiliations":[{"raw_affiliation_string":"UCLA","institution_ids":["https://openalex.org/I2799798094"]},{"raw_affiliation_string":"[UCLA Electrical Engineering Dept.]","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5080344547"],"corresponding_institution_ids":["https://openalex.org/I2799798094"],"apc_list":null,"apc_paid":null,"fwci":1.4979,"has_fulltext":false,"cited_by_count":15,"citation_normalized_percentile":{"value":0.83410532,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"50","last_page":"56"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/multiple-patterning","display_name":"Multiple patterning","score":0.8321356773376465},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6235086917877197},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.5673332214355469},{"id":"https://openalex.org/keywords/limiting","display_name":"Limiting","score":0.5314047932624817},{"id":"https://openalex.org/keywords/standard-cell","display_name":"Standard cell","score":0.4748566150665283},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.46717721223831177},{"id":"https://openalex.org/keywords/design-for-manufacturability","display_name":"Design for manufacturability","score":0.4363982677459717},{"id":"https://openalex.org/keywords/computer-engineering","display_name":"Computer engineering","score":0.34439003467559814},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.34001293778419495},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20371684432029724},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.19956517219543457},{"id":"https://openalex.org/keywords/resist","display_name":"Resist","score":0.194790780544281},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.174617737531662},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.1111401617527008},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.09546506404876709}],"concepts":[{"id":"https://openalex.org/C177409738","wikidata":"https://www.wikidata.org/wiki/Q1917460","display_name":"Multiple patterning","level":4,"score":0.8321356773376465},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6235086917877197},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.5673332214355469},{"id":"https://openalex.org/C188198153","wikidata":"https://www.wikidata.org/wiki/Q1613840","display_name":"Limiting","level":2,"score":0.5314047932624817},{"id":"https://openalex.org/C78401558","wikidata":"https://www.wikidata.org/wiki/Q464496","display_name":"Standard cell","level":3,"score":0.4748566150665283},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.46717721223831177},{"id":"https://openalex.org/C62064638","wikidata":"https://www.wikidata.org/wiki/Q553878","display_name":"Design for manufacturability","level":2,"score":0.4363982677459717},{"id":"https://openalex.org/C113775141","wikidata":"https://www.wikidata.org/wiki/Q428691","display_name":"Computer engineering","level":1,"score":0.34439003467559814},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.34001293778419495},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20371684432029724},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.19956517219543457},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.194790780544281},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.174617737531662},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.1111401617527008},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.09546506404876709},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1145/2429384.2429395","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2429384.2429395","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the International Conference on Computer-Aided Design","raw_type":"proceedings-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.690.5591","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.690.5591","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://nanocad.ee.ucla.edu/pub/Main/Publications/C64_paper.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.5400000214576721,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":25,"referenced_works":["https://openalex.org/W1600456215","https://openalex.org/W1972047514","https://openalex.org/W1974376306","https://openalex.org/W1977425906","https://openalex.org/W2013251580","https://openalex.org/W2028762187","https://openalex.org/W2038178364","https://openalex.org/W2056491067","https://openalex.org/W2056749372","https://openalex.org/W2067065170","https://openalex.org/W2082525005","https://openalex.org/W2087070363","https://openalex.org/W2103223568","https://openalex.org/W2105616993","https://openalex.org/W2108352706","https://openalex.org/W2110803890","https://openalex.org/W2125595978","https://openalex.org/W2125831674","https://openalex.org/W2128997425","https://openalex.org/W2142950782","https://openalex.org/W2148618168","https://openalex.org/W2171733540","https://openalex.org/W2256578114","https://openalex.org/W2295732415","https://openalex.org/W6664830322"],"related_works":["https://openalex.org/W1979360617","https://openalex.org/W2157255030","https://openalex.org/W1520032252","https://openalex.org/W2975406511","https://openalex.org/W2140942945","https://openalex.org/W2541440459","https://openalex.org/W2403265952","https://openalex.org/W2575916813","https://openalex.org/W2050847819","https://openalex.org/W2115795789"],"abstract_inverted_index":{"Double/Multiple-patterning":[0],"(DP/MP)":[1],"lithography":[2,102],"in":[3,103,145,209],"a":[4,10,49,70,87],"multiple":[5,123],"litho-etch":[6,124],"steps":[7],"process":[8],"is":[9,36,108],"favorable":[11],"solution":[12],"for":[13,28,38,51,63,100,116,171,174],"technology":[14],"scaling":[15],"to":[16,153,186,198],"the":[17,25,39,52,66,95,98,106,136,177,188,204,210],"20nm":[18],"node":[19],"and":[20,30,55,59,112,130,156,159,165],"below.":[21],"Mask-assignment":[22],"conflicts":[23],"represent":[24],"biggest":[26],"challenge":[27],"MP":[29,42,60],"limiting":[31],"them":[32],"through":[33],"design":[34,192],"rules":[35,61,158,172],"crucial":[37],"adoption":[40],"of":[41,57,97,134,206],"technology.":[43],"In":[44,90],"this":[45,91],"paper,":[46],"we":[47,74,93],"offer":[48],"methodology":[50,107,137,149,169],"early":[53],"evaluation":[54],"exploration":[56],"layout":[58,76,157,166],"intended":[62],"speeding":[64],"up":[65],"rules-development":[67],"cycle.":[68],"Using":[69],"novel":[71],"wiring-estimation":[72],"method,":[73],"create":[75],"estimates":[77],"with":[78,122],"fine-grained":[79],"congestion":[80],"prediction.":[81,147],"MP-conflicts":[82],"are":[83],"then":[84,151],"predicted":[85],"using":[86],"machine-learning":[88],"approach.":[89],"work,":[92],"demonstrate":[94],"use":[96],"method":[99],"double-patterning":[101],"litho-etch-litho-etch":[104],"process;":[105],"more":[109,201],"general,":[110],"however,":[111],"can":[113],"be":[114],"applied":[115],"other":[117],"multiple-patterning":[118],"technologies":[119],"including":[120],"tripe/multiple-patterning":[121],"steps,":[125],"self-aligned":[126],"double":[127,203],"patterning":[128],"(SADP),":[129],"directed":[131],"self-assembly.":[132],"Results":[133],"testing":[135],"on":[138,163],"standard-cell":[139],"layouts":[140],"show":[141],"an":[142],"81%":[143],"accuracy":[144],"DP-conflicts":[146],"The":[148,168],"was":[150],"used":[152],"explore":[154],"DP":[155],"investigate":[160],"their":[161],"effects":[162],"DP-compatibility":[164],"area.":[167],"allows":[170],"optimization;":[173],"example,":[175],"pushing":[176],"minimum":[178,189],"tip-to-side":[179],"same-color":[180],"spacing":[181,191],"rule":[182,193],"value":[183],"from":[184,195],"1.7x":[185],"1.5x":[187],"side-to-side":[190],"(i.e.,":[194],"110nm":[196],"down":[197],"90nm)":[199],"would":[200],"than":[202],"number":[205],"DP-compatible":[207],"cells":[208],"library.":[211]},"counts_by_year":[{"year":2021,"cited_by_count":2},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":3},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":3},{"year":2014,"cited_by_count":3}],"updated_date":"2026-04-05T17:49:38.594831","created_date":"2025-10-10T00:00:00"}