{"id":"https://openalex.org/W2069656207","doi":"https://doi.org/10.1145/2347655.2347659","title":"Impact of lithography retargeting process on low level interconnect in 20nm technology","display_name":"Impact of lithography retargeting process on low level interconnect in 20nm technology","publication_year":2012,"publication_date":"2012-06-03","ids":{"openalex":"https://openalex.org/W2069656207","doi":"https://doi.org/10.1145/2347655.2347659","mag":"2069656207"},"language":"en","primary_location":{"id":"doi:10.1145/2347655.2347659","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2347655.2347659","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the International Workshop on System Level Interconnect Prediction","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100461106","display_name":"Hongbo Zhang","orcid":"https://orcid.org/0009-0001-3886-3763"},"institutions":[{"id":"https://openalex.org/I157725225","display_name":"University of Illinois Urbana-Champaign","ror":"https://ror.org/047426m28","country_code":"US","type":"education","lineage":["https://openalex.org/I157725225"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Hongbo Zhang","raw_affiliation_strings":["University of Illinois at Urbana-Champaign","University of Illinois at Urbana Champaign"],"affiliations":[{"raw_affiliation_string":"University of Illinois at Urbana-Champaign","institution_ids":["https://openalex.org/I157725225"]},{"raw_affiliation_string":"University of Illinois at Urbana Champaign","institution_ids":["https://openalex.org/I157725225"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110001992","display_name":"Yunfei Deng","orcid":null},"institutions":[{"id":"https://openalex.org/I35662394","display_name":"GlobalFoundries (United States)","ror":"https://ror.org/02h0ps145","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yunfei Deng","raw_affiliation_strings":["GlobalFoundries, Sunnyvale, CA","GlobalFoundries, Sunnyvale, CA#TAB#"],"affiliations":[{"raw_affiliation_string":"GlobalFoundries, Sunnyvale, CA","institution_ids":["https://openalex.org/I35662394"]},{"raw_affiliation_string":"GlobalFoundries, Sunnyvale, CA#TAB#","institution_ids":["https://openalex.org/I35662394"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111832882","display_name":"Jongwook Kye","orcid":null},"institutions":[{"id":"https://openalex.org/I35662394","display_name":"GlobalFoundries (United States)","ror":"https://ror.org/02h0ps145","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jongwook Kye","raw_affiliation_strings":["GlobalFoundries, Sunnyvale, CA","GlobalFoundries, Sunnyvale, CA#TAB#"],"affiliations":[{"raw_affiliation_string":"GlobalFoundries, Sunnyvale, CA","institution_ids":["https://openalex.org/I35662394"]},{"raw_affiliation_string":"GlobalFoundries, Sunnyvale, CA#TAB#","institution_ids":["https://openalex.org/I35662394"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5053378706","display_name":"Martin D. F. Wong","orcid":"https://orcid.org/0000-0001-8274-9688"},"institutions":[{"id":"https://openalex.org/I157725225","display_name":"University of Illinois Urbana-Champaign","ror":"https://ror.org/047426m28","country_code":"US","type":"education","lineage":["https://openalex.org/I157725225"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Martin D. F. Wong","raw_affiliation_strings":["University of Illinois at Urbana-Champaign","University of Illinois at Urbana Champaign"],"affiliations":[{"raw_affiliation_string":"University of Illinois at Urbana-Champaign","institution_ids":["https://openalex.org/I157725225"]},{"raw_affiliation_string":"University of Illinois at Urbana Champaign","institution_ids":["https://openalex.org/I157725225"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5100461106"],"corresponding_institution_ids":["https://openalex.org/I157725225"],"apc_list":null,"apc_paid":null,"fwci":0.491,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.69258883,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":"6154","issue":null,"first_page":"3","last_page":"10"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9961000084877014,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/retargeting","display_name":"Retargeting","score":0.9791595935821533},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.7232004404067993},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.6830083131790161},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.6378220319747925},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.5780171751976013},{"id":"https://openalex.org/keywords/node","display_name":"Node (physics)","score":0.5056726932525635},{"id":"https://openalex.org/keywords/punching","display_name":"Punching","score":0.46365413069725037},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.24910566210746765},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.1641068458557129},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.11411574482917786},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.09727606177330017},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.07564380764961243}],"concepts":[{"id":"https://openalex.org/C2780575108","wikidata":"https://www.wikidata.org/wiki/Q7316652","display_name":"Retargeting","level":2,"score":0.9791595935821533},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.7232004404067993},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.6830083131790161},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.6378220319747925},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.5780171751976013},{"id":"https://openalex.org/C62611344","wikidata":"https://www.wikidata.org/wiki/Q1062658","display_name":"Node (physics)","level":2,"score":0.5056726932525635},{"id":"https://openalex.org/C2778527123","wikidata":"https://www.wikidata.org/wiki/Q11750728","display_name":"Punching","level":2,"score":0.46365413069725037},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.24910566210746765},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.1641068458557129},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.11411574482917786},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.09727606177330017},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.07564380764961243},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/2347655.2347659","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2347655.2347659","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the International Workshop on System Level Interconnect Prediction","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1983069902","https://openalex.org/W2009296772","https://openalex.org/W2016669084","https://openalex.org/W2020323308","https://openalex.org/W2040165472","https://openalex.org/W2050063146","https://openalex.org/W2071589594","https://openalex.org/W2100344939","https://openalex.org/W3144063603","https://openalex.org/W6646353702","https://openalex.org/W6668356502"],"related_works":["https://openalex.org/W2461433938","https://openalex.org/W4389483750","https://openalex.org/W2770958975","https://openalex.org/W4388007604","https://openalex.org/W1033720759","https://openalex.org/W2043281736","https://openalex.org/W2798302728","https://openalex.org/W4316663596","https://openalex.org/W2314886821","https://openalex.org/W2924774772"],"abstract_inverted_index":{"As":[0],"the":[1,6,14,40,44,49,60,67,78,112,119,123,126,135,142,161,171,175],"lithography":[2],"continues":[3],"to":[4,21,38,76,117,132,159],"be":[5],"biggest":[7],"challenge":[8],"in":[9,66],"20":[10],"nm":[11],"technology":[12],"node,":[13],"process":[15,25,73,86],"windows":[16,87],"become":[17],"a":[18,72,95,103,148,156],"serious":[19],"concern":[20],"handle":[22],"more":[23,90],"severe":[24],"variations":[26],"for":[27,84,147,170,185],"better":[28,85],"printability":[29],"and":[30,55,63,92,177,180],"yield.":[31],"The":[32],"mask":[33],"pattern":[34],"modification":[35],"that":[36,129],"is":[37,183],"set":[39],"printing":[41],"target":[42],"as":[43,53],"original":[45,79],"designed":[46],"patterns":[47],"under":[48],"best":[50],"focus,":[51],"such":[52],"OPC":[54],"SRAF,":[56],"becomes":[57,88,102],"insufficient.":[58],"With":[59],"random":[61],"space":[62,83],"width":[64,81],"existing":[65],"low":[68,113],"level":[69,114],"interconnect":[70,101],"layer,":[71],"called":[74],"\"retargeting\"":[75],"change":[77],"line":[80],"or":[82],"much":[89],"important":[91],"noticeable.":[93],"Therefore,":[94],"study":[96],"of":[97],"retargeting":[98,120,150,162],"impact":[99,121,146,173],"on":[100,111,122,174],"must.":[104],"In":[105],"this":[106],"paper,":[107],"we":[108,130,140],"are":[109],"focusing":[110],"metal":[115],"layer":[116],"demonstrate":[118],"delay.":[124],"By":[125],"test":[127],"benches":[128],"build":[131],"enumerate":[133],"all":[134],"possible":[136],"changes":[137],"during":[138],"retargeting,":[139],"analyze":[141],"worst":[143],"case":[144],"scenario":[145],"worry-free":[149],"process.":[151],"We":[152],"also":[153],"successfully":[154],"generate":[155],"compact":[157,187],"model":[158,169],"predict":[160],"impact.":[163],"Experimental":[164],"results":[165],"verify":[166],"our":[167,186],"estimation":[168],"retargeting's":[172],"preferred":[176],"non-preferred":[178],"direction,":[179],"little":[181],"error":[182],"found":[184],"model.":[188]},"counts_by_year":[{"year":2021,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2014,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}