{"id":"https://openalex.org/W2017050778","doi":"https://doi.org/10.1145/2333660.2333666","title":"Design benchmarking to 7nm with FinFET predictive technology models","display_name":"Design benchmarking to 7nm with FinFET predictive technology models","publication_year":2012,"publication_date":"2012-07-30","ids":{"openalex":"https://openalex.org/W2017050778","doi":"https://doi.org/10.1145/2333660.2333666","mag":"2017050778"},"language":"en","primary_location":{"id":"doi:10.1145/2333660.2333666","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2333660.2333666","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2012 ACM/IEEE international symposium on Low power electronics and design","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5016963468","display_name":"Saurabh Sinha","orcid":"https://orcid.org/0000-0001-7453-9576"},"institutions":[{"id":"https://openalex.org/I4210156213","display_name":"American Rock Mechanics Association","ror":"https://ror.org/05vfrxy92","country_code":"US","type":"nonprofit","lineage":["https://openalex.org/I4210156213"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Saurabh Sinha","raw_affiliation_strings":["ARM Inc., Austin, TX, USA"],"affiliations":[{"raw_affiliation_string":"ARM Inc., Austin, TX, USA","institution_ids":["https://openalex.org/I4210156213"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109501603","display_name":"Brian Cline","orcid":null},"institutions":[{"id":"https://openalex.org/I4210156213","display_name":"American Rock Mechanics Association","ror":"https://ror.org/05vfrxy92","country_code":"US","type":"nonprofit","lineage":["https://openalex.org/I4210156213"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Brian Cline","raw_affiliation_strings":["ARM Inc., Austin, TX, USA"],"affiliations":[{"raw_affiliation_string":"ARM Inc., Austin, TX, USA","institution_ids":["https://openalex.org/I4210156213"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036881947","display_name":"Greg Yeric","orcid":null},"institutions":[{"id":"https://openalex.org/I4210156213","display_name":"American Rock Mechanics Association","ror":"https://ror.org/05vfrxy92","country_code":"US","type":"nonprofit","lineage":["https://openalex.org/I4210156213"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Greg Yeric","raw_affiliation_strings":["ARM Inc., Austin, TX, USA"],"affiliations":[{"raw_affiliation_string":"ARM Inc., Austin, TX, USA","institution_ids":["https://openalex.org/I4210156213"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5016704219","display_name":"Vikas Chandra","orcid":"https://orcid.org/0009-0005-4996-8455"},"institutions":[{"id":"https://openalex.org/I4210156213","display_name":"American Rock Mechanics Association","ror":"https://ror.org/05vfrxy92","country_code":"US","type":"nonprofit","lineage":["https://openalex.org/I4210156213"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Vikas Chandra","raw_affiliation_strings":["ARM Inc., San Jose, CA, USA"],"affiliations":[{"raw_affiliation_string":"ARM Inc., San Jose, CA, USA","institution_ids":["https://openalex.org/I4210156213"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100740019","display_name":"Yu Cao","orcid":"https://orcid.org/0000-0001-6968-1180"},"institutions":[{"id":"https://openalex.org/I55732556","display_name":"Arizona State University","ror":"https://ror.org/03efmqc40","country_code":"US","type":"education","lineage":["https://openalex.org/I55732556"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yu Cao","raw_affiliation_strings":["Arizona State University, Tempe, AZ, USA","Arizona State University , Tempe , AZ , USA"],"affiliations":[{"raw_affiliation_string":"Arizona State University, Tempe, AZ, USA","institution_ids":["https://openalex.org/I55732556"]},{"raw_affiliation_string":"Arizona State University , Tempe , AZ , USA","institution_ids":["https://openalex.org/I55732556"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5016963468"],"corresponding_institution_ids":["https://openalex.org/I4210156213"],"apc_list":null,"apc_paid":null,"fwci":1.964,"has_fulltext":false,"cited_by_count":39,"citation_normalized_percentile":{"value":0.86987131,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"15","last_page":"20"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.7419822812080383},{"id":"https://openalex.org/keywords/benchmark","display_name":"Benchmark (surveying)","score":0.6795324683189392},{"id":"https://openalex.org/keywords/benchmarking","display_name":"Benchmarking","score":0.6351439952850342},{"id":"https://openalex.org/keywords/netlist","display_name":"Netlist","score":0.6116311550140381},{"id":"https://openalex.org/keywords/parasitic-extraction","display_name":"Parasitic extraction","score":0.5956051349639893},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.5890278816223145},{"id":"https://openalex.org/keywords/node","display_name":"Node (physics)","score":0.5801123380661011},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.561245322227478},{"id":"https://openalex.org/keywords/integrated-circuit-design","display_name":"Integrated circuit design","score":0.4504127502441406},{"id":"https://openalex.org/keywords/semiconductor-device-modeling","display_name":"Semiconductor device modeling","score":0.4493171274662018},{"id":"https://openalex.org/keywords/extrapolation","display_name":"Extrapolation","score":0.4314674437046051},{"id":"https://openalex.org/keywords/scaling","display_name":"Scaling","score":0.4185430407524109},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.357266366481781},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.3245111107826233},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.24367335438728333},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20203006267547607},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.09310364723205566}],"concepts":[{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.7419822812080383},{"id":"https://openalex.org/C185798385","wikidata":"https://www.wikidata.org/wiki/Q1161707","display_name":"Benchmark (surveying)","level":2,"score":0.6795324683189392},{"id":"https://openalex.org/C86251818","wikidata":"https://www.wikidata.org/wiki/Q816754","display_name":"Benchmarking","level":2,"score":0.6351439952850342},{"id":"https://openalex.org/C177650935","wikidata":"https://www.wikidata.org/wiki/Q1760303","display_name":"Netlist","level":2,"score":0.6116311550140381},{"id":"https://openalex.org/C159818811","wikidata":"https://www.wikidata.org/wiki/Q7135947","display_name":"Parasitic extraction","level":2,"score":0.5956051349639893},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.5890278816223145},{"id":"https://openalex.org/C62611344","wikidata":"https://www.wikidata.org/wiki/Q1062658","display_name":"Node (physics)","level":2,"score":0.5801123380661011},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.561245322227478},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.4504127502441406},{"id":"https://openalex.org/C4775677","wikidata":"https://www.wikidata.org/wiki/Q7449393","display_name":"Semiconductor device modeling","level":3,"score":0.4493171274662018},{"id":"https://openalex.org/C132459708","wikidata":"https://www.wikidata.org/wiki/Q744069","display_name":"Extrapolation","level":2,"score":0.4314674437046051},{"id":"https://openalex.org/C99844830","wikidata":"https://www.wikidata.org/wiki/Q102441924","display_name":"Scaling","level":2,"score":0.4185430407524109},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.357266366481781},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.3245111107826233},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.24367335438728333},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20203006267547607},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.09310364723205566},{"id":"https://openalex.org/C144133560","wikidata":"https://www.wikidata.org/wiki/Q4830453","display_name":"Business","level":0,"score":0.0},{"id":"https://openalex.org/C162853370","wikidata":"https://www.wikidata.org/wiki/Q39809","display_name":"Marketing","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C205649164","wikidata":"https://www.wikidata.org/wiki/Q1071","display_name":"Geography","level":0,"score":0.0},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.0},{"id":"https://openalex.org/C13280743","wikidata":"https://www.wikidata.org/wiki/Q131089","display_name":"Geodesy","level":1,"score":0.0},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/2333660.2333666","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2333660.2333666","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2012 ACM/IEEE international symposium on Low power electronics and design","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6399999856948853,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":20,"referenced_works":["https://openalex.org/W1573760091","https://openalex.org/W2006312753","https://openalex.org/W2042783150","https://openalex.org/W2067674587","https://openalex.org/W2083494045","https://openalex.org/W2090418340","https://openalex.org/W2113013533","https://openalex.org/W2120697845","https://openalex.org/W2126496577","https://openalex.org/W2135407913","https://openalex.org/W2139250167","https://openalex.org/W2146824752","https://openalex.org/W2152819129","https://openalex.org/W2153409216","https://openalex.org/W2156642062","https://openalex.org/W2166765376","https://openalex.org/W2188838890","https://openalex.org/W6661174221","https://openalex.org/W6671414415","https://openalex.org/W6673235863"],"related_works":["https://openalex.org/W4280631195","https://openalex.org/W2076615226","https://openalex.org/W2170939617","https://openalex.org/W2885948601","https://openalex.org/W2165072054","https://openalex.org/W4255141013","https://openalex.org/W1486902652","https://openalex.org/W2113789186","https://openalex.org/W3148400831","https://openalex.org/W4312992159"],"abstract_inverted_index":{"The":[0],"coming":[1],"ten":[2],"years":[3],"promise":[4],"great":[5],"changes":[6],"in":[7,29,45],"silicon":[8],"technology,":[9,32],"with":[10,66],"the":[11,18,30,33,62,77,91,100,112],"end":[12],"of":[13,20,36,88,93,102],"planar":[14],"bulk":[15,96],"CMOS":[16,97],"and":[17,73,106],"rise":[19],"interconnect":[21,68],"parasitics":[22],"to":[23,41,61,82],"true":[24],"significance.":[25],"With":[26],"such":[27],"shifts":[28],"underlying":[31],"simple":[34],"extrapolation":[35],"performance":[37,72],"metrics":[38],"may":[39],"lead":[40],"pronounced":[42],"prediction":[43],"errors":[44],"design":[46,104,109],"pathfinding.":[47],"In":[48],"this":[49],"work,":[50],"we":[51,70],"utilize":[52],"newly":[53],"developed":[54],"Predictive":[55],"Technology":[56],"Models":[57],"for":[58,76],"FinFETs":[59],"aligned":[60],"2011":[63],"ITRS.":[64],"Together":[65],"predictive":[67],"models,":[69,89],"project":[71],"power":[74],"landscape":[75],"technology":[78],"nodes":[79],"from":[80],"20nm":[81],"7nm.":[83],"We":[84],"present":[85],"an":[86],"overview":[87],"assess":[90],"advantage":[92],"FinFET":[94],"over":[95],"devices,":[98],"benchmark":[99],"scaling":[101],"critical":[103],"metrics,":[105],"illustrate":[107],"major":[108],"barriers":[110],"toward":[111],"7nm":[113],"node.":[114]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":4},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":4},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":7},{"year":2018,"cited_by_count":4},{"year":2017,"cited_by_count":5},{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":6},{"year":2014,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}