{"id":"https://openalex.org/W1963768348","doi":"https://doi.org/10.1145/2287696.2287704","title":"Spatial and temporal thermal characterization of stacked multicore architectures","display_name":"Spatial and temporal thermal characterization of stacked multicore architectures","publication_year":2012,"publication_date":"2012-08-01","ids":{"openalex":"https://openalex.org/W1963768348","doi":"https://doi.org/10.1145/2287696.2287704","mag":"1963768348"},"language":"en","primary_location":{"id":"doi:10.1145/2287696.2287704","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2287696.2287704","pdf_url":null,"source":{"id":"https://openalex.org/S96198239","display_name":"ACM Journal on Emerging Technologies in Computing Systems","issn_l":"1550-4832","issn":["1550-4832","1550-4840"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319798","host_organization_name":"Association for Computing Machinery","host_organization_lineage":["https://openalex.org/P4310319798"],"host_organization_lineage_names":["Association for Computing Machinery"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ACM Journal on Emerging Technologies in Computing Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5034278781","display_name":"Eren Kursun","orcid":null},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Eren Kursun","raw_affiliation_strings":["IBM T.J. Watson Research Labs, Yorktown Heights, NY","IBM T. J. Watson Research Lab., Yorktown Heights, NY"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM T.J. Watson Research Labs, Yorktown Heights, NY","institution_ids":[]},{"raw_affiliation_string":"IBM T. J. Watson Research Lab., Yorktown Heights, NY","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088712234","display_name":"J. Wakil","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jamil Wakil","raw_affiliation_strings":["IBM System and Technology Group, Fishkill, NY","IBM System and Technology Group, Fishkill, NY#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM System and Technology Group, Fishkill, NY","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"IBM System and Technology Group, Fishkill, NY#TAB#","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5000312313","display_name":"Mukta Farooq","orcid":"https://orcid.org/0009-0009-5641-1398"},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Mukta Farooq","raw_affiliation_strings":["IBM System and Technology Group, Fishkill, NY","IBM System and Technology Group, Fishkill, NY#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM System and Technology Group, Fishkill, NY","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"IBM System and Technology Group, Fishkill, NY#TAB#","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5110453274","display_name":"R. Hannon","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Robert Hannon","raw_affiliation_strings":["IBM System and Technology Group, Fishkill, NY","IBM System and Technology Group, Fishkill, NY#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM System and Technology Group, Fishkill, NY","institution_ids":["https://openalex.org/I1341412227"]},{"raw_affiliation_string":"IBM System and Technology Group, Fishkill, NY#TAB#","institution_ids":["https://openalex.org/I1341412227"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5034278781"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.2498,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.5677914,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":97},"biblio":{"volume":"8","issue":"3","first_page":"1","last_page":"17"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9968000054359436,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9937000274658203,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/stacking","display_name":"Stacking","score":0.674381673336029},{"id":"https://openalex.org/keywords/multi-core-processor","display_name":"Multi-core processor","score":0.6597612500190735},{"id":"https://openalex.org/keywords/stack","display_name":"Stack (abstract data type)","score":0.6411219835281372},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.5696952939033508},{"id":"https://openalex.org/keywords/microprocessor","display_name":"Microprocessor","score":0.5468882322311401},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5448550581932068},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.48397302627563477},{"id":"https://openalex.org/keywords/dissipation","display_name":"Dissipation","score":0.458786278963089},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4448690414428711},{"id":"https://openalex.org/keywords/thermal-management-of-electronic-devices-and-systems","display_name":"Thermal management of electronic devices and systems","score":0.43974193930625916},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.35555940866470337},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.28238922357559204},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.27611738443374634},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.17197048664093018},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.1401505172252655}],"concepts":[{"id":"https://openalex.org/C33347731","wikidata":"https://www.wikidata.org/wiki/Q285210","display_name":"Stacking","level":2,"score":0.674381673336029},{"id":"https://openalex.org/C78766204","wikidata":"https://www.wikidata.org/wiki/Q555032","display_name":"Multi-core processor","level":2,"score":0.6597612500190735},{"id":"https://openalex.org/C9395851","wikidata":"https://www.wikidata.org/wiki/Q177929","display_name":"Stack (abstract data type)","level":2,"score":0.6411219835281372},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.5696952939033508},{"id":"https://openalex.org/C2780728072","wikidata":"https://www.wikidata.org/wiki/Q5297","display_name":"Microprocessor","level":2,"score":0.5468882322311401},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5448550581932068},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.48397302627563477},{"id":"https://openalex.org/C135402231","wikidata":"https://www.wikidata.org/wiki/Q898440","display_name":"Dissipation","level":2,"score":0.458786278963089},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4448690414428711},{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.43974193930625916},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.35555940866470337},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.28238922357559204},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.27611738443374634},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.17197048664093018},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.1401505172252655},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/2287696.2287704","is_oa":false,"landing_page_url":"https://doi.org/10.1145/2287696.2287704","pdf_url":null,"source":{"id":"https://openalex.org/S96198239","display_name":"ACM Journal on Emerging Technologies in Computing Systems","issn_l":"1550-4832","issn":["1550-4832","1550-4840"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319798","host_organization_name":"Association for Computing Machinery","host_organization_lineage":["https://openalex.org/P4310319798"],"host_organization_lineage_names":["Association for Computing Machinery"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ACM Journal on Emerging Technologies in Computing Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.8999999761581421,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":42,"referenced_works":["https://openalex.org/W87600089","https://openalex.org/W1541633348","https://openalex.org/W1964634575","https://openalex.org/W1971322722","https://openalex.org/W1983692682","https://openalex.org/W1987131925","https://openalex.org/W1987293146","https://openalex.org/W1989916619","https://openalex.org/W1993700253","https://openalex.org/W2018129150","https://openalex.org/W2028641195","https://openalex.org/W2071003187","https://openalex.org/W2086716781","https://openalex.org/W2094477153","https://openalex.org/W2097116393","https://openalex.org/W2098297070","https://openalex.org/W2102694790","https://openalex.org/W2104543858","https://openalex.org/W2107304970","https://openalex.org/W2113911387","https://openalex.org/W2114139104","https://openalex.org/W2115946118","https://openalex.org/W2124824852","https://openalex.org/W2125213532","https://openalex.org/W2130517400","https://openalex.org/W2133044942","https://openalex.org/W2139479815","https://openalex.org/W2140746294","https://openalex.org/W2141736089","https://openalex.org/W2143807959","https://openalex.org/W2144149750","https://openalex.org/W2145135695","https://openalex.org/W2145547293","https://openalex.org/W2147541574","https://openalex.org/W2151600006","https://openalex.org/W2152472834","https://openalex.org/W2154857344","https://openalex.org/W2157558963","https://openalex.org/W2158921969","https://openalex.org/W2164332729","https://openalex.org/W4242472899","https://openalex.org/W4300425614"],"related_works":["https://openalex.org/W1970479385","https://openalex.org/W2786493094","https://openalex.org/W2063603127","https://openalex.org/W3001671786","https://openalex.org/W2765638973","https://openalex.org/W4239706042","https://openalex.org/W2396347320","https://openalex.org/W2778007986","https://openalex.org/W2144881807","https://openalex.org/W2069071066"],"abstract_inverted_index":{"Three-dimensional":[0],"integration":[1],"provides":[2],"a":[3,13],"new":[4],"way":[5],"of":[6,22,42,59,72,80,95,122],"performance":[7,18,51],"growth":[8],"for":[9,138,168],"microprocessor":[10],"architectures.":[11],"While":[12],"recent":[14],"studies":[15],"report":[16],"promising":[17],"improvement":[19,52],"numbers,":[20],"majority":[21],"the":[23,36,43,48,54,70,76,81,96,104,136,144,149,155],"processor":[24,107,130,173],"stacking":[25,174],"options":[26],"are":[27],"thermally-limited.":[28],"Elevated":[29],"stack":[30,109],"temperatures":[31,162],"have":[32],"significant":[33],"effect":[34],"on":[35,103,116],"overall":[37],"energy":[38],"efficiency":[39],"and":[40,88,108,118,129,159],"reliability":[41],"processor;":[44],"they":[45],"also":[46],"limit":[47],"potential":[49],"peak":[50],"from":[53,63],"3D":[55,60,82,105,123],"implementation.":[56],"Thermal":[57],"characteristics":[58,121],"stacks":[61],"differ":[62],"2D":[64],"processors":[65],"in":[66,143,172],"various":[67],"ways":[68],"including:":[69],"nature":[71],"heat":[73],"dissipation":[74],"throughout":[75],"stack,":[77],"thermal":[78,98,120,141,170],"conductivity":[79],"structures":[83],"such":[84],"as":[85],"micro-C4":[86],"layers,":[87],"hotspot":[89],"interactions":[90],"among":[91],"layers.":[92],"The":[93],"intensity":[94],"corresponding":[97],"problems":[99],"is":[100],"highly":[101],"dependent":[102],"technology,":[106],"parameters.":[110],"In":[111,153],"this":[112],"study":[113],"we":[114],"focus":[115],"spatial":[117],"temporal":[119],"multicore":[124],"architectures":[125],"using":[126],"high-fidelity":[127],"technology":[128],"models.":[131],"Our":[132],"experimental":[133],"results":[134],"highlight":[135],"need":[137],"integrating":[139],"detailed":[140],"models":[142],"design":[145,151],"flow,":[146],"starting":[147],"with":[148],"early":[150],"stages.":[152],"addition,":[154],"reduced":[156],"time":[157,166],"constants":[158],"elevated":[160],"on-chip":[161],"indicate":[163],"faster":[164],"response":[165],"requirements":[167],"dynamic":[169],"management":[171],"options.":[175]},"counts_by_year":[{"year":2025,"cited_by_count":3},{"year":2024,"cited_by_count":2},{"year":2013,"cited_by_count":1}],"updated_date":"2026-05-21T09:19:25.381259","created_date":"2025-10-10T00:00:00"}