{"id":"https://openalex.org/W2118043660","doi":"https://doi.org/10.1145/1960397.1960417","title":"Assembling 2D blocks into 3D chips","display_name":"Assembling 2D blocks into 3D chips","publication_year":2011,"publication_date":"2011-03-22","ids":{"openalex":"https://openalex.org/W2118043660","doi":"https://doi.org/10.1145/1960397.1960417","mag":"2118043660"},"language":"en","primary_location":{"id":"doi:10.1145/1960397.1960417","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1960397.1960417","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2011 international symposium on Physical design","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5052751303","display_name":"Johann Knechtel","orcid":"https://orcid.org/0000-0001-5093-2939"},"institutions":[{"id":"https://openalex.org/I27837315","display_name":"University of Michigan","ror":"https://ror.org/00jmfr291","country_code":"US","type":"education","lineage":["https://openalex.org/I27837315"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Johann Knechtel","raw_affiliation_strings":["University of Michigan, Ann Arbor USA & Dresden University of Technology, Dresden, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Michigan, Ann Arbor USA & Dresden University of Technology, Dresden, Germany","institution_ids":["https://openalex.org/I27837315"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5065370018","display_name":"Igor L. Markov","orcid":"https://orcid.org/0000-0002-3826-527X"},"institutions":[{"id":"https://openalex.org/I27837315","display_name":"University of Michigan","ror":"https://ror.org/00jmfr291","country_code":"US","type":"education","lineage":["https://openalex.org/I27837315"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Igor L. Markov","raw_affiliation_strings":["University of Michigan, Ann Arbor, MI, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Michigan, Ann Arbor, MI, USA","institution_ids":["https://openalex.org/I27837315"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5070654831","display_name":"Jens Lienig","orcid":"https://orcid.org/0000-0002-2140-4587"},"institutions":[{"id":"https://openalex.org/I78650965","display_name":"Technische Universit\u00e4t Dresden","ror":"https://ror.org/042aqky30","country_code":"DE","type":"education","lineage":["https://openalex.org/I78650965"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Jens Lienig","raw_affiliation_strings":["Dresden University of Technology, Dresden, Germany","Dresden University of Technology , Dresden , Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dresden University of Technology, Dresden, Germany","institution_ids":["https://openalex.org/I78650965"]},{"raw_affiliation_string":"Dresden University of Technology , Dresden , Germany","institution_ids":["https://openalex.org/I78650965"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.8109,"has_fulltext":false,"cited_by_count":10,"citation_normalized_percentile":{"value":0.77097626,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"81","last_page":"88"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9943000078201294,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10502","display_name":"Advanced Memory and Neural Computing","score":0.9914000034332275,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5449579358100891}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5449579358100891}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/1960397.1960417","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1960397.1960417","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2011 international symposium on Physical design","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.4699999988079071,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":42,"referenced_works":["https://openalex.org/W144954708","https://openalex.org/W1541633348","https://openalex.org/W1944814515","https://openalex.org/W1992904657","https://openalex.org/W2013451793","https://openalex.org/W2015145609","https://openalex.org/W2025331063","https://openalex.org/W2027712195","https://openalex.org/W2045766544","https://openalex.org/W2046574526","https://openalex.org/W2053913299","https://openalex.org/W2064712157","https://openalex.org/W2069323107","https://openalex.org/W2086551550","https://openalex.org/W2089322412","https://openalex.org/W2103751315","https://openalex.org/W2120266641","https://openalex.org/W2124414146","https://openalex.org/W2125082141","https://openalex.org/W2126073857","https://openalex.org/W2126084661","https://openalex.org/W2127907001","https://openalex.org/W2133667118","https://openalex.org/W2141067179","https://openalex.org/W2143474538","https://openalex.org/W2143502515","https://openalex.org/W2144881807","https://openalex.org/W2148292324","https://openalex.org/W2148448340","https://openalex.org/W2150620980","https://openalex.org/W2158473722","https://openalex.org/W2158921969","https://openalex.org/W2160312460","https://openalex.org/W2161129061","https://openalex.org/W2161277442","https://openalex.org/W2163273848","https://openalex.org/W2165437459","https://openalex.org/W2168938583","https://openalex.org/W2169862329","https://openalex.org/W2255465923","https://openalex.org/W6680812728","https://openalex.org/W7008583937"],"related_works":["https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W2358668433","https://openalex.org/W2093578348","https://openalex.org/W2376932109","https://openalex.org/W2382290278","https://openalex.org/W2350741829","https://openalex.org/W3004735627","https://openalex.org/W2130043461"],"abstract_inverted_index":{"Three-dimensional":[0],"ICs":[1,20],"promise":[2],"to":[3,26,57,121],"significantly":[4],"extend":[5],"the":[6,32,62,85,93],"scale":[7],"of":[8,34,53,87,95,135],"system":[9],"integration":[10,134],"and":[11,40,50,91,115],"facilitate":[12],"new-generation":[13],"electronics.":[14],"However,":[15],"progress":[16],"in":[17,76,100],"commercial":[18,36],"3D":[19,37,58,77,101,133],"has":[21],"been":[22],"slow.":[23],"In":[24],"addition":[25],"technology-related":[27],"difficulties,":[28],"industry":[29],"experts":[30],"cite":[31],"lack":[33],"a":[35,47,109],"EDA":[38],"tool-chain":[39],"design":[41,66,81],"standards,":[42],"high":[43,51],"risk":[44],"associated":[45],"with":[46],"new":[48],"technology,":[49],"cost":[52],"transition":[54],"from":[55],"2D":[56,71,97,123,137],"ICs.":[59,78,102],"To":[60,103],"streamline":[61],"transition,":[63],"we":[64,107],"explore":[65],"styles":[67,82],"that":[68],"reuse":[69,94],"existing":[70,96],"Intellectual":[72],"Property":[73],"(IP)":[74],"blocks":[75,99,125,139],"Currently,":[79],"these":[80],"severely":[83],"limit":[84],"placement":[86],"Through-Silicon":[88],"Vias":[89],"(TSVs)":[90],"constrain":[92],"IP":[98,124],"overcome":[104],"this":[105,145],"problem,":[106],"develop":[108],"methodology":[110],"for":[111,118,144],"using":[112],"TSV":[113,127],"islands":[114],"novel":[116],"techniques":[117],"clustering":[119],"nets":[120],"connect":[122],"through":[126],"islands.":[128],"Our":[129],"empirical":[130],"validation":[131],"demonstrates":[132],"traditional":[136],"circuit":[138],"without":[140],"modifying":[141],"their":[142],"layout":[143],"context.":[146]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2012,"cited_by_count":2}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}