{"id":"https://openalex.org/W1978037946","doi":"https://doi.org/10.1145/1960397.1960416","title":"Advances in 3D integrated circuits","display_name":"Advances in 3D integrated circuits","publication_year":2011,"publication_date":"2011-03-22","ids":{"openalex":"https://openalex.org/W1978037946","doi":"https://doi.org/10.1145/1960397.1960416","mag":"1978037946"},"language":"en","primary_location":{"id":"doi:10.1145/1960397.1960416","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1960397.1960416","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2011 international symposium on Physical design","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5044855375","display_name":"Robert Patti","orcid":"https://orcid.org/0000-0003-0247-160X"},"institutions":[{"id":"https://openalex.org/I4210121846","display_name":"Tezzaron Semiconductor (United States)","ror":"https://ror.org/02wedcm51","country_code":"US","type":"company","lineage":["https://openalex.org/I4210121846"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Robert Patti","raw_affiliation_strings":["Tezzaron Semiconductor Corporation, Naperville, IL, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tezzaron Semiconductor Corporation, Naperville, IL, USA","institution_ids":["https://openalex.org/I4210121846"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5044855375"],"corresponding_institution_ids":["https://openalex.org/I4210121846"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.05270194,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"79","last_page":"80"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9575999975204468,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10624","display_name":"Silicon and Solar Cell Technologies","score":0.9307000041007996,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.7067633271217346},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6091768145561218},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.5435431599617004},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.538216769695282},{"id":"https://openalex.org/keywords/mixed-signal-integrated-circuit","display_name":"Mixed-signal integrated circuit","score":0.4951585829257965},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4904651343822479},{"id":"https://openalex.org/keywords/field","display_name":"Field (mathematics)","score":0.43158161640167236},{"id":"https://openalex.org/keywords/system-integration","display_name":"System integration","score":0.42869535088539124},{"id":"https://openalex.org/keywords/integrated-circuit-design","display_name":"Integrated circuit design","score":0.4127136766910553},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.33604735136032104},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.32085976004600525},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.31287986040115356},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.3099779486656189},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3010770082473755},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2903100252151489}],"concepts":[{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.7067633271217346},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6091768145561218},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5435431599617004},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.538216769695282},{"id":"https://openalex.org/C62907940","wikidata":"https://www.wikidata.org/wiki/Q1541329","display_name":"Mixed-signal integrated circuit","level":3,"score":0.4951585829257965},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4904651343822479},{"id":"https://openalex.org/C9652623","wikidata":"https://www.wikidata.org/wiki/Q190109","display_name":"Field (mathematics)","level":2,"score":0.43158161640167236},{"id":"https://openalex.org/C19527686","wikidata":"https://www.wikidata.org/wiki/Q1665453","display_name":"System integration","level":2,"score":0.42869535088539124},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.4127136766910553},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.33604735136032104},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.32085976004600525},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.31287986040115356},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.3099779486656189},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3010770082473755},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2903100252151489},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C202444582","wikidata":"https://www.wikidata.org/wiki/Q837863","display_name":"Pure mathematics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/1960397.1960416","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1960397.1960416","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2011 international symposium on Physical design","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.46000000834465027,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2031235560","https://openalex.org/W2161335888","https://openalex.org/W2375192119","https://openalex.org/W3215142653","https://openalex.org/W4242383160","https://openalex.org/W2114773158","https://openalex.org/W2548106609","https://openalex.org/W2154989823","https://openalex.org/W1957521530","https://openalex.org/W1852277090"],"abstract_inverted_index":{"In":[0],"this":[1],"paper,":[2],"we":[3],"describe":[4],"the":[5,8,34],"developments":[6],"over":[7],"past":[9],"several":[10],"years":[11],"in":[12,42,84],"field":[13],"of":[14,33,39,58,115],"3D":[15,18,50,81,109],"integrated":[16,51],"circuits.":[17],"integration":[19,110],"offers":[20,82],"far":[21],"greater":[22],"improvements":[23],"than":[24],"traditional":[25],"semiconductor":[26,40],"scaling":[27],"can":[28,53],"provide":[29],"today.":[30],"Considered":[31],"part":[32],"\"More":[35],"Than":[36],"Moore\"":[37],"category":[38],"technology,":[41],"addition":[43],"to":[44,92],"increasing":[45],"circuit":[46],"and":[47,60,89,98,119],"system":[48,99],"density,":[49,87],"circuits":[52],"blend":[54],"a":[55,63,78],"wide":[56],"range":[57],"materials":[59],"technologies":[61],"into":[62],"signal":[64],"polylithic":[65],"device":[66],"acting":[67],"as":[68],"if":[69],"these":[70],"disparate":[71],"items":[72],"were":[73],"truly":[74],"fabricated":[75],"together":[76],"on":[77],"single":[79],"wafer.":[80],"improvement":[83],"power,":[85],"speed,":[86],"cost":[88],"reliability,":[90],"but":[91],"access":[93],"these,":[94],"new":[95],"design":[96],"techniques":[97],"architectures":[100],"must":[101],"be":[102],"used.":[103],"The":[104],"paper":[105],"will":[106],"review":[107],"various":[108],"techniques,":[111],"tool":[112],"requirements,":[113],"application":[114],"advanced":[116],"test":[117],"methodologies,":[118],"results.":[120]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}