{"id":"https://openalex.org/W2126084661","doi":"https://doi.org/10.1145/1837274.1837476","title":"TSV stress aware timing analysis with applications to 3D-IC layout optimization","display_name":"TSV stress aware timing analysis with applications to 3D-IC layout optimization","publication_year":2010,"publication_date":"2010-06-13","ids":{"openalex":"https://openalex.org/W2126084661","doi":"https://doi.org/10.1145/1837274.1837476","mag":"2126084661"},"language":"en","primary_location":{"id":"doi:10.1145/1837274.1837476","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1837274.1837476","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 47th Design Automation Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5102460504","display_name":"Jae-Seok Yang","orcid":null},"institutions":[{"id":"https://openalex.org/I86519309","display_name":"The University of Texas at Austin","ror":"https://ror.org/00hj54h04","country_code":"US","type":"education","lineage":["https://openalex.org/I86519309"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Jae-Seok Yang","raw_affiliation_strings":["University of Texas at Austin, Austin, TX","[Department of ECE, University of Texas at Austin, Austin, TX, USA]"],"affiliations":[{"raw_affiliation_string":"University of Texas at Austin, Austin, TX","institution_ids":["https://openalex.org/I86519309"]},{"raw_affiliation_string":"[Department of ECE, University of Texas at Austin, Austin, TX, USA]","institution_ids":["https://openalex.org/I86519309"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067424365","display_name":"Krit Athikulwongse","orcid":"https://orcid.org/0000-0002-4092-8634"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Krit Athikulwongse","raw_affiliation_strings":["Georgia Institute of Technology, Atlanta, Georgia","School of ECE, Georgia Institute of Technology Atlanta, Georgia, USA"],"affiliations":[{"raw_affiliation_string":"Georgia Institute of Technology, Atlanta, Georgia","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"School of ECE, Georgia Institute of Technology Atlanta, Georgia, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101399645","display_name":"Young\u2010Joon Lee","orcid":"https://orcid.org/0000-0002-1735-3385"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Young-Joon Lee","raw_affiliation_strings":["Georgia Institute of Technology, Atlanta, Georgia","School of ECE, Georgia Institute of Technology Atlanta, Georgia, USA"],"affiliations":[{"raw_affiliation_string":"Georgia Institute of Technology, Atlanta, Georgia","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"School of ECE, Georgia Institute of Technology Atlanta, Georgia, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052950521","display_name":"Sung Kyu Lim","orcid":"https://orcid.org/0000-0002-2267-5282"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sung Kyu Lim","raw_affiliation_strings":["Georgia Institute of Technology, Atlanta, Georgia","School of ECE, Georgia Institute of Technology Atlanta, Georgia, USA"],"affiliations":[{"raw_affiliation_string":"Georgia Institute of Technology, Atlanta, Georgia","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"School of ECE, Georgia Institute of Technology Atlanta, Georgia, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5011883763","display_name":"David Z. Pan","orcid":"https://orcid.org/0000-0002-5705-2501"},"institutions":[{"id":"https://openalex.org/I86519309","display_name":"The University of Texas at Austin","ror":"https://ror.org/00hj54h04","country_code":"US","type":"education","lineage":["https://openalex.org/I86519309"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"David Z. Pan","raw_affiliation_strings":["University of Texas at Austin, Austin, TX","[Department of ECE, University of Texas at Austin, Austin, TX, USA]"],"affiliations":[{"raw_affiliation_string":"University of Texas at Austin, Austin, TX","institution_ids":["https://openalex.org/I86519309"]},{"raw_affiliation_string":"[Department of ECE, University of Texas at Austin, Austin, TX, USA]","institution_ids":["https://openalex.org/I86519309"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5102460504"],"corresponding_institution_ids":["https://openalex.org/I86519309"],"apc_list":null,"apc_paid":null,"fwci":18.473,"has_fulltext":false,"cited_by_count":107,"citation_normalized_percentile":{"value":0.99500277,"is_in_top_1_percent":true,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":100},"biblio":{"volume":null,"issue":null,"first_page":"803","last_page":"806"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.631953239440918},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.6167029738426208},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.5938705801963806},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.578308641910553},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.5098754167556763},{"id":"https://openalex.org/keywords/stacking","display_name":"Stacking","score":0.4974425137042999},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.46668821573257446},{"id":"https://openalex.org/keywords/transistor","display_name":"Transistor","score":0.45801419019699097},{"id":"https://openalex.org/keywords/static-timing-analysis","display_name":"Static timing analysis","score":0.4554043710231781},{"id":"https://openalex.org/keywords/netlist","display_name":"Netlist","score":0.4371337592601776},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.42207467555999756},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.34722793102264404},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.2319309413433075},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.21438559889793396},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.14454805850982666},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.1212267279624939},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.07971468567848206}],"concepts":[{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.631953239440918},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.6167029738426208},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.5938705801963806},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.578308641910553},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.5098754167556763},{"id":"https://openalex.org/C33347731","wikidata":"https://www.wikidata.org/wiki/Q285210","display_name":"Stacking","level":2,"score":0.4974425137042999},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.46668821573257446},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.45801419019699097},{"id":"https://openalex.org/C93682380","wikidata":"https://www.wikidata.org/wiki/Q2025226","display_name":"Static timing analysis","level":2,"score":0.4554043710231781},{"id":"https://openalex.org/C177650935","wikidata":"https://www.wikidata.org/wiki/Q1760303","display_name":"Netlist","level":2,"score":0.4371337592601776},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.42207467555999756},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.34722793102264404},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.2319309413433075},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.21438559889793396},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.14454805850982666},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1212267279624939},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.07971468567848206},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/1837274.1837476","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1837274.1837476","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 47th Design Automation Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.4099999964237213}],"awards":[],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W2002257666","https://openalex.org/W2015941345","https://openalex.org/W2026777333","https://openalex.org/W2069345435","https://openalex.org/W2103567833","https://openalex.org/W2108880814","https://openalex.org/W2122909261","https://openalex.org/W2133667118","https://openalex.org/W2150620980","https://openalex.org/W2154869256","https://openalex.org/W2161129061","https://openalex.org/W2163273848","https://openalex.org/W2546770439","https://openalex.org/W3023222859","https://openalex.org/W6654486189"],"related_works":["https://openalex.org/W1990828594","https://openalex.org/W2016970881","https://openalex.org/W2027159884","https://openalex.org/W2333804548","https://openalex.org/W2534942874","https://openalex.org/W3093450488","https://openalex.org/W2016589506","https://openalex.org/W2376702355","https://openalex.org/W4385062230","https://openalex.org/W4237709086"],"abstract_inverted_index":{"As":[0],"the":[1,98,185],"geometry":[2],"shrinking":[3],"faces":[4],"severe":[5],"limitations,":[6],"3D":[7],"wafer":[8],"stacking":[9],"with":[10,91,154],"through":[11],"silicon":[12,27,37,61],"via":[13],"(TSV)":[14],"has":[15],"gained":[16],"interest":[17],"for":[18,81,133,171,179],"future":[19],"SOC":[20],"integration.":[21],"Since":[22],"TSV":[23,35,51,70,159],"fill":[24,52],"material":[25,53],"and":[26,46,75,105,115,122,126,144,151,208],"have":[28],"different":[29,41],"coefficients":[30],"of":[31],"thermal":[32],"expansion":[33],"(CTE),":[34],"causes":[36,57],"deformation":[38],"due":[39],"to":[40,78,103,140,149,156,189,206],"temperatures":[42],"at":[43],"chip":[44],"manufacturing":[45],"operating.":[47],"The":[48],"widely":[49],"used":[50],"is":[54,101,138],"copper":[55],"which":[56],"tensile":[58,99],"stress":[59,71,88,95,100,150,160],"on":[60,110,192],"near":[62],"TSV.":[63],"In":[64],"this":[65],"paper,":[66],"we":[67,85,182],"propose":[68],"systematic":[69],"aware":[72,119],"timing":[73,131,135,162,191],"analysis":[74],"show":[76,196],"how":[77],"optimize":[79],"layout":[80,180],"better":[82],"performance.":[83],"First,":[84],"generate":[86],"a":[87],"contour":[89],"map":[90],"an":[92,129,172,177],"analytical":[93],"radial":[94],"model.":[96],"Then,":[97],"converted":[102],"hole":[104],"electron":[106],"mobility":[107,187],"variations":[108,163],"depending":[109],"geometric":[111],"relation":[112],"between":[113],"TSVs":[114],"transistors.":[116],"Mobility":[117],"variation":[118],"cell":[120,202],"library":[121],"netlist":[123],"are":[124],"generated":[125],"incorporated":[127],"in":[128,214],"industrial":[130],"engine":[132],"3D-IC":[134],"analysis.":[136],"It":[137],"interesting":[139],"observe":[141],"that":[142,197],"rise":[143],"fall":[145],"time":[146],"react":[147],"differently":[148],"relative":[152],"locations":[153],"respect":[155],"TSVs.":[157],"Overall,":[158],"induced":[161],"can":[164,183],"be":[165],"as":[166,168,176],"much":[167],"\u00b1":[169],"10%":[170],"individual":[173],"cell.":[174],"Thus":[175],"application":[178],"optimization,":[181],"exploit":[184],"stress-induced":[186],"enhancement":[188],"improve":[190],"critical":[193,209],"cells.":[194],"We":[195],"stress-aware":[198],"perturbation":[199],"could":[200],"reduce":[201],"delay":[203,211],"by":[204,212],"up":[205],"14.0%":[207],"path":[210],"6.5%":[213],"our":[215],"test":[216],"case.":[217]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":3},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2018,"cited_by_count":5},{"year":2017,"cited_by_count":4},{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":11},{"year":2014,"cited_by_count":11},{"year":2013,"cited_by_count":20},{"year":2012,"cited_by_count":26}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}