{"id":"https://openalex.org/W2010435501","doi":"https://doi.org/10.1145/1741906.1742206","title":"RF signal crossover across PTH (Via)","display_name":"RF signal crossover across PTH (Via)","publication_year":2010,"publication_date":"2010-02-26","ids":{"openalex":"https://openalex.org/W2010435501","doi":"https://doi.org/10.1145/1741906.1742206","mag":"2010435501"},"language":"en","primary_location":{"id":"doi:10.1145/1741906.1742206","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1741906.1742206","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the International Conference and Workshop on Emerging Trends in Technology","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5067311216","display_name":"Dushyant P. Sharma","orcid":null},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Dushyant P. Sharma","raw_affiliation_strings":[""],"affiliations":[{"raw_affiliation_string":"","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108555879","display_name":"A. Ebenezer Jeyakumar","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Amutha Jeyakumar","raw_affiliation_strings":[""],"affiliations":[{"raw_affiliation_string":"","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5041583554","display_name":"Dimple Vora","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Dimple Vora","raw_affiliation_strings":[""],"affiliations":[{"raw_affiliation_string":"","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5028362345","display_name":"Bhavana Bhardwaj","orcid":"https://orcid.org/0000-0002-4379-1565"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"B. C. Bhardwaj","raw_affiliation_strings":[""],"affiliations":[{"raw_affiliation_string":"","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5067311216"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.08589163,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1015","last_page":"1015"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9825000166893005,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9825000166893005,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9763000011444092,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10986","display_name":"RFID technology advancements","score":0.9700999855995178,"subfield":{"id":"https://openalex.org/subfields/2214","display_name":"Media Technology"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.7824151515960693},{"id":"https://openalex.org/keywords/miniaturization","display_name":"Miniaturization","score":0.7695175409317017},{"id":"https://openalex.org/keywords/microstrip","display_name":"Microstrip","score":0.7010948657989502},{"id":"https://openalex.org/keywords/crossover","display_name":"Crossover","score":0.6838188171386719},{"id":"https://openalex.org/keywords/signal-integrity","display_name":"Signal integrity","score":0.5328384637832642},{"id":"https://openalex.org/keywords/stub","display_name":"Stub (electronics)","score":0.5261953473091125},{"id":"https://openalex.org/keywords/electrical-impedance","display_name":"Electrical impedance","score":0.48653116822242737},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.47044673562049866},{"id":"https://openalex.org/keywords/insertion-loss","display_name":"Insertion loss","score":0.4402119219303131},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4375343322753906},{"id":"https://openalex.org/keywords/signal","display_name":"SIGNAL (programming language)","score":0.4215930104255676},{"id":"https://openalex.org/keywords/radio-frequency","display_name":"Radio frequency","score":0.41323086619377136},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.37900638580322266},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3587195575237274},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.3385043144226074},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.2146053910255432}],"concepts":[{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.7824151515960693},{"id":"https://openalex.org/C57528182","wikidata":"https://www.wikidata.org/wiki/Q1271842","display_name":"Miniaturization","level":2,"score":0.7695175409317017},{"id":"https://openalex.org/C123657345","wikidata":"https://www.wikidata.org/wiki/Q639055","display_name":"Microstrip","level":2,"score":0.7010948657989502},{"id":"https://openalex.org/C122507166","wikidata":"https://www.wikidata.org/wiki/Q628906","display_name":"Crossover","level":2,"score":0.6838188171386719},{"id":"https://openalex.org/C44938667","wikidata":"https://www.wikidata.org/wiki/Q4503810","display_name":"Signal integrity","level":3,"score":0.5328384637832642},{"id":"https://openalex.org/C63676506","wikidata":"https://www.wikidata.org/wiki/Q3976238","display_name":"Stub (electronics)","level":2,"score":0.5261953473091125},{"id":"https://openalex.org/C17829176","wikidata":"https://www.wikidata.org/wiki/Q179043","display_name":"Electrical impedance","level":2,"score":0.48653116822242737},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.47044673562049866},{"id":"https://openalex.org/C90327742","wikidata":"https://www.wikidata.org/wiki/Q947396","display_name":"Insertion loss","level":2,"score":0.4402119219303131},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4375343322753906},{"id":"https://openalex.org/C2779843651","wikidata":"https://www.wikidata.org/wiki/Q7390335","display_name":"SIGNAL (programming language)","level":2,"score":0.4215930104255676},{"id":"https://openalex.org/C74064498","wikidata":"https://www.wikidata.org/wiki/Q3396184","display_name":"Radio frequency","level":2,"score":0.41323086619377136},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.37900638580322266},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3587195575237274},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.3385043144226074},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.2146053910255432},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/1741906.1742206","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1741906.1742206","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the International Conference and Workshop on Emerging Trends in Technology","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2549034220","https://openalex.org/W3000048763","https://openalex.org/W27383583","https://openalex.org/W2364371960","https://openalex.org/W2537540583","https://openalex.org/W1582212326","https://openalex.org/W948881177","https://openalex.org/W3211049872","https://openalex.org/W3216124604","https://openalex.org/W2156032803"],"abstract_inverted_index":{"A":[0],"microstrip":[1,135],"Via":[2,106],"or":[3,94],"Plated":[4],"Through":[5],"Hole":[6],"is":[7,20,41,107,110,182,187],"encountered":[8],"in":[9,54,73,112,117,153,192,203],"case":[10],"of":[11,36,58,60,85,91,104,129,133,140,145],"(a)":[12],"Component":[13],"grounding":[14],"and":[15,44,75,87,109,168,196,215],"(b)":[16],"when":[17],"the":[18,48,105,113,127,130,134,138,154,204,210,213,216],"signal":[19,37],"expected":[21],"to":[22,83,125,178,200],"change":[23,53],"a":[24,27,39,51,69,89],"layer":[25],"on":[26,162],"Printed":[28],"Circuit":[29],"Board":[30],"(PCB).":[31],"Case":[32],"(b),":[33],"i.e.":[34],"Crossover":[35],"through":[38],"'Via'":[40],"an":[42,141],"important":[43],"interesting":[45],"phenomenon":[46],"as":[47,151],"discontinuity":[49],"presents":[50],"step":[52],"characteristic":[55],"impedance!":[56],"Requirement":[57],"Miniaturization":[59],"circuitry":[61],"means":[62],"that":[63],"Signal":[64],"Cross-Over":[65],"Vias":[66],"(SCOV)":[67],"find":[68],"place":[70],"quite":[71],"often":[72,79],"RF":[74],"Microwave":[76],"Boards.":[77],"Engineers":[78],"avoid":[80],"them":[81],"due":[82],"lack":[84],"understanding":[86],"sacrifice":[88],"lot":[90],"board":[92],"space":[93],"end":[95],"up":[96,177],"implementing":[97],"expensive":[98],"alternate":[99],"solutions.":[100],"Reasonably":[101],"accurate":[102],"model":[103],"available":[108],"used":[111],"study":[114,158],"carried":[115,161],"out":[116],"this":[118],"paper.":[119],"An":[120],"attempt":[121],"has":[122,159,173],"been":[123,160,174],"made":[124],"minimize":[126],"effect":[128],"inductive":[131],"reactance":[132],"via":[136,166],"with":[137,164],"help":[139],"open":[142],"wire":[143],"stub":[144],"small":[146],"(appropriate)":[147],"length,":[148],"interchangeably":[149],"termed":[150],"monopole":[152],"following":[155],"passages.":[156],"The":[157,170],"PCBs":[163],"different":[165],"sizes":[167],"configurations.":[169],"frequency":[171],"range":[172],"purposely":[175],"restricted":[176],"4GHz.":[179],"Substrate":[180],"chosen":[181],"commercial":[183],"Rogers":[184],"4003C.":[185],"It":[186],"low":[188],"loss":[189],"substrate":[190],"even":[191],"Millimetre":[193],"Wave":[194],"Range":[195],"will":[197],"not":[198],"contribute":[199],"absorptive":[201],"losses":[202],"PCB.":[205],"Conclusions":[206],"are":[207],"drawn":[208],"from":[209],"comparison":[211],"between":[212],"observed":[214],"theoretical":[217],"results.":[218]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}