{"id":"https://openalex.org/W2170382128","doi":"https://doi.org/10.1145/1669112.1669172","title":"McPAT","display_name":"McPAT","publication_year":2009,"publication_date":"2009-12-12","ids":{"openalex":"https://openalex.org/W2170382128","doi":"https://doi.org/10.1145/1669112.1669172","mag":"2170382128"},"language":"en","primary_location":{"id":"doi:10.1145/1669112.1669172","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1669112.1669172","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 42nd Annual IEEE/ACM International Symposium on Microarchitecture","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100359839","display_name":"Sheng Li","orcid":"https://orcid.org/0000-0003-1205-8632"},"institutions":[{"id":"https://openalex.org/I1324840837","display_name":"Hewlett-Packard (United States)","ror":"https://ror.org/059rn9488","country_code":"US","type":"company","lineage":["https://openalex.org/I1324840837"]},{"id":"https://openalex.org/I107639228","display_name":"University of Notre Dame","ror":"https://ror.org/00mkhxb43","country_code":"US","type":"education","lineage":["https://openalex.org/I107639228"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Sheng Li","raw_affiliation_strings":["University of Notre Dame and Hewlett-Packard Labs"],"affiliations":[{"raw_affiliation_string":"University of Notre Dame and Hewlett-Packard Labs","institution_ids":["https://openalex.org/I1324840837","https://openalex.org/I107639228"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078262826","display_name":"Jung Ho Ahn","orcid":"https://orcid.org/0000-0003-1733-1394"},"institutions":[{"id":"https://openalex.org/I1324840837","display_name":"Hewlett-Packard (United States)","ror":"https://ror.org/059rn9488","country_code":"US","type":"company","lineage":["https://openalex.org/I1324840837"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jung Ho Ahn","raw_affiliation_strings":["Seoul National University and Hewlett-Packard Labs"],"affiliations":[{"raw_affiliation_string":"Seoul National University and Hewlett-Packard Labs","institution_ids":["https://openalex.org/I1324840837"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110669073","display_name":"Richard Strong","orcid":null},"institutions":[{"id":"https://openalex.org/I36258959","display_name":"University of California, San Diego","ror":"https://ror.org/0168r3w48","country_code":"US","type":"education","lineage":["https://openalex.org/I36258959"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Richard D. Strong","raw_affiliation_strings":["University of California, San Diego"],"affiliations":[{"raw_affiliation_string":"University of California, San Diego","institution_ids":["https://openalex.org/I36258959"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026229568","display_name":"Jay Brockman","orcid":null},"institutions":[{"id":"https://openalex.org/I107639228","display_name":"University of Notre Dame","ror":"https://ror.org/00mkhxb43","country_code":"US","type":"education","lineage":["https://openalex.org/I107639228"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jay B. Brockman","raw_affiliation_strings":["University of Notre Dame"],"affiliations":[{"raw_affiliation_string":"University of Notre Dame","institution_ids":["https://openalex.org/I107639228"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5065583627","display_name":"Dean M. Tullsen","orcid":"https://orcid.org/0000-0003-3174-9316"},"institutions":[{"id":"https://openalex.org/I139264467","display_name":"Seoul National University","ror":"https://ror.org/04h9pn542","country_code":"KR","type":"education","lineage":["https://openalex.org/I139264467"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Dean M. Tullsen","raw_affiliation_strings":["Seoul National University"],"affiliations":[{"raw_affiliation_string":"Seoul National University","institution_ids":["https://openalex.org/I139264467"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5050207942","display_name":"Norman P. Jouppi","orcid":"https://orcid.org/0000-0003-1765-1929"},"institutions":[{"id":"https://openalex.org/I1324840837","display_name":"Hewlett-Packard (United States)","ror":"https://ror.org/059rn9488","country_code":"US","type":"company","lineage":["https://openalex.org/I1324840837"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Norman P. Jouppi","raw_affiliation_strings":["Hewlett-Packard Labs"],"affiliations":[{"raw_affiliation_string":"Hewlett-Packard Labs","institution_ids":["https://openalex.org/I1324840837"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5100359839"],"corresponding_institution_ids":["https://openalex.org/I107639228","https://openalex.org/I1324840837"],"apc_list":null,"apc_paid":null,"fwci":60.0295,"has_fulltext":false,"cited_by_count":2361,"citation_normalized_percentile":{"value":0.99990535,"is_in_top_1_percent":true,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":99,"max":100},"biblio":{"volume":null,"issue":null,"first_page":"469","last_page":"480"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4823714792728424}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4823714792728424}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/1669112.1669172","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1669112.1669172","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 42nd Annual IEEE/ACM International Symposium on Microarchitecture","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.6499999761581421,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":48,"referenced_works":["https://openalex.org/W63944998","https://openalex.org/W1482073811","https://openalex.org/W1492601037","https://openalex.org/W1505816907","https://openalex.org/W1514437667","https://openalex.org/W1555915743","https://openalex.org/W1978154694","https://openalex.org/W1996623312","https://openalex.org/W2010585077","https://openalex.org/W2022740893","https://openalex.org/W2032094184","https://openalex.org/W2042340295","https://openalex.org/W2042885725","https://openalex.org/W2044206819","https://openalex.org/W2053325738","https://openalex.org/W2079668820","https://openalex.org/W2097207701","https://openalex.org/W2100799944","https://openalex.org/W2102727118","https://openalex.org/W2103206828","https://openalex.org/W2116020886","https://openalex.org/W2117648153","https://openalex.org/W2118532220","https://openalex.org/W2134633067","https://openalex.org/W2138351227","https://openalex.org/W2139542266","https://openalex.org/W2145021036","https://openalex.org/W2145252892","https://openalex.org/W2153456949","https://openalex.org/W2153733042","https://openalex.org/W2156476900","https://openalex.org/W2160079210","https://openalex.org/W2161864047","https://openalex.org/W2164188348","https://openalex.org/W2164264749","https://openalex.org/W2166151045","https://openalex.org/W2169875292","https://openalex.org/W2178304631","https://openalex.org/W2725179571","https://openalex.org/W2788962374","https://openalex.org/W3103339143","https://openalex.org/W3145579537","https://openalex.org/W4239813889","https://openalex.org/W4244034697","https://openalex.org/W4285719527","https://openalex.org/W6602613798","https://openalex.org/W6630190462","https://openalex.org/W6644613506"],"related_works":["https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W2358668433","https://openalex.org/W2376932109","https://openalex.org/W2382290278","https://openalex.org/W2350741829","https://openalex.org/W2130043461","https://openalex.org/W2530322880","https://openalex.org/W1596801655"],"abstract_inverted_index":{"This":[0,146],"paper":[1,147],"introduces":[2],"McPAT,":[3],"an":[4],"integrated":[5,55],"power,":[6,204],"area,":[7,205],"and":[8,20,29,48,58,64,74,77,96,129,142,174,206,226,265],"timing":[9,70,207],"modeling":[10,80],"framework":[11],"that":[12,231],"supports":[13,68],"comprehensive":[14],"design":[15],"space":[16],"exploration":[17],"for":[18,38,81,222],"multicore":[19],"manycore":[21,154,228],"processor":[22,50],"configurations":[23],"ranging":[24],"from":[25],"90nm":[26],"to":[27,105,121,180,198],"22nm":[28,219],"beyond.":[30],"At":[31,61],"the":[32,39,62,84,89,124,149,158,177,218,245,262],"microarchitectural":[33],"level,":[34],"McPAT":[35,67,99,118,210],"includes":[36],"models":[37],"fundamental":[40],"components":[41],"of":[42,83,126,132,152,160,164,195,200,209,214],"a":[43,101,115],"chip":[44],"multiprocessor,":[45],"including":[46,92],"in-order":[47,225],"out-of-order":[49,227],"cores,":[51],"networks-on-chip,":[52],"shared":[53],"caches,":[54],"memory":[56],"controllers,":[57],"multiple-domain":[59],"clocking.":[60],"circuit":[63],"technology":[65,220],"levels,":[66],"critical-path":[69],"modeling,":[71,73],"area":[72,173,186],"dynamic,":[75],"short-circuit,":[76],"leakage":[78],"power":[79],"each":[82],"device":[85],"types":[86],"forecast":[87],"in":[88],"ITRS":[90],"roadmap":[91],"bulk":[93],"CMOS,":[94],"SOI,":[95],"double-gate":[97],"transistors.":[98],"has":[100],"flexible":[102],"XML":[103],"interface":[104],"facilitate":[106],"its":[107],"use":[108,194],"with":[109,114,211,258],"many":[110,189],"performance":[111,116,175,212],"simulators.":[112],"Combined":[113],"simulator,":[117],"enables":[119],"architects":[120],"consistently":[122],"quantify":[123],"cost":[125,234,251],"new":[127,136],"ideas":[128],"assess":[130],"tradeoffs":[131,171],"different":[133],"architectures":[134],"using":[135],"metrics":[137],"like":[138],"energy-delay-area2":[139],"product":[140,144],"(EDA2P)":[141],"energy-delay-area":[143],"(EDAP).":[145],"explores":[148],"interconnect":[150],"options":[151],"future":[153],"processors":[155],"by":[156],"varying":[157],"degree":[159],"clustering":[161,240],"over":[162],"generations":[163],"process":[165],"technologies.":[166],"Clustering":[167],"will":[168],"bring":[169],"interesting":[170],"between":[172],"because":[176],"interconnects":[178],"needed":[179],"group":[181],"cores":[182,242,260],"into":[183,238,254],"clusters":[184,257],"incur":[185],"overhead,":[187],"but":[188],"applications":[190],"can":[191],"make":[192],"good":[193],"them":[196],"due":[197],"synergies":[199],"cache":[201],"sharing.":[202],"Combining":[203],"results":[208],"simulation":[213],"PARSEC":[215],"benchmarks":[216],"at":[217],"node":[221],"both":[223],"common":[224],"designs":[229],"shows":[230],"when":[232,250],"die":[233],"is":[235,252],"not":[236],"taken":[237,253],"account":[239,255],"8":[241],"together":[243],"gives":[244,261],"best":[246,263],"energy-delay":[247],"product,":[248],"whereas":[249],"configuring":[256],"4":[259],"EDA2P":[264],"EDAP.":[266]},"counts_by_year":[{"year":2026,"cited_by_count":10},{"year":2025,"cited_by_count":47},{"year":2024,"cited_by_count":45},{"year":2023,"cited_by_count":50},{"year":2022,"cited_by_count":74},{"year":2021,"cited_by_count":115},{"year":2020,"cited_by_count":157},{"year":2019,"cited_by_count":179},{"year":2018,"cited_by_count":237},{"year":2017,"cited_by_count":252},{"year":2016,"cited_by_count":294},{"year":2015,"cited_by_count":276},{"year":2014,"cited_by_count":229},{"year":2013,"cited_by_count":171},{"year":2012,"cited_by_count":133}],"updated_date":"2026-04-14T08:04:32.555800","created_date":"2016-06-24T00:00:00"}