{"id":"https://openalex.org/W2131224517","doi":"https://doi.org/10.1145/1629911.1630054","title":"Variability analysis under layout pattern-dependent rapid-thermal annealing process","display_name":"Variability analysis under layout pattern-dependent rapid-thermal annealing process","publication_year":2009,"publication_date":"2009-07-26","ids":{"openalex":"https://openalex.org/W2131224517","doi":"https://doi.org/10.1145/1629911.1630054","mag":"2131224517"},"language":"en","primary_location":{"id":"doi:10.1145/1629911.1630054","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1629911.1630054","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 46th Annual Design Automation Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100675702","display_name":"Yun Ye","orcid":"https://orcid.org/0000-0003-1868-6744"},"institutions":[{"id":"https://openalex.org/I55732556","display_name":"Arizona State University","ror":"https://ror.org/03efmqc40","country_code":"US","type":"education","lineage":["https://openalex.org/I55732556"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Yun Ye","raw_affiliation_strings":["Arizona State University, Tempe, AZ","Dept. of Electr. Eng.. Arizona State Univ., Tempe, AZ, USA"],"affiliations":[{"raw_affiliation_string":"Arizona State University, Tempe, AZ","institution_ids":["https://openalex.org/I55732556"]},{"raw_affiliation_string":"Dept. of Electr. Eng.. Arizona State Univ., Tempe, AZ, USA","institution_ids":["https://openalex.org/I55732556"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006587869","display_name":"Frank Liu","orcid":"https://orcid.org/0000-0001-6615-0739"},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]},{"id":"https://openalex.org/I4210156936","display_name":"IBM Research - Austin","ror":"https://ror.org/05gjbbg60","country_code":"US","type":"facility","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210114115","https://openalex.org/I4210156936"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Frank Liu","raw_affiliation_strings":["IBM Austin Research Laboratory, Austin, TX","IBM Austin Research Laboratory, Austin, TX#TAB#"],"affiliations":[{"raw_affiliation_string":"IBM Austin Research Laboratory, Austin, TX","institution_ids":["https://openalex.org/I4210156936"]},{"raw_affiliation_string":"IBM Austin Research Laboratory, Austin, TX#TAB#","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100337221","display_name":"Min Chen","orcid":"https://orcid.org/0000-0002-3122-6788"},"institutions":[{"id":"https://openalex.org/I55732556","display_name":"Arizona State University","ror":"https://ror.org/03efmqc40","country_code":"US","type":"education","lineage":["https://openalex.org/I55732556"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Min Chen","raw_affiliation_strings":["Arizona State University, Tempe, AZ","Dept. of Electr. Eng.. Arizona State Univ., Tempe, AZ, USA"],"affiliations":[{"raw_affiliation_string":"Arizona State University, Tempe, AZ","institution_ids":["https://openalex.org/I55732556"]},{"raw_affiliation_string":"Dept. of Electr. Eng.. Arizona State Univ., Tempe, AZ, USA","institution_ids":["https://openalex.org/I55732556"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100740019","display_name":"Yu Cao","orcid":"https://orcid.org/0000-0001-6968-1180"},"institutions":[{"id":"https://openalex.org/I55732556","display_name":"Arizona State University","ror":"https://ror.org/03efmqc40","country_code":"US","type":"education","lineage":["https://openalex.org/I55732556"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yu Cao","raw_affiliation_strings":["Arizona State University, Tempe, AZ","Dept. of Electr. Eng.. Arizona State Univ., Tempe, AZ, USA"],"affiliations":[{"raw_affiliation_string":"Arizona State University, Tempe, AZ","institution_ids":["https://openalex.org/I55732556"]},{"raw_affiliation_string":"Dept. of Electr. Eng.. Arizona State Univ., Tempe, AZ, USA","institution_ids":["https://openalex.org/I55732556"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5100675702"],"corresponding_institution_ids":["https://openalex.org/I55732556"],"apc_list":null,"apc_paid":null,"fwci":2.0935,"has_fulltext":false,"cited_by_count":15,"citation_normalized_percentile":{"value":0.87860403,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"551","last_page":"556"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10623","display_name":"Thin-Film Transistor Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5391533374786377},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.48626887798309326},{"id":"https://openalex.org/keywords/annealing","display_name":"Annealing (glass)","score":0.4511394798755646},{"id":"https://openalex.org/keywords/simulated-annealing","display_name":"Simulated annealing","score":0.42119771242141724},{"id":"https://openalex.org/keywords/thermal-analysis","display_name":"Thermal analysis","score":0.41119998693466187},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.3574834167957306},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.25671809911727905},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.12168210744857788},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.0744016170501709},{"id":"https://openalex.org/keywords/programming-language","display_name":"Programming language","score":0.0687524676322937}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5391533374786377},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.48626887798309326},{"id":"https://openalex.org/C2777855556","wikidata":"https://www.wikidata.org/wiki/Q4339544","display_name":"Annealing (glass)","level":2,"score":0.4511394798755646},{"id":"https://openalex.org/C126980161","wikidata":"https://www.wikidata.org/wiki/Q863783","display_name":"Simulated annealing","level":2,"score":0.42119771242141724},{"id":"https://openalex.org/C129446986","wikidata":"https://www.wikidata.org/wiki/Q542419","display_name":"Thermal analysis","level":3,"score":0.41119998693466187},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.3574834167957306},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.25671809911727905},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.12168210744857788},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0744016170501709},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0687524676322937},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/1629911.1630054","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1629911.1630054","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 46th Annual Design Automation Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.7099999785423279,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W2004900205","https://openalex.org/W2012330358","https://openalex.org/W2029897760","https://openalex.org/W2036732602","https://openalex.org/W2044786215","https://openalex.org/W2046311163","https://openalex.org/W2069345435","https://openalex.org/W2098940745","https://openalex.org/W2105088857","https://openalex.org/W2108880814","https://openalex.org/W2109604935","https://openalex.org/W4244855212","https://openalex.org/W6675902717"],"related_works":["https://openalex.org/W2392013129","https://openalex.org/W2349721049","https://openalex.org/W2144626236","https://openalex.org/W2151100248","https://openalex.org/W1488569537","https://openalex.org/W2125447883","https://openalex.org/W246399138","https://openalex.org/W2350972196","https://openalex.org/W2150807309","https://openalex.org/W2350291007"],"abstract_inverted_index":{"Rapid-Thermal":[0],"Annealing":[1],"(RTA)":[2],"with":[3,19,153,166],"radiation":[4],"heating":[5,55],"is":[6],"recently":[7],"adopted":[8],"in":[9,13],"nanoscale":[10],"CMOS":[11],"fabrication":[12],"order":[14],"to":[15,40,74,120,128,134,180,188],"achieve":[16],"ultra-shallow":[17],"junction":[18],"maximum":[20],"dopant":[21,109,122],"activation":[22],"rate.":[23],"However,":[24],"recent":[25],"results":[26],"report":[27],"the":[28,87,99,112,149,189],"systematic":[29],"shift":[30,132],"of":[31,47,101,114,144],"threshold":[32],"voltage":[33],"(Vth)":[34],"and":[35,58,70,83,111,136,172,182],"increased":[36],"Vth":[37],"variation":[38,95],"due":[39,119,133,187],"RTA":[41,54,84,151,191],"process":[42,152],"[1--2].":[43],"The":[44,161],"exact":[45],"amount":[46],"variations":[48],"depends":[49],"on":[50],"layout":[51,80],"pattern":[52,81],"density,":[53],"temperature":[56],"(T)":[57],"effective":[59,102],"annealing":[60],"time.":[61],"In":[62],"this":[63],"work,":[64],"we":[65,91,140],"develop":[66],"joint":[67],"thermal/TCAD":[68],"simulation":[69,89],"compact":[71,145],"modeling":[72],"tools":[73,163],"analyze":[75],"performance":[76,131,185],"variability":[77,186],"under":[78,97],"various":[79],"densities":[82],"conditions.":[85],"With":[86],"new":[88,162],"capability,":[90],"recognize":[92],"two":[93],"major":[94],"mechanisms":[96],"RTA:":[98],"change":[100,156],"channel":[103],"length":[104],"(Leff)":[105],"induced":[106],"by":[107],"lateral":[108],"diffusion,":[110],"fluctuation":[113],"equivalent":[115],"oxide":[116],"thickness":[117],"(EOT)":[118],"incomplete":[121],"activation.":[123],"We":[124],"perform":[125],"device":[126,154],"simulations":[127],"quantify":[129],"transistor":[130],"Leff":[135],"EOT":[137],"variations.":[138],"Moreover,":[139],"propose":[141],"a":[142],"suite":[143],"models":[146],"that":[147],"bridge":[148],"underlying":[150],"parameter":[155],"for":[157],"efficient":[158],"design":[159],"optimization.":[160],"are":[164],"validated":[165],"published":[167],"silicon":[168],"data":[169],"at":[170],"45nm":[171],"65nm":[173],"nodes.":[174],"They":[175],"will":[176],"facilitate":[177],"physical":[178],"designers":[179],"predict":[181],"mitigate":[183],"circuit":[184],"layout-dependent":[190],"process.":[192]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":2},{"year":2013,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}