{"id":"https://openalex.org/W2066744219","doi":"https://doi.org/10.1145/1594233.1594243","title":"Hybrid logical-statistical simulation with thermal and IR-drop mapping for degradation and variation prediction","display_name":"Hybrid logical-statistical simulation with thermal and IR-drop mapping for degradation and variation prediction","publication_year":2009,"publication_date":"2009-08-19","ids":{"openalex":"https://openalex.org/W2066744219","doi":"https://doi.org/10.1145/1594233.1594243","mag":"2066744219"},"language":"en","primary_location":{"id":"doi:10.1145/1594233.1594243","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1594233.1594243","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2009 ACM/IEEE international symposium on Low power electronics and design","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5034866545","display_name":"Domenik Helms","orcid":"https://orcid.org/0000-0001-7326-200X"},"institutions":[{"id":"https://openalex.org/I202367325","display_name":"Oldenburger Institut f\u00fcr Informatik","ror":"https://ror.org/003sav189","country_code":"DE","type":"facility","lineage":["https://openalex.org/I202367325"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Domenik Helms","raw_affiliation_strings":["OFFIS, D26121 Oldenburg, Germany","OFFIS, D26121 Oldenburg, Germany#TAB#"],"affiliations":[{"raw_affiliation_string":"OFFIS, D26121 Oldenburg, Germany","institution_ids":["https://openalex.org/I202367325"]},{"raw_affiliation_string":"OFFIS, D26121 Oldenburg, Germany#TAB#","institution_ids":["https://openalex.org/I202367325"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5012071528","display_name":"Kai Hylla","orcid":null},"institutions":[{"id":"https://openalex.org/I202367325","display_name":"Oldenburger Institut f\u00fcr Informatik","ror":"https://ror.org/003sav189","country_code":"DE","type":"facility","lineage":["https://openalex.org/I202367325"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Kai Hylla","raw_affiliation_strings":["OFFIS, D26121, Oldenburg, Germany","OFFIS, D26121 Oldenburg, Germany#TAB#"],"affiliations":[{"raw_affiliation_string":"OFFIS, D26121, Oldenburg, Germany","institution_ids":["https://openalex.org/I202367325"]},{"raw_affiliation_string":"OFFIS, D26121 Oldenburg, Germany#TAB#","institution_ids":["https://openalex.org/I202367325"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5048688572","display_name":"Wolfgang Nebel","orcid":null},"institutions":[{"id":"https://openalex.org/I129877168","display_name":"Carl von Ossietzky Universit\u00e4t Oldenburg","ror":"https://ror.org/033n9gh91","country_code":"DE","type":"education","lineage":["https://openalex.org/I129877168"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Wolfgang Nebel","raw_affiliation_strings":["CvO Univerity, D26121, Oldenburg, Germany"],"affiliations":[{"raw_affiliation_string":"CvO Univerity, D26121, Oldenburg, Germany","institution_ids":["https://openalex.org/I129877168"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5034866545"],"corresponding_institution_ids":["https://openalex.org/I202367325"],"apc_list":null,"apc_paid":null,"fwci":0.2991,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.62166908,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"33","last_page":"38"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/floorplan","display_name":"Floorplan","score":0.7035263776779175},{"id":"https://openalex.org/keywords/degradation","display_name":"Degradation (telecommunications)","score":0.6112784147262573},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.5676145553588867},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5512951612472534},{"id":"https://openalex.org/keywords/leakage","display_name":"Leakage (economics)","score":0.45640337467193604},{"id":"https://openalex.org/keywords/drop","display_name":"Drop (telecommunication)","score":0.4383798837661743},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.4219704866409302},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4169695973396301},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.21845144033432007},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.204055517911911},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.10644635558128357},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.09663790464401245}],"concepts":[{"id":"https://openalex.org/C130145326","wikidata":"https://www.wikidata.org/wiki/Q1553985","display_name":"Floorplan","level":2,"score":0.7035263776779175},{"id":"https://openalex.org/C2779679103","wikidata":"https://www.wikidata.org/wiki/Q5251805","display_name":"Degradation (telecommunications)","level":2,"score":0.6112784147262573},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.5676145553588867},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5512951612472534},{"id":"https://openalex.org/C2777042071","wikidata":"https://www.wikidata.org/wiki/Q6509304","display_name":"Leakage (economics)","level":2,"score":0.45640337467193604},{"id":"https://openalex.org/C2781345722","wikidata":"https://www.wikidata.org/wiki/Q5308388","display_name":"Drop (telecommunication)","level":2,"score":0.4383798837661743},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.4219704866409302},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4169695973396301},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.21845144033432007},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.204055517911911},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.10644635558128357},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.09663790464401245},{"id":"https://openalex.org/C162324750","wikidata":"https://www.wikidata.org/wiki/Q8134","display_name":"Economics","level":0,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C139719470","wikidata":"https://www.wikidata.org/wiki/Q39680","display_name":"Macroeconomics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/1594233.1594243","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1594233.1594243","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2009 ACM/IEEE international symposium on Low power electronics and design","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Responsible consumption and production","score":0.5299999713897705,"id":"https://metadata.un.org/sdg/12"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1524238279","https://openalex.org/W1538951169","https://openalex.org/W1607199524","https://openalex.org/W1789558444","https://openalex.org/W2032444288","https://openalex.org/W2035224686","https://openalex.org/W2118955652","https://openalex.org/W2129947514","https://openalex.org/W2147702906","https://openalex.org/W2166879689","https://openalex.org/W2404664789"],"related_works":["https://openalex.org/W2055008360","https://openalex.org/W1500063550","https://openalex.org/W2135118255","https://openalex.org/W215057456","https://openalex.org/W2106366463","https://openalex.org/W1535718467","https://openalex.org/W2165891825","https://openalex.org/W4251805775","https://openalex.org/W4239364405","https://openalex.org/W2370255709"],"abstract_inverted_index":{"We":[0],"present":[1],"a":[2,31,36],"statistical":[3],"life-time":[4],"description":[5],"for":[6,20],"digital":[7],"systems,":[8],"which":[9],"is":[10],"characterised":[11],"by":[12],"short":[13],"term":[14,70],"functional":[15],"simulation.":[16],"Temperature":[17],"and":[18,35,43,51,56,61],"IR-drops":[19],"each":[21],"hardware":[22],"task":[23],"of":[24,40],"the":[25,41],"system":[26],"are":[27],"regarded":[28],"based":[29],"on":[30],"coarse":[32],"RT":[33],"floorplan":[34],"component":[37],"wise":[38],"prediction":[39],"dynamic":[42,55],"leakage":[44,57],"power.":[45],"By":[46],"iteratively":[47],"updating":[48],"threshold":[49],"voltage":[50],"supply":[52],"resistances,":[53],"then":[54,59],"power,":[58],"temperature":[60],"IR-drop":[62],"distribution,":[63],"electro-thermal":[64],"coupling":[65],"as":[66,68],"well":[67],"long":[69],"degradation":[71],"effects":[72],"can":[73],"be":[74],"described.":[75]},"counts_by_year":[{"year":2017,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}