{"id":"https://openalex.org/W2050219435","doi":"https://doi.org/10.1145/1514932.1514969","title":"A faster approximation scheme for timing driven minimum cost layer assignment","display_name":"A faster approximation scheme for timing driven minimum cost layer assignment","publication_year":2009,"publication_date":"2009-03-29","ids":{"openalex":"https://openalex.org/W2050219435","doi":"https://doi.org/10.1145/1514932.1514969","mag":"2050219435"},"language":"en","primary_location":{"id":"doi:10.1145/1514932.1514969","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1514932.1514969","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2009 international symposium on Physical design","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5114375267","display_name":"Shiyan Hu","orcid":"https://orcid.org/0000-0001-5029-1588"},"institutions":[{"id":"https://openalex.org/I11957088","display_name":"Michigan Technological University","ror":"https://ror.org/0036rpn28","country_code":"US","type":"education","lineage":["https://openalex.org/I11957088"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Shiyan Hu","raw_affiliation_strings":["Michigan Technological University, Houghton, MI, USA","Michigan Technological University Houghton, MI, USA,#TAB#"],"affiliations":[{"raw_affiliation_string":"Michigan Technological University, Houghton, MI, USA","institution_ids":["https://openalex.org/I11957088"]},{"raw_affiliation_string":"Michigan Technological University Houghton, MI, USA,#TAB#","institution_ids":["https://openalex.org/I11957088"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5043863682","display_name":"Zhuo Li","orcid":"https://orcid.org/0000-0002-3100-9249"},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]},{"id":"https://openalex.org/I4210156936","display_name":"IBM Research - Austin","ror":"https://ror.org/05gjbbg60","country_code":"US","type":"facility","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210114115","https://openalex.org/I4210156936"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Zhuo Li","raw_affiliation_strings":["IBM Austin Research Lab, Austin, TX, USA","IBM Austin Research Laboratories, Austin, TX, USA#TAB#"],"affiliations":[{"raw_affiliation_string":"IBM Austin Research Lab, Austin, TX, USA","institution_ids":["https://openalex.org/I4210156936"]},{"raw_affiliation_string":"IBM Austin Research Laboratories, Austin, TX, USA#TAB#","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5113656006","display_name":"Charles J. Alpert","orcid":null},"institutions":[{"id":"https://openalex.org/I4210156936","display_name":"IBM Research - Austin","ror":"https://ror.org/05gjbbg60","country_code":"US","type":"facility","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210114115","https://openalex.org/I4210156936"]},{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Charles J. Alpert","raw_affiliation_strings":["IBM Austin Research Lab, Austin, TX, USA","IBM Austin Research Laboratories, Austin, TX, USA#TAB#"],"affiliations":[{"raw_affiliation_string":"IBM Austin Research Lab, Austin, TX, USA","institution_ids":["https://openalex.org/I4210156936"]},{"raw_affiliation_string":"IBM Austin Research Laboratories, Austin, TX, USA#TAB#","institution_ids":["https://openalex.org/I1341412227"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5114375267"],"corresponding_institution_ids":["https://openalex.org/I11957088"],"apc_list":null,"apc_paid":null,"fwci":0.9137,"has_fulltext":false,"cited_by_count":15,"citation_normalized_percentile":{"value":0.76680455,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"167","last_page":"174"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7193162441253662},{"id":"https://openalex.org/keywords/very-large-scale-integration","display_name":"Very-large-scale integration","score":0.6899698376655579},{"id":"https://openalex.org/keywords/routing","display_name":"Routing (electronic design automation)","score":0.6647290587425232},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5963032245635986},{"id":"https://openalex.org/keywords/resistive-touchscreen","display_name":"Resistive touchscreen","score":0.5717694163322449},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.5620269775390625},{"id":"https://openalex.org/keywords/node","display_name":"Node (physics)","score":0.4940195679664612},{"id":"https://openalex.org/keywords/component","display_name":"Component (thermodynamics)","score":0.43351489305496216},{"id":"https://openalex.org/keywords/upper-and-lower-bounds","display_name":"Upper and lower bounds","score":0.4181283414363861},{"id":"https://openalex.org/keywords/topology","display_name":"Topology (electrical circuits)","score":0.3528482913970947},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.2506221532821655},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.183488130569458},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.1579430103302002},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1564154326915741},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.1529252529144287},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.11807021498680115},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.11213713884353638},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.10247153043746948}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7193162441253662},{"id":"https://openalex.org/C14580979","wikidata":"https://www.wikidata.org/wiki/Q876049","display_name":"Very-large-scale integration","level":2,"score":0.6899698376655579},{"id":"https://openalex.org/C74172769","wikidata":"https://www.wikidata.org/wiki/Q1446839","display_name":"Routing (electronic design automation)","level":2,"score":0.6647290587425232},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5963032245635986},{"id":"https://openalex.org/C6899612","wikidata":"https://www.wikidata.org/wiki/Q852911","display_name":"Resistive touchscreen","level":2,"score":0.5717694163322449},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.5620269775390625},{"id":"https://openalex.org/C62611344","wikidata":"https://www.wikidata.org/wiki/Q1062658","display_name":"Node (physics)","level":2,"score":0.4940195679664612},{"id":"https://openalex.org/C168167062","wikidata":"https://www.wikidata.org/wiki/Q1117970","display_name":"Component (thermodynamics)","level":2,"score":0.43351489305496216},{"id":"https://openalex.org/C77553402","wikidata":"https://www.wikidata.org/wiki/Q13222579","display_name":"Upper and lower bounds","level":2,"score":0.4181283414363861},{"id":"https://openalex.org/C184720557","wikidata":"https://www.wikidata.org/wiki/Q7825049","display_name":"Topology (electrical circuits)","level":2,"score":0.3528482913970947},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2506221532821655},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.183488130569458},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.1579430103302002},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1564154326915741},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.1529252529144287},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.11807021498680115},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.11213713884353638},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.10247153043746948},{"id":"https://openalex.org/C31972630","wikidata":"https://www.wikidata.org/wiki/Q844240","display_name":"Computer vision","level":1,"score":0.0},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.0},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1145/1514932.1514969","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1514932.1514969","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2009 international symposium on Physical design","raw_type":"proceedings-article"},{"id":"pmh:oai:digitalcommons.mtu.edu:michigantech-p-31796","is_oa":false,"landing_page_url":"https://digitalcommons.mtu.edu/michigantech-p/12494","pdf_url":null,"source":{"id":"https://openalex.org/S4377196391","display_name":"Digital Commons - Michigan Tech (Michigan Technological University)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I11957088","host_organization_name":"Michigan Technological University","host_organization_lineage":["https://openalex.org/I11957088"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Michigan Tech Publications, Part 1","raw_type":"text"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.377.3299","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.377.3299","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www.ece.mtu.edu/faculty/shiyan/HuISPD09.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":17,"referenced_works":["https://openalex.org/W1967474595","https://openalex.org/W1968636796","https://openalex.org/W1971048398","https://openalex.org/W1999938868","https://openalex.org/W2049546399","https://openalex.org/W2061701207","https://openalex.org/W2087275089","https://openalex.org/W2096773724","https://openalex.org/W2113537658","https://openalex.org/W2123316553","https://openalex.org/W2130626677","https://openalex.org/W2137428232","https://openalex.org/W2141907973","https://openalex.org/W2160252016","https://openalex.org/W2162756981","https://openalex.org/W4231119589","https://openalex.org/W4232214728"],"related_works":["https://openalex.org/W2155019192","https://openalex.org/W4283025278","https://openalex.org/W2014709025","https://openalex.org/W2081032080","https://openalex.org/W2134733504","https://openalex.org/W2144460576","https://openalex.org/W4301193134","https://openalex.org/W3111786897","https://openalex.org/W4205718258","https://openalex.org/W1989674257"],"abstract_inverted_index":{"As":[0,17],"VLSI":[1],"technology":[2],"moves":[3],"to":[4,58,62,70],"the":[5,14,37,66,79],"65nm":[6],"node":[7],"and":[8,65,92],"beyond,":[9],"interconnect":[10,22],"delay":[11],"greatly":[12],"limits":[13],"circuit":[15],"performance.":[16],"a":[18,93],"critical":[19],"component":[20],"in":[21,29],"synthesis,":[23],"layer":[24,87],"assignment":[25,88],"manifests":[26],"enormous":[27],"potential":[28],"drastically":[30],"reducing":[31],"wire":[32],"delay.":[33],"This":[34,82],"is":[35,55,69,90,100],"due":[36],"fact":[38],"that":[39],"wires":[40,61],"on":[41,50],"thick":[42,63],"metals":[43,64],"are":[44],"much":[45],"less":[46],"resistive":[47],"than":[48],"those":[49],"thin":[51],"metals.":[52],"Nevertheless,":[53],"it":[54],"not":[56],"desired":[57],"assign":[59],"all":[60],"right":[67],"strategy":[68],"only":[71],"use":[72],"minimal":[73],"thick-metal":[74],"routing":[75],"resources":[76],"for":[77],"meeting":[78],"timing":[80,83],"constraints.":[81],"driven":[84],"minimum":[85],"cost":[86],"problem":[89],"NP-Complete,":[91],"fast":[94],"algorithm":[95],"with":[96],"provable":[97],"approximation":[98],"bound":[99],"highly":[101],"desired.":[102]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":3},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2026-04-04T16:13:02.066488","created_date":"2025-10-10T00:00:00"}