{"id":"https://openalex.org/W1989916619","doi":"https://doi.org/10.1145/1412587.1412590","title":"Investigating the effects of fine-grain three-dimensional integration on microarchitecture design","display_name":"Investigating the effects of fine-grain three-dimensional integration on microarchitecture design","publication_year":2008,"publication_date":"2008-10-01","ids":{"openalex":"https://openalex.org/W1989916619","doi":"https://doi.org/10.1145/1412587.1412590","mag":"1989916619"},"language":"en","primary_location":{"id":"doi:10.1145/1412587.1412590","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1412587.1412590","pdf_url":null,"source":{"id":"https://openalex.org/S96198239","display_name":"ACM Journal on Emerging Technologies in Computing Systems","issn_l":"1550-4832","issn":["1550-4832","1550-4840"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319798","host_organization_name":"Association for Computing Machinery","host_organization_lineage":["https://openalex.org/P4310319798"],"host_organization_lineage_names":["Association for Computing Machinery"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ACM Journal on Emerging Technologies in Computing Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5102025379","display_name":"Yuchun Ma","orcid":"https://orcid.org/0000-0003-3160-6681"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Yuchun Ma","raw_affiliation_strings":["Tsinghua University, Beijing, P. R. China"],"affiliations":[{"raw_affiliation_string":"Tsinghua University, Beijing, P. R. China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101767883","display_name":"Yongxiang Liu","orcid":"https://orcid.org/0000-0002-5428-1077"},"institutions":[{"id":"https://openalex.org/I161318765","display_name":"University of California, Los Angeles","ror":"https://ror.org/046rm7j60","country_code":"US","type":"education","lineage":["https://openalex.org/I161318765"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yongxiang Liu","raw_affiliation_strings":["University of California, Los Angeles, Los Angeles, CA"],"affiliations":[{"raw_affiliation_string":"University of California, Los Angeles, Los Angeles, CA","institution_ids":["https://openalex.org/I161318765"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5034278781","display_name":"Eren Kursun","orcid":null},"institutions":[{"id":"https://openalex.org/I161318765","display_name":"University of California, Los Angeles","ror":"https://ror.org/046rm7j60","country_code":"US","type":"education","lineage":["https://openalex.org/I161318765"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Eren Kursun","raw_affiliation_strings":["University of California, Los Angeles, Los Angeles, CA"],"affiliations":[{"raw_affiliation_string":"University of California, Los Angeles, Los Angeles, CA","institution_ids":["https://openalex.org/I161318765"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5083493225","display_name":"Glenn Reinman","orcid":null},"institutions":[{"id":"https://openalex.org/I161318765","display_name":"University of California, Los Angeles","ror":"https://ror.org/046rm7j60","country_code":"US","type":"education","lineage":["https://openalex.org/I161318765"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Glenn Reinman","raw_affiliation_strings":["University of California, Los Angeles, Los Angeles, CA"],"affiliations":[{"raw_affiliation_string":"University of California, Los Angeles, Los Angeles, CA","institution_ids":["https://openalex.org/I161318765"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5102170602","display_name":"Jason Cong","orcid":null},"institutions":[{"id":"https://openalex.org/I142207940","display_name":"California NanoSystems Institute","ror":"https://ror.org/00q7fqf35","country_code":"US","type":"facility","lineage":["https://openalex.org/I142207940","https://openalex.org/I154570441","https://openalex.org/I161318765"]},{"id":"https://openalex.org/I1341358820","display_name":"Nanosys (United States)","ror":"https://ror.org/05prpy113","country_code":"US","type":"company","lineage":["https://openalex.org/I1341358820"]},{"id":"https://openalex.org/I161318765","display_name":"University of California, Los Angeles","ror":"https://ror.org/046rm7j60","country_code":"US","type":"education","lineage":["https://openalex.org/I161318765"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jason Cong","raw_affiliation_strings":["University of California, Los Angeles, Los Angeles, CA; California Nanosystems Institute","California Nanosystems Institute"],"affiliations":[{"raw_affiliation_string":"University of California, Los Angeles, Los Angeles, CA; California Nanosystems Institute","institution_ids":["https://openalex.org/I142207940","https://openalex.org/I161318765"]},{"raw_affiliation_string":"California Nanosystems Institute","institution_ids":["https://openalex.org/I142207940","https://openalex.org/I1341358820"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5102025379"],"corresponding_institution_ids":["https://openalex.org/I99065089"],"apc_list":null,"apc_paid":null,"fwci":1.695,"has_fulltext":false,"cited_by_count":9,"citation_normalized_percentile":{"value":0.8388348,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":"4","issue":"4","first_page":"1","last_page":"30"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9965999722480774,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microarchitecture","display_name":"Microarchitecture","score":0.8581629991531372},{"id":"https://openalex.org/keywords/floorplan","display_name":"Floorplan","score":0.7941936254501343},{"id":"https://openalex.org/keywords/implementation","display_name":"Implementation","score":0.6373671889305115},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.633374810218811},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.601740300655365},{"id":"https://openalex.org/keywords/physical-design","display_name":"Physical design","score":0.5317296981811523},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.5234044194221497},{"id":"https://openalex.org/keywords/design-space-exploration","display_name":"Design space exploration","score":0.4732906222343445},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.47291383147239685},{"id":"https://openalex.org/keywords/block","display_name":"Block (permutation group theory)","score":0.46196454763412476},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.38063034415245056},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3768211007118225},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3705996870994568},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.34120020270347595},{"id":"https://openalex.org/keywords/circuit-design","display_name":"Circuit design","score":0.34076428413391113},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20135751366615295},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.12928414344787598},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.07897135615348816}],"concepts":[{"id":"https://openalex.org/C107598950","wikidata":"https://www.wikidata.org/wiki/Q259864","display_name":"Microarchitecture","level":2,"score":0.8581629991531372},{"id":"https://openalex.org/C130145326","wikidata":"https://www.wikidata.org/wiki/Q1553985","display_name":"Floorplan","level":2,"score":0.7941936254501343},{"id":"https://openalex.org/C26713055","wikidata":"https://www.wikidata.org/wiki/Q245962","display_name":"Implementation","level":2,"score":0.6373671889305115},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.633374810218811},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.601740300655365},{"id":"https://openalex.org/C188817802","wikidata":"https://www.wikidata.org/wiki/Q13426855","display_name":"Physical design","level":3,"score":0.5317296981811523},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.5234044194221497},{"id":"https://openalex.org/C2776221188","wikidata":"https://www.wikidata.org/wiki/Q21072556","display_name":"Design space exploration","level":2,"score":0.4732906222343445},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.47291383147239685},{"id":"https://openalex.org/C2777210771","wikidata":"https://www.wikidata.org/wiki/Q4927124","display_name":"Block (permutation group theory)","level":2,"score":0.46196454763412476},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.38063034415245056},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3768211007118225},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3705996870994568},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.34120020270347595},{"id":"https://openalex.org/C190560348","wikidata":"https://www.wikidata.org/wiki/Q3245116","display_name":"Circuit design","level":2,"score":0.34076428413391113},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20135751366615295},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.12928414344787598},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.07897135615348816},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1145/1412587.1412590","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1412587.1412590","pdf_url":null,"source":{"id":"https://openalex.org/S96198239","display_name":"ACM Journal on Emerging Technologies in Computing Systems","issn_l":"1550-4832","issn":["1550-4832","1550-4840"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319798","host_organization_name":"Association for Computing Machinery","host_organization_lineage":["https://openalex.org/P4310319798"],"host_organization_lineage_names":["Association for Computing Machinery"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ACM Journal on Emerging Technologies in Computing Systems","raw_type":"journal-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.159.9230","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.159.9230","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://ballade.cs.ucla.edu/~cong/papers/JETC-4.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.6100000143051147}],"awards":[{"id":"https://openalex.org/G1659186129","display_name":null,"funder_award_id":"CCR-0096383CCF-0430077CCF-0530261NSFC 60606007","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"},{"id":"https://openalex.org/G4092632697","display_name":null,"funder_award_id":"CCR-0096383CCF-0430077CCF-0530261NSFC 60606007","funder_id":"https://openalex.org/F4320337387","funder_display_name":"Division of Computing and Communication Foundations"},{"id":"https://openalex.org/G915910373","display_name":null,"funder_award_id":"JC20070021","funder_id":"https://openalex.org/F4320322392","funder_display_name":"Tsinghua University"}],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"},{"id":"https://openalex.org/F4320322392","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549"},{"id":"https://openalex.org/F4320337387","display_name":"Division of Computing and Communication Foundations","ror":"https://ror.org/01mng8331"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":53,"referenced_works":["https://openalex.org/W118432253","https://openalex.org/W1512475422","https://openalex.org/W1541633348","https://openalex.org/W1544642978","https://openalex.org/W1556752523","https://openalex.org/W1666750238","https://openalex.org/W1826768222","https://openalex.org/W1949410241","https://openalex.org/W1971201733","https://openalex.org/W1977873933","https://openalex.org/W1987131925","https://openalex.org/W2002041333","https://openalex.org/W2009795871","https://openalex.org/W2025331063","https://openalex.org/W2046574526","https://openalex.org/W2052274298","https://openalex.org/W2063740797","https://openalex.org/W2071003187","https://openalex.org/W2105977039","https://openalex.org/W2106149819","https://openalex.org/W2106240397","https://openalex.org/W2119416693","https://openalex.org/W2120914420","https://openalex.org/W2121050483","https://openalex.org/W2121098912","https://openalex.org/W2123170006","https://openalex.org/W2123859688","https://openalex.org/W2127012874","https://openalex.org/W2129507101","https://openalex.org/W2129760904","https://openalex.org/W2130517400","https://openalex.org/W2131413854","https://openalex.org/W2141104258","https://openalex.org/W2141736089","https://openalex.org/W2143807959","https://openalex.org/W2144149750","https://openalex.org/W2145135695","https://openalex.org/W2151734895","https://openalex.org/W2153215457","https://openalex.org/W2154941994","https://openalex.org/W2156174665","https://openalex.org/W2158921969","https://openalex.org/W2161864047","https://openalex.org/W2174898847","https://openalex.org/W2183935829","https://openalex.org/W2603178913","https://openalex.org/W2911267893","https://openalex.org/W2911831466","https://openalex.org/W3139689176","https://openalex.org/W3148607552","https://openalex.org/W4237131533","https://openalex.org/W4250395788","https://openalex.org/W4391902753"],"related_works":["https://openalex.org/W1990789187","https://openalex.org/W2013391748","https://openalex.org/W1965050610","https://openalex.org/W1757458251","https://openalex.org/W2138401961","https://openalex.org/W2150542224","https://openalex.org/W3150489614","https://openalex.org/W1989916619","https://openalex.org/W2129188682","https://openalex.org/W2168527127"],"abstract_inverted_index":{"In":[0],"this":[1],"article":[2],"we":[3],"propose":[4],"techniques":[5,164],"that":[6],"enable":[7],"efficient":[8,84],"exploration":[9],"of":[10,53,97,110,122,149],"the":[11,41,90,104,155,169],"3D":[12,27,65,141,150],"design":[13,59,67,82,107,120],"space,":[14],"where":[15],"each":[16],"logical":[17],"block":[18],"can":[19,76],"span":[20],"more":[21],"than":[22],"one":[23],"silicon":[24],"layer.":[25],"Fine-grain":[26],"integration":[28],"provides":[29],"reduced":[30],"intrablock":[31],"wire":[32],"delay":[33],"as":[34,36],"well":[35],"improved":[37],"power":[38,43],"consumption.":[39],"However,":[40],"corresponding":[42],"and":[44,60,80,138,160],"performance":[45,130],"advantage":[46],"is":[47],"usually":[48],"underutilized,":[49],"since":[50],"various":[51],"implementations":[52,101],"multilayer":[54,100],"blocks":[55],"require":[56],"novel":[57],"physical":[58,79],"microarchitecture":[61,66],"infrastructure":[62],"to":[63,102,167],"explore":[64],"space.":[68],"We":[69],"develop":[70],"a":[71,95,119,123,128],"cubic":[72],"packing":[73],"engine":[74],"which":[75],"simultaneously":[77],"optimize":[78],"architectural":[81],"for":[83,135],"vertical":[85],"integration.":[86],"This":[87],"technique":[88],"selects":[89],"individual":[91],"unit":[92,144],"designs":[93],"from":[94],"set":[96],"single-layer":[98,143],"or":[99,113],"get":[103],"best":[105],"microarchitectural":[106],"in":[108],"terms":[109],"performance,":[111],"temperature,":[112],"both.":[114],"Our":[115],"experimental":[116],"results":[117],"using":[118],"driver":[121],"high-performance":[124],"superscalar":[125],"processor":[126],"show":[127],"36%":[129],"improvement":[131],"over":[132,140],"traditional":[133],"2D":[134],"2--4":[136],"layers":[137],"14%":[139],"with":[142],"implementations.":[145],"Since":[146],"thermal":[147,161],"characteristics":[148],"integrated":[151],"circuits":[152],"are":[153,165],"among":[154],"main":[156],"challenges,":[157],"thermal-aware":[158],"floorplanning":[159],"via":[162],"insertion":[163],"employed":[166],"keep":[168],"peak":[170],"temperatures":[171],"below":[172],"threshold.":[173]},"counts_by_year":[{"year":2016,"cited_by_count":1},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":2}],"updated_date":"2026-04-05T17:49:38.594831","created_date":"2025-10-10T00:00:00"}