{"id":"https://openalex.org/W1976979352","doi":"https://doi.org/10.1145/1393921.1393922","title":"Towards a green electronic world","display_name":"Towards a green electronic world","publication_year":2008,"publication_date":"2008-01-01","ids":{"openalex":"https://openalex.org/W1976979352","doi":"https://doi.org/10.1145/1393921.1393922","mag":"1976979352"},"language":"en","primary_location":{"id":"doi:10.1145/1393921.1393922","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1393921.1393922","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceeding of the thirteenth international symposium on Low power electronics and design - ISLPED '08","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5111973586","display_name":"Jaswinder Ahuja","orcid":null},"institutions":[{"id":"https://openalex.org/I66217453","display_name":"Cadence Design Systems (United States)","ror":"https://ror.org/04w8xa018","country_code":"US","type":"company","lineage":["https://openalex.org/I66217453"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Jaswinder Ahuja","raw_affiliation_strings":["Cadence Design Systems, Inc. Noida, India"],"affiliations":[{"raw_affiliation_string":"Cadence Design Systems, Inc. Noida, India","institution_ids":["https://openalex.org/I66217453"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5111973586"],"corresponding_institution_ids":["https://openalex.org/I66217453"],"apc_list":null,"apc_paid":null,"fwci":0.3329,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.61064826,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"2"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.948199987411499,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.948199987411499,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10904","display_name":"Embedded Systems Design Techniques","score":0.9358999729156494,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12238","display_name":"Green IT and Sustainability","score":0.9254000186920166,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4707900583744049}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4707900583744049}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/1393921.1393922","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1393921.1393922","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceeding of the thirteenth international symposium on Low power electronics and design - ISLPED '08","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.5799999833106995,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W2358668433","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W2382290278","https://openalex.org/W2350741829","https://openalex.org/W2130043461","https://openalex.org/W2530322880"],"abstract_inverted_index":{"Summary":[0],"form":[1],"only":[2],"given.":[3],"Increasing":[4],"power":[5,48,63,81,105,112],"density":[6],"of":[7,15,33,56,122],"complex":[8],"SoC's":[9],"have":[10,28],"made":[11],"low-power":[12,123],"a":[13,30,84,100,109],"topic":[14],"interest":[16],"in":[17,22,45],"the":[18,66,88,117,126,130],"industry.":[19],"Power":[20],"considerations":[21,55],"portable":[23],"and":[24,41,59,91,120],"wireless":[25],"consumer":[26],"devices":[27,40],"become":[29],"key":[31],"part":[32],"many":[34],"product":[35],"specifications.":[36],"Even":[37],"for":[38,116],"wired":[39],"other":[42],"industry":[43,133],"segments":[44],"which":[46],"battery":[47],"has":[49],"not":[50],"traditionally":[51],"been":[52],"an":[53,136],"issue,":[54],"packaging,":[57],"reliability,":[58],"cooling":[60],"costs":[61],"brings":[62],"firmly":[64],"to":[65,76,102],"forefront":[67],"at":[68],"smaller":[69],"geometries.":[70],"In":[71],"particular,":[72],"as":[73],"designs":[74],"migrate":[75],"sub-90":[77],"nm":[78],"process":[79],"nodes,":[80],"management":[82],"becomes":[83],"serious":[85],"concern":[86],"across":[87,129],"entire":[89],"design":[90,96,131],"manufacturing":[92],"chain.":[93],"To":[94],"help":[95],"teams,":[97],"there":[98],"is":[99,114,135],"need":[101],"adopt":[103],"advanced":[104],"reduction":[106],"techniques,":[107],"where":[108],"complete":[110],"low":[111],"solution":[113],"needed":[115],"design,":[118],"verification,":[119],"implementation":[121],"chips.":[124],"Since":[125],"challenge":[127],"spans":[128],"chain,":[132],"collaboration":[134],"imperative.":[137]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}
