{"id":"https://openalex.org/W2172033327","doi":"https://doi.org/10.1145/1278480.1278612","title":"An analysis of timing violations due to spatially distributed thermal effects in global wires","display_name":"An analysis of timing violations due to spatially distributed thermal effects in global wires","publication_year":2007,"publication_date":"2007-01-01","ids":{"openalex":"https://openalex.org/W2172033327","doi":"https://doi.org/10.1145/1278480.1278612","mag":"2172033327"},"language":"en","primary_location":{"id":"doi:10.1145/1278480.1278612","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1278480.1278612","pdf_url":null,"source":{"id":"https://openalex.org/S4210231368","display_name":"Proceedings - ACM IEEE Design Automation Conference","issn_l":"0738-100X","issn":["0738-100X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319798","host_organization_name":"Association for Computing Machinery","host_organization_lineage":["https://openalex.org/P4310319798"],"host_organization_lineage_names":["Association for Computing Machinery"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 44th annual conference on Design automation - DAC '07","raw_type":"proceedings-article"},"type":"conference-abstract","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5046074471","display_name":"K. Sundaresan","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Krishnan Sundaresan","raw_affiliation_strings":["Sun Microsystems, Inc., Sunnyvale, CA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Sun Microsystems, Inc., Sunnyvale, CA","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5108624212","display_name":"Nihar R. Mahapatra","orcid":"https://orcid.org/0000-0002-3821-3330"},"institutions":[{"id":"https://openalex.org/I87216513","display_name":"Michigan State University","ror":"https://ror.org/05hs6h993","country_code":"US","type":"education","lineage":["https://openalex.org/I87216513"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Nihar R. Mahapatra","raw_affiliation_strings":["Michigan State University, East Lansing, MI"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Michigan State University, East Lansing, MI","institution_ids":["https://openalex.org/I87216513"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":9,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"515","last_page":"515"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6458841562271118},{"id":"https://openalex.org/keywords/joule-heating","display_name":"Joule heating","score":0.5650988221168518},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.536976158618927},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4655488431453705},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.4491743743419647},{"id":"https://openalex.org/keywords/node","display_name":"Node (physics)","score":0.4193829596042633},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3749849200248718},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3631610870361328},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.32958516478538513},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.24347779154777527},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.18272638320922852},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.15667223930358887},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.11004769802093506}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6458841562271118},{"id":"https://openalex.org/C117926987","wikidata":"https://www.wikidata.org/wiki/Q210009","display_name":"Joule heating","level":2,"score":0.5650988221168518},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.536976158618927},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4655488431453705},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.4491743743419647},{"id":"https://openalex.org/C62611344","wikidata":"https://www.wikidata.org/wiki/Q1062658","display_name":"Node (physics)","level":2,"score":0.4193829596042633},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3749849200248718},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3631610870361328},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.32958516478538513},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.24347779154777527},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.18272638320922852},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.15667223930358887},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.11004769802093506},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/1278480.1278612","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1278480.1278612","pdf_url":null,"source":{"id":"https://openalex.org/S4210231368","display_name":"Proceedings - ACM IEEE Design Automation Conference","issn_l":"0738-100X","issn":["0738-100X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319798","host_organization_name":"Association for Computing Machinery","host_organization_lineage":["https://openalex.org/P4310319798"],"host_organization_lineage_names":["Association for Computing Machinery"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 44th annual conference on Design automation - DAC '07","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.6000000238418579}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":12,"referenced_works":["https://openalex.org/W1990333732","https://openalex.org/W2032094184","https://openalex.org/W2104984156","https://openalex.org/W2110090002","https://openalex.org/W2132816157","https://openalex.org/W2145289226","https://openalex.org/W2151025435","https://openalex.org/W2153128082","https://openalex.org/W2153456949","https://openalex.org/W2165071510","https://openalex.org/W2167848093","https://openalex.org/W2171365326"],"related_works":["https://openalex.org/W2291049038","https://openalex.org/W2591896032","https://openalex.org/W2471196634","https://openalex.org/W1998675521","https://openalex.org/W2091286720","https://openalex.org/W2155019192","https://openalex.org/W2014709025","https://openalex.org/W2008827750","https://openalex.org/W4232392699","https://openalex.org/W2000595253"],"abstract_inverted_index":{"Higher-than-normal":[0],"wire":[1,14,31,43],"temperatures":[2,44,71],"and":[3,9,22,45,100,125],"temperature":[4],"gradients":[5],"between":[6],"the":[7,26,85,103,108,152,156],"sending":[8],"receiving":[10],"ends":[11],"of":[12,29,145],"a":[13,30,38,64,94],"that":[15,58],"are":[16,67],"caused":[17],"due":[18],"to":[19,41,69,142],"Joule":[20],"heating":[21],"substrate":[23],"hotspots":[24],"affect":[25],"propagation":[27],"delay":[28,46],"significantly.":[32],"In":[33],"this":[34],"paper,":[35],"we":[36],"develop":[37],"high-level":[39],"model":[40,56],"track":[42],"variability":[47],"during":[48,90],"early":[49],"stage":[50],"design":[51],"exploration.":[52],"Results":[53],"using":[54],"our":[55],"show":[57],"ALU":[59,109],"result":[60,110],"bus":[61,123,135,149],"wires":[62],"in":[63,77,107,137],"4-issue":[65],"processor":[66,96,154],"likely":[68],"reach":[70],"as":[72,74,129,131],"high":[73,130],"103\u00b0C":[75],"(117\u00b0C)":[76],"130-nm":[78,95],"(45-nm)":[79],"technology":[80,158],"which":[81],"is":[82,119],"greater":[83],"than":[84],"100\u00b0C":[86],"maximum":[87],"normally":[88],"assumed":[89],"interconnect":[91],"design.":[92],"For":[93],"with":[97],"no":[98],"power":[99],"thermal":[101],"management,":[102],"temperature-induced":[104],"timing":[105],"violations":[106],"bus,":[111],"on":[112],"average":[113,144],"across":[114],"ten":[115],"SPEC":[116],"CPU2K":[117],"benchmarks,":[118],"2.27":[120],"per":[121,133,147],"hundred":[122,134,148],"references":[124,136,150],"it":[126],"can":[127],"be":[128],"4.91":[132],"some":[138],"programs.":[139],"It":[140],"increases":[141],"an":[143],"6.20":[146],"for":[151],"same":[153],"at":[155],"45-nm":[157],"node.":[159]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}