{"id":"https://openalex.org/W2098571191","doi":"https://doi.org/10.1145/1233501.1233639","title":"Fill for shallow trench isolation CMP","display_name":"Fill for shallow trench isolation CMP","publication_year":2006,"publication_date":"2006-01-01","ids":{"openalex":"https://openalex.org/W2098571191","doi":"https://doi.org/10.1145/1233501.1233639","mag":"2098571191"},"language":"en","primary_location":{"id":"doi:10.1145/1233501.1233639","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1233501.1233639","pdf_url":null,"source":{"id":"https://openalex.org/S4210177401","display_name":"Digest of technical papers/Digest of technical papers - IEEE/ACM International Conference on Computer-Aided Design","issn_l":"1092-3152","issn":["1092-3152","1558-2434"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319798","host_organization_name":"Association for Computing Machinery","host_organization_lineage":["https://openalex.org/P4310319798"],"host_organization_lineage_names":["Association for Computing Machinery"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design  - ICCAD '06","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5073558386","display_name":"Andrew B. Kahng","orcid":"https://orcid.org/0000-0002-4490-5018"},"institutions":[{"id":"https://openalex.org/I36258959","display_name":"University of California, San Diego","ror":"https://ror.org/0168r3w48","country_code":"US","type":"education","lineage":["https://openalex.org/I36258959"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Andrew B. Kahng","raw_affiliation_strings":["Blaze DFM Inc., Sunnyvale, CA; CSE Department, University of California at San Diego; ECE Department, University of California at San Diego, abk@cs.ucsd.edu"],"affiliations":[{"raw_affiliation_string":"Blaze DFM Inc., Sunnyvale, CA; CSE Department, University of California at San Diego; ECE Department, University of California at San Diego, abk@cs.ucsd.edu","institution_ids":["https://openalex.org/I36258959"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5114889173","display_name":"Puneet Sharma","orcid":"https://orcid.org/0009-0004-6271-8031"},"institutions":[{"id":"https://openalex.org/I36258959","display_name":"University of California, San Diego","ror":"https://ror.org/0168r3w48","country_code":"US","type":"education","lineage":["https://openalex.org/I36258959"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Puneet Sharma","raw_affiliation_strings":["ECE Department, University of California at San Diego, sharma@ucsd.edu"],"affiliations":[{"raw_affiliation_string":"ECE Department, University of California at San Diego, sharma@ucsd.edu","institution_ids":["https://openalex.org/I36258959"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5072751459","display_name":"Alex Zelikovsky","orcid":"https://orcid.org/0000-0003-4424-4691"},"institutions":[{"id":"https://openalex.org/I181565077","display_name":"Georgia State University","ror":"https://ror.org/03qt6ba18","country_code":"US","type":"education","lineage":["https://openalex.org/I181565077"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Alexander Zelikovsky","raw_affiliation_strings":["CS Department, Georgia State University, alexz@cs.gsu.edu"],"affiliations":[{"raw_affiliation_string":"CS Department, Georgia State University, alexz@cs.gsu.edu","institution_ids":["https://openalex.org/I181565077"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5073558386"],"corresponding_institution_ids":["https://openalex.org/I36258959"],"apc_list":null,"apc_paid":null,"fwci":1.7295,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.84615385,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"661","last_page":"661"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/shallow-trench-isolation","display_name":"Shallow trench isolation","score":0.7858178615570068},{"id":"https://openalex.org/keywords/trench","display_name":"Trench","score":0.6646478772163391},{"id":"https://openalex.org/keywords/isolation","display_name":"Isolation (microbiology)","score":0.5873244404792786},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.437531054019928},{"id":"https://openalex.org/keywords/geology","display_name":"Geology","score":0.38655832409858704},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.2566121816635132},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.07091730833053589}],"concepts":[{"id":"https://openalex.org/C105066941","wikidata":"https://www.wikidata.org/wiki/Q1424524","display_name":"Shallow trench isolation","level":4,"score":0.7858178615570068},{"id":"https://openalex.org/C155310634","wikidata":"https://www.wikidata.org/wiki/Q1852785","display_name":"Trench","level":3,"score":0.6646478772163391},{"id":"https://openalex.org/C2775941552","wikidata":"https://www.wikidata.org/wiki/Q25212305","display_name":"Isolation (microbiology)","level":2,"score":0.5873244404792786},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.437531054019928},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.38655832409858704},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2566121816635132},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.07091730833053589},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C89423630","wikidata":"https://www.wikidata.org/wiki/Q7193","display_name":"Microbiology","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":4,"locations":[{"id":"doi:10.1145/1233501.1233639","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1233501.1233639","pdf_url":null,"source":{"id":"https://openalex.org/S4210177401","display_name":"Digest of technical papers/Digest of technical papers - IEEE/ACM International Conference on Computer-Aided Design","issn_l":"1092-3152","issn":["1092-3152","1558-2434"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319798","host_organization_name":"Association for Computing Machinery","host_organization_lineage":["https://openalex.org/P4310319798"],"host_organization_lineage_names":["Association for Computing Machinery"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design  - ICCAD '06","raw_type":"proceedings-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.120.6519","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.120.6519","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://suez.cs.gsu.edu/~cscazz/postscript/iccad06.pdf","raw_type":"text"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.259.2453","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.259.2453","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www.cecs.uci.edu/%7Epapers/iccad06/papers/9A_2.pdf","raw_type":"text"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.87.2549","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.87.2549","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://vlsicad.ucsd.edu/Publications/Conferences/231/c231.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W50466776","https://openalex.org/W2037974844","https://openalex.org/W2099124382","https://openalex.org/W2118653668","https://openalex.org/W2123973955","https://openalex.org/W2128613910","https://openalex.org/W2142928176","https://openalex.org/W4285719527"],"related_works":["https://openalex.org/W2006928005","https://openalex.org/W2119814266","https://openalex.org/W2749871982","https://openalex.org/W2140756430","https://openalex.org/W2104314732","https://openalex.org/W2188624265","https://openalex.org/W1992381812","https://openalex.org/W2101111387","https://openalex.org/W1507517533","https://openalex.org/W1869246841"],"abstract_inverted_index":{"Shallow":[0],"trench":[1],"isolation":[2,8],"(STI)":[3],"is":[4,55,70,73,100,131,147,170,179],"the":[5,104,151,157,162,166,198,206],"mainstream":[6],"CMOS":[7],"technology.":[9],"It":[10],"uses":[11],"chemical":[12],"mechanical":[13],"planarization":[14,81,207],"(CMP)":[15],"to":[16,57,78,84,133,185,217,233],"remove":[17],"excess":[18],"of":[19],"deposited":[20],"oxide":[21,118,135,139,153,167,231],"and":[22,49,61,72,122,175,204,222],"attain":[23,79],"a":[24,143],"planar":[25],"surface":[26],"for":[27,115],"successive":[28],"process":[29],"steps.":[30],"Despite":[31],"advances":[32],"in":[33,47,95,211,229],"STI":[34,93],"CMP":[35,94,195],"technology,":[36],"pattern":[37,59],"dependencies":[38],"cause":[39],"large":[40,164],"post-CMP":[41,64,191,230],"topography":[42,65],"variation":[43,60,120,169],"that":[44,137,149],"can":[45,214],"result":[46],"functional":[48],"parametric":[50],"yield":[51],"loss.":[52],"Fill":[53],"insertion":[54,69,98,145],"used":[56,74,132],"reduce":[58],"consequently":[62],"decrease":[63,234],"variation.":[66,141],"Traditional":[67],"fill":[68,97,116,144,187],"rulebased":[71],"with":[75,88,201],"reverse":[76,89],"etchback":[77],"desired":[80],"quality.":[82],"Due":[83],"extra":[85],"costs":[86],"associated":[87],"etchback,":[90],"\u201csingle-step":[91],"\u201d":[92],"which":[96,212],"suffices":[99],"desirable.":[101],"To":[102,189],"alleviate":[103],"failures":[105],"caused":[106],"by":[107,172,181,219,235],"imperfect":[108],"CMP,":[109],"we":[110,193],"focus":[111],"on":[112,197],"two":[113,163],"objectives":[114],"insertion:":[117],"density":[119,124,140,154,168,178],"minimization":[121],"nitride":[123,158,177],"maximization.":[125],"A":[126],"linear":[127],"programming":[128],"based":[129],"optimization":[130],"calculate":[134],"densities":[136],"minimize":[138],"Next":[142],"methodology":[146],"presented":[148],"attains":[150],"calculated":[152],"while":[155],"maximizing":[156],"density.":[159],"Averaged":[160],"over":[161],"testcases,":[165],"reduced":[171],"63":[173],"%":[174,183,221],"minimum":[176],"increased":[180],"79":[182],"compared":[184],"tiling-based":[186],"insertion.":[188],"assess":[190],"planarization,":[192],"run":[194],"simulation":[196],"layout":[199],"filled":[200],"our":[202],"approach":[203],"find":[205],"window":[208,210],"(time":[209],"polishing":[213],"be":[215],"stopped)":[216],"increase":[218],"17":[220],"maximum":[223],"final":[224],"step":[225],"height":[226],"(maximum":[227],"difference":[228],"thickness)":[232],"9%.":[236]},"counts_by_year":[],"updated_date":"2026-04-05T17:49:38.594831","created_date":"2025-10-10T00:00:00"}