{"id":"https://openalex.org/W2125491806","doi":"https://doi.org/10.1145/1233501.1233619","title":"Adaptive multi-domain thermal modeling and analysis for integrated circuit synthesis and design","display_name":"Adaptive multi-domain thermal modeling and analysis for integrated circuit synthesis and design","publication_year":2006,"publication_date":"2006-01-01","ids":{"openalex":"https://openalex.org/W2125491806","doi":"https://doi.org/10.1145/1233501.1233619","mag":"2125491806"},"language":"en","primary_location":{"id":"doi:10.1145/1233501.1233619","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1233501.1233619","pdf_url":null,"source":{"id":"https://openalex.org/S4210177401","display_name":"Digest of technical papers/Digest of technical papers - IEEE/ACM International Conference on Computer-Aided Design","issn_l":"1092-3152","issn":["1092-3152","1558-2434"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319798","host_organization_name":"Association for Computing Machinery","host_organization_lineage":["https://openalex.org/P4310319798"],"host_organization_lineage_names":["Association for Computing Machinery"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design  - ICCAD '06","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101962652","display_name":"Yonghong Yang","orcid":"https://orcid.org/0000-0003-3092-7213"},"institutions":[{"id":"https://openalex.org/I204722609","display_name":"Queen's University","ror":"https://ror.org/02y72wh86","country_code":"CA","type":"education","lineage":["https://openalex.org/I204722609"]}],"countries":["CA"],"is_corresponding":true,"raw_author_name":"Yonghong Yang","raw_affiliation_strings":["Queen's University, Kingston, ON, Canada","[Dept. of Electr. & Comput. Eng., Queen's Univ., Kingston, Ont.]"],"affiliations":[{"raw_affiliation_string":"Queen's University, Kingston, ON, Canada","institution_ids":["https://openalex.org/I204722609"]},{"raw_affiliation_string":"[Dept. of Electr. & Comput. Eng., Queen's Univ., Kingston, Ont.]","institution_ids":["https://openalex.org/I204722609"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5042667184","display_name":"Changyun Zhu","orcid":null},"institutions":[{"id":"https://openalex.org/I204722609","display_name":"Queen's University","ror":"https://ror.org/02y72wh86","country_code":"CA","type":"education","lineage":["https://openalex.org/I204722609"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Changyun Zhu","raw_affiliation_strings":["Queen's University, Kingston, ON, Canada","[Dept. of Electr. & Comput. Eng., Queen's Univ., Kingston, Ont.]"],"affiliations":[{"raw_affiliation_string":"Queen's University, Kingston, ON, Canada","institution_ids":["https://openalex.org/I204722609"]},{"raw_affiliation_string":"[Dept. of Electr. & Comput. Eng., Queen's Univ., Kingston, Ont.]","institution_ids":["https://openalex.org/I204722609"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5077467778","display_name":"Zhenyu Gu","orcid":"https://orcid.org/0000-0002-7888-7890"},"institutions":[{"id":"https://openalex.org/I111979921","display_name":"Northwestern University","ror":"https://ror.org/000e0be47","country_code":"US","type":"education","lineage":["https://openalex.org/I111979921"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Zhenyu (Peter) Gu","raw_affiliation_strings":["Northwestern University, Evanston, IL","Northwestern University Evanston IL"],"affiliations":[{"raw_affiliation_string":"Northwestern University, Evanston, IL","institution_ids":["https://openalex.org/I111979921"]},{"raw_affiliation_string":"Northwestern University Evanston IL","institution_ids":["https://openalex.org/I111979921"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5004722925","display_name":"Li Shang","orcid":"https://orcid.org/0000-0003-3944-7531"},"institutions":[{"id":"https://openalex.org/I204722609","display_name":"Queen's University","ror":"https://ror.org/02y72wh86","country_code":"CA","type":"education","lineage":["https://openalex.org/I204722609"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Li Shang","raw_affiliation_strings":["Queen's University, Kingston, ON, Canada","Queen's Univ., Kingston, ON (Canada)"],"affiliations":[{"raw_affiliation_string":"Queen's University, Kingston, ON, Canada","institution_ids":["https://openalex.org/I204722609"]},{"raw_affiliation_string":"Queen's Univ., Kingston, ON (Canada)","institution_ids":["https://openalex.org/I204722609"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5068224304","display_name":"Robert P. Dick","orcid":"https://orcid.org/0000-0001-5428-9530"},"institutions":[{"id":"https://openalex.org/I111979921","display_name":"Northwestern University","ror":"https://ror.org/000e0be47","country_code":"US","type":"education","lineage":["https://openalex.org/I111979921"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Robert P. Dick","raw_affiliation_strings":["Northwestern University, Evanston, IL","Northwestern University Evanston IL"],"affiliations":[{"raw_affiliation_string":"Northwestern University, Evanston, IL","institution_ids":["https://openalex.org/I111979921"]},{"raw_affiliation_string":"Northwestern University Evanston IL","institution_ids":["https://openalex.org/I111979921"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5101962652"],"corresponding_institution_ids":["https://openalex.org/I204722609"],"apc_list":null,"apc_paid":null,"fwci":3.7609,"has_fulltext":false,"cited_by_count":37,"citation_normalized_percentile":{"value":0.93131446,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"575","last_page":"575"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5521133542060852},{"id":"https://openalex.org/keywords/thermal-analysis","display_name":"Thermal analysis","score":0.5079851746559143},{"id":"https://openalex.org/keywords/discrete-circuit","display_name":"Discrete circuit","score":0.45640385150909424},{"id":"https://openalex.org/keywords/integrated-circuit-design","display_name":"Integrated circuit design","score":0.43944287300109863},{"id":"https://openalex.org/keywords/circuit-design","display_name":"Circuit design","score":0.424378901720047},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.40628674626350403},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3559145927429199},{"id":"https://openalex.org/keywords/equivalent-circuit","display_name":"Equivalent circuit","score":0.2841368317604065},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.22616630792617798},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.19609183073043823},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.14860206842422485},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.10329395532608032},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.08337482810020447}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5521133542060852},{"id":"https://openalex.org/C129446986","wikidata":"https://www.wikidata.org/wiki/Q542419","display_name":"Thermal analysis","level":3,"score":0.5079851746559143},{"id":"https://openalex.org/C188058453","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Discrete circuit","level":4,"score":0.45640385150909424},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.43944287300109863},{"id":"https://openalex.org/C190560348","wikidata":"https://www.wikidata.org/wiki/Q3245116","display_name":"Circuit design","level":2,"score":0.424378901720047},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.40628674626350403},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3559145927429199},{"id":"https://openalex.org/C23572009","wikidata":"https://www.wikidata.org/wiki/Q964981","display_name":"Equivalent circuit","level":3,"score":0.2841368317604065},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.22616630792617798},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.19609183073043823},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.14860206842422485},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.10329395532608032},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.08337482810020447},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/1233501.1233619","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1233501.1233619","pdf_url":null,"source":{"id":"https://openalex.org/S4210177401","display_name":"Digest of technical papers/Digest of technical papers - IEEE/ACM International Conference on Computer-Aided Design","issn_l":"1092-3152","issn":["1092-3152","1558-2434"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319798","host_organization_name":"Association for Computing Machinery","host_organization_lineage":["https://openalex.org/P4310319798"],"host_organization_lineage_names":["Association for Computing Machinery"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design  - ICCAD '06","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.4699999988079071}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W1494160854","https://openalex.org/W1506727139","https://openalex.org/W1530872699","https://openalex.org/W1538951169","https://openalex.org/W2040832766","https://openalex.org/W2048649163","https://openalex.org/W2104086123","https://openalex.org/W2111887248","https://openalex.org/W2128515395","https://openalex.org/W2132820637","https://openalex.org/W2146765961","https://openalex.org/W2154857344","https://openalex.org/W2158343256","https://openalex.org/W2168138998"],"related_works":["https://openalex.org/W2390607226","https://openalex.org/W2355158303","https://openalex.org/W4200015010","https://openalex.org/W4387986196","https://openalex.org/W1668877707","https://openalex.org/W2074653506","https://openalex.org/W4237655007","https://openalex.org/W3166836537","https://openalex.org/W2393658466","https://openalex.org/W2081795747"],"abstract_inverted_index":{"Chip-package":[0],"thermal":[1,22],"analysis":[2,23],"is":[3],"necessary":[4],"for":[5],"the":[6],"design":[7],"and":[8,35],"synthesis":[9,34],"of":[10,20],"reliable,":[11],"high-performance,":[12],"low-power,":[13],"compact":[14],"integrated":[15],"circuits":[16],"(ICs).":[17],"Many":[18],"methods":[19],"IC":[21,33],"suffer":[24],"performance":[25],"or":[26],"accuracy":[27],"problems":[28],"that":[29],"prevent":[30],"use":[31,37],"in":[32,38],"hinder":[36],"architectural":[39],"design.":[40]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":3},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":2},{"year":2012,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}