{"id":"https://openalex.org/W1970255480","doi":"https://doi.org/10.1145/1233501.1233588","title":"Thermal sensor allocation and placement for reconfigurable systems","display_name":"Thermal sensor allocation and placement for reconfigurable systems","publication_year":2006,"publication_date":"2006-01-01","ids":{"openalex":"https://openalex.org/W1970255480","doi":"https://doi.org/10.1145/1233501.1233588","mag":"1970255480"},"language":"en","primary_location":{"id":"doi:10.1145/1233501.1233588","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1233501.1233588","pdf_url":null,"source":{"id":"https://openalex.org/S4210177401","display_name":"Digest of technical papers/Digest of technical papers - IEEE/ACM International Conference on Computer-Aided Design","issn_l":"1092-3152","issn":["1092-3152","1558-2434"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319798","host_organization_name":"Association for Computing Machinery","host_organization_lineage":["https://openalex.org/P4310319798"],"host_organization_lineage_names":["Association for Computing Machinery"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design  - ICCAD '06","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5013076039","display_name":"Rajarshi Mukherjee","orcid":"https://orcid.org/0000-0002-5761-8958"},"institutions":[{"id":"https://openalex.org/I4210088951","display_name":"Synopsys (United States)","ror":"https://ror.org/013by2m91","country_code":"US","type":"company","lineage":["https://openalex.org/I4210088951"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Rajarshi Mukherjee","raw_affiliation_strings":["Synopsys, Inc., Mountain View, CA, 94043"],"affiliations":[{"raw_affiliation_string":"Synopsys, Inc., Mountain View, CA, 94043","institution_ids":["https://openalex.org/I4210088951"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103540413","display_name":"Somsubhra Mondal","orcid":null},"institutions":[{"id":"https://openalex.org/I111979921","display_name":"Northwestern University","ror":"https://ror.org/000e0be47","country_code":"US","type":"education","lineage":["https://openalex.org/I111979921"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Somsubhra Mondal","raw_affiliation_strings":["Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL 60208"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL 60208","institution_ids":["https://openalex.org/I111979921"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5111716641","display_name":"Seda \u00d6\u01e7renci Memik","orcid":null},"institutions":[{"id":"https://openalex.org/I111979921","display_name":"Northwestern University","ror":"https://ror.org/000e0be47","country_code":"US","type":"education","lineage":["https://openalex.org/I111979921"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Seda Ogrenci Memik","raw_affiliation_strings":["Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL 60208"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL 60208","institution_ids":["https://openalex.org/I111979921"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5013076039"],"corresponding_institution_ids":["https://openalex.org/I4210088951"],"apc_list":null,"apc_paid":null,"fwci":1.4208,"has_fulltext":false,"cited_by_count":36,"citation_normalized_percentile":{"value":0.80495009,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"437","last_page":"437"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10904","display_name":"Embedded Systems Design Techniques","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6001416444778442}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6001416444778442}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1145/1233501.1233588","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1233501.1233588","pdf_url":null,"source":{"id":"https://openalex.org/S4210177401","display_name":"Digest of technical papers/Digest of technical papers - IEEE/ACM International Conference on Computer-Aided Design","issn_l":"1092-3152","issn":["1092-3152","1558-2434"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319798","host_organization_name":"Association for Computing Machinery","host_organization_lineage":["https://openalex.org/P4310319798"],"host_organization_lineage_names":["Association for Computing Machinery"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design  - ICCAD '06","raw_type":"proceedings-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.137.7809","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.137.7809","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www.iccad.com/data2/iccad/iccad_06acceptedpapers.nsf/9cfb1ebaaf59043587256a6a00031f78/c11c3a4074f40cc18725718f006e7e7e/$file/6a_2.pdf","raw_type":"text"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.259.415","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.259.415","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www.cecs.uci.edu/%7Epapers/iccad06/papers/6A_2.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6299999952316284,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"},{"id":"https://openalex.org/F4320309475","display_name":"Northwestern University","ror":"https://ror.org/000e0be47"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W65564217","https://openalex.org/W141741427","https://openalex.org/W190714407","https://openalex.org/W1523051745","https://openalex.org/W1960617833","https://openalex.org/W1987786682","https://openalex.org/W2060967598","https://openalex.org/W2087422927","https://openalex.org/W2100430744","https://openalex.org/W2101815940","https://openalex.org/W2111887248","https://openalex.org/W2127218421","https://openalex.org/W2134268621","https://openalex.org/W2150938931","https://openalex.org/W2154857344"],"related_works":["https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W2358668433","https://openalex.org/W2376932109","https://openalex.org/W2382290278","https://openalex.org/W2350741829","https://openalex.org/W2130043461","https://openalex.org/W2530322880","https://openalex.org/W1596801655"],"abstract_inverted_index":{"Temperature":[0],"monitoring":[1],"using":[2,164],"thermal":[3,12,74,111,135,143],"sensors":[4,75,85,112,144,170,202],"is":[5,145,178],"an":[6,184],"essential":[7],"tool":[8],"for":[9,55,99,107,192],"evaluating":[10],"the":[11,16,47,82,124,129,151,167,204],"behavior":[13],"and":[14,21,28,32,86],"sustaining":[15],"reliable":[17],"operation":[18],"in":[19,96,148],"high-performance":[20],"high-power":[22],"systems.":[23],"With":[24],"current":[25],"technology":[26],"scaling":[27],"integration":[29],"trends":[30],"timely":[31],"accurate":[33],"detection":[34],"of":[35,49,60,84,110,117,128,142,153,169,176,189,201],"localized":[36],"heating":[37],"will":[38],"be":[39,159],"evermore":[40],"important.":[41],"In":[42],"this":[43],"work,":[44],"we":[45],"address":[46],"creation":[48],"a":[50,77,93,100,115,138,174,198],"resource":[51],"efficient":[52],"sensor":[53,88],"infrastructure":[54],"computing":[56,67],"systems":[57],"that":[58,163],"are":[59,105],"regular":[61,78],"nature,":[62],"such":[63],"as":[64],"logic":[65,122,190],"array-based":[66],"platforms.":[68],"We":[69,161],"propose":[70],"algorithms":[71,104],"to":[72,80,91,113,133,172,197],"embed":[73],"into":[76],"structure":[79],"minimize":[81],"number":[83,168],"determine":[87],"locations":[89],"required":[90,171],"maintain":[92],"given":[94,101],"accuracy":[95],"temperature":[97],"sensing":[98],"design.":[102],"Our":[103],"tailored":[106],"minimal":[108],"usage":[109,127],"suit":[114],"variety":[116],"architectural":[118],"conditions.":[119],"For":[120],"programmable":[121],"arrays":[123,191],"highly":[125],"application-specific":[126],"hardware":[130,155],"resources":[131],"leads":[132],"unpredictable":[134],"profiles.":[136],"As":[137],"result,":[139],"post-manufacture":[140],"instantiation":[141],"desired,":[146],"which":[147,157],"turn":[149],"demands":[150],"use":[152],"native":[154],"resources,":[156],"can":[158],"scarce.":[160],"demonstrate":[162],"our":[165],"techniques":[166],"monitor":[173],"set":[175],"hotspots":[177],"reduced":[179],"by":[180],"75":[181],"%":[182],"on":[183],"average,":[185],"across":[186],"different":[187,193],"sizes":[188],"hotspot":[194],"distributions":[195],"compared":[196],"uniform":[199],"distribution":[200],"throughout":[203],"fabrics.":[205]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":3},{"year":2016,"cited_by_count":3},{"year":2015,"cited_by_count":2},{"year":2014,"cited_by_count":3},{"year":2013,"cited_by_count":2},{"year":2012,"cited_by_count":3}],"updated_date":"2026-04-05T17:49:38.594831","created_date":"2025-10-10T00:00:00"}