{"id":"https://openalex.org/W2142548152","doi":"https://doi.org/10.1145/1146909.1147174","title":"Reliability modeling and management in dynamic microprocessor-based systems","display_name":"Reliability modeling and management in dynamic microprocessor-based systems","publication_year":2006,"publication_date":"2006-01-01","ids":{"openalex":"https://openalex.org/W2142548152","doi":"https://doi.org/10.1145/1146909.1147174","mag":"2142548152"},"language":"en","primary_location":{"id":"doi:10.1145/1146909.1147174","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1146909.1147174","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 43rd annual conference on Design automation  - DAC '06","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5053857493","display_name":"Eric Karl","orcid":null},"institutions":[{"id":"https://openalex.org/I27837315","display_name":"University of Michigan\u2013Ann Arbor","ror":"https://ror.org/00jmfr291","country_code":"US","type":"education","lineage":["https://openalex.org/I27837315"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Eric Karl","raw_affiliation_strings":["University of Michigan, Ann Arbor, MI","Michigan Univ., Ann Arbor, MI, USA"],"affiliations":[{"raw_affiliation_string":"University of Michigan, Ann Arbor, MI","institution_ids":["https://openalex.org/I27837315"]},{"raw_affiliation_string":"Michigan Univ., Ann Arbor, MI, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026311377","display_name":"David Blaauw","orcid":"https://orcid.org/0000-0001-6744-7075"},"institutions":[{"id":"https://openalex.org/I27837315","display_name":"University of Michigan\u2013Ann Arbor","ror":"https://ror.org/00jmfr291","country_code":"US","type":"education","lineage":["https://openalex.org/I27837315"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"David Blaauw","raw_affiliation_strings":["University of Michigan, Ann Arbor, MI","Michigan Univ., Ann Arbor, MI, USA"],"affiliations":[{"raw_affiliation_string":"University of Michigan, Ann Arbor, MI","institution_ids":["https://openalex.org/I27837315"]},{"raw_affiliation_string":"Michigan Univ., Ann Arbor, MI, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5000767141","display_name":"Dennis Sylvester","orcid":"https://orcid.org/0000-0003-2598-0458"},"institutions":[{"id":"https://openalex.org/I27837315","display_name":"University of Michigan\u2013Ann Arbor","ror":"https://ror.org/00jmfr291","country_code":"US","type":"education","lineage":["https://openalex.org/I27837315"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Dennis Sylvester","raw_affiliation_strings":["University of Michigan, Ann Arbor, MI","Michigan Univ., Ann Arbor, MI, USA"],"affiliations":[{"raw_affiliation_string":"University of Michigan, Ann Arbor, MI","institution_ids":["https://openalex.org/I27837315"]},{"raw_affiliation_string":"Michigan Univ., Ann Arbor, MI, USA","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5037541525","display_name":"Trevor Mudge","orcid":"https://orcid.org/0000-0001-7845-2187"},"institutions":[{"id":"https://openalex.org/I27837315","display_name":"University of Michigan\u2013Ann Arbor","ror":"https://ror.org/00jmfr291","country_code":"US","type":"education","lineage":["https://openalex.org/I27837315"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Trevor Mudge","raw_affiliation_strings":["University of Michigan, Ann Arbor, MI","Michigan Univ., Ann Arbor, MI, USA"],"affiliations":[{"raw_affiliation_string":"University of Michigan, Ann Arbor, MI","institution_ids":["https://openalex.org/I27837315"]},{"raw_affiliation_string":"Michigan Univ., Ann Arbor, MI, USA","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5053857493"],"corresponding_institution_ids":["https://openalex.org/I27837315"],"apc_list":null,"apc_paid":null,"fwci":6.5125,"has_fulltext":false,"cited_by_count":76,"citation_normalized_percentile":{"value":0.96793454,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1057","last_page":"1057"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.8200544118881226},{"id":"https://openalex.org/keywords/microprocessor","display_name":"Microprocessor","score":0.7170053124427795},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.6800780296325684},{"id":"https://openalex.org/keywords/workload","display_name":"Workload","score":0.6378951668739319},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.637792706489563},{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.5945229530334473},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.49548518657684326},{"id":"https://openalex.org/keywords/temperature-cycling","display_name":"Temperature cycling","score":0.4484996199607849},{"id":"https://openalex.org/keywords/mean-time-between-failures","display_name":"Mean time between failures","score":0.43539106845855713},{"id":"https://openalex.org/keywords/failure-rate","display_name":"Failure rate","score":0.3514208197593689},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.30510804057121277},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20646309852600098},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.1926071047782898},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.1570446491241455},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.13825994729995728}],"concepts":[{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.8200544118881226},{"id":"https://openalex.org/C2780728072","wikidata":"https://www.wikidata.org/wiki/Q5297","display_name":"Microprocessor","level":2,"score":0.7170053124427795},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.6800780296325684},{"id":"https://openalex.org/C2778476105","wikidata":"https://www.wikidata.org/wiki/Q628539","display_name":"Workload","level":2,"score":0.6378951668739319},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.637792706489563},{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.5945229530334473},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.49548518657684326},{"id":"https://openalex.org/C177564732","wikidata":"https://www.wikidata.org/wiki/Q7698333","display_name":"Temperature cycling","level":3,"score":0.4484996199607849},{"id":"https://openalex.org/C44154001","wikidata":"https://www.wikidata.org/wiki/Q754940","display_name":"Mean time between failures","level":3,"score":0.43539106845855713},{"id":"https://openalex.org/C163164238","wikidata":"https://www.wikidata.org/wiki/Q2737027","display_name":"Failure rate","level":2,"score":0.3514208197593689},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.30510804057121277},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20646309852600098},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.1926071047782898},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1570446491241455},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.13825994729995728},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1145/1146909.1147174","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1146909.1147174","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 43rd annual conference on Design automation  - DAC '06","raw_type":"proceedings-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.648.9902","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.648.9902","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://web.eecs.umich.edu/~tnm/trev_test/papersPDF/2006.06.Reliability Modeling and Management in Dynamic Microporcessor-Based Systems_The ACM-IEEE Design Automation Conference.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6499999761581421,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1527137186","https://openalex.org/W1890614305","https://openalex.org/W1923733561","https://openalex.org/W1988201279","https://openalex.org/W1990215011","https://openalex.org/W2119610788","https://openalex.org/W2139006661","https://openalex.org/W2147702906","https://openalex.org/W2165071510","https://openalex.org/W2795854098","https://openalex.org/W3134875744"],"related_works":["https://openalex.org/W2165108872","https://openalex.org/W4286566980","https://openalex.org/W2324711075","https://openalex.org/W2372884135","https://openalex.org/W2053233382","https://openalex.org/W2034080945","https://openalex.org/W2337334590","https://openalex.org/W2006898677","https://openalex.org/W167642385","https://openalex.org/W912168359"],"abstract_inverted_index":{"Reliability":[0],"failure":[1],"mechanisms,":[2],"such":[3],"as":[4],"time":[5,56,93],"dependent":[6],"dielectric":[7],"breakdown,":[8],"electromigration,":[9],"and":[10,41,60],"thermal":[11],"cycling":[12],"have":[13],"become":[14],"a":[15,49,71,90,104],"key":[16],"concern":[17],"in":[18,70,113],"processor":[19,30,47,86],"design.":[20],"The":[21],"traditional":[22],"approach":[23],"to":[24,78],"reliability":[25,72,94,107,127],"qualification":[26],"assumes":[27],"that":[28,74,111],"the":[29,45,125],"will":[31],"operate":[32],"at":[33,57],"maximum":[34,58],"performance":[35,81,115],"continuously":[36],"under":[37],"worst":[38],"case":[39],"voltage":[40,59],"temperature":[42],"conditions.":[43,100],"However,":[44],"typical":[46],"spends":[48],"very":[50],"small":[51],"fraction":[52],"of":[53,84,119],"its":[54],"operational":[55],"temperature.":[61],"In":[62],"this":[63,68],"paper,":[64],"we":[65],"show":[66],"how":[67],"results":[69,112],"\"slack\"":[73],"can":[75],"be":[76],"leveraged":[77],"provide":[79],"increased":[80],"during":[82,117],"periods":[83,118],"peak":[85,120],"demand.":[87],"We":[88,101],"develop":[89],"novel,":[91],"real":[92],"model":[95],"based":[96],"on":[97],"workload":[98],"driven":[99],"then":[102],"propose":[103],"new":[105],"dynamic":[106],"management":[108],"(DRM)":[109],"scheme":[110],"20-35%":[114],"improvement":[116],"computational":[121],"demand":[122],"while":[123],"ensuring":[124],"required":[126],"lifetime.":[128]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":4},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":4},{"year":2017,"cited_by_count":6},{"year":2016,"cited_by_count":3},{"year":2015,"cited_by_count":4},{"year":2014,"cited_by_count":4},{"year":2013,"cited_by_count":4},{"year":2012,"cited_by_count":9}],"updated_date":"2026-04-05T17:49:38.594831","created_date":"2025-10-10T00:00:00"}