{"id":"https://openalex.org/W2164568153","doi":"https://doi.org/10.1145/1120725.1120841","title":"Wire congestion and thermal aware 3D global placement","display_name":"Wire congestion and thermal aware 3D global placement","publication_year":2005,"publication_date":"2005-01-01","ids":{"openalex":"https://openalex.org/W2164568153","doi":"https://doi.org/10.1145/1120725.1120841","mag":"2164568153"},"language":"en","primary_location":{"id":"doi:10.1145/1120725.1120841","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1120725.1120841","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2005 conference on Asia South Pacific design automation - ASP-DAC '05","raw_type":"proceedings-article"},"type":"conference-abstract","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5025878949","display_name":"Karthik Balakrishnan","orcid":"https://orcid.org/0000-0002-0244-249X"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Karthik Balakrishnan","raw_affiliation_strings":["Georgia Institute of Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Georgia Institute of Technology","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5003835087","display_name":"Vidit Nanda","orcid":null},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Vidit Nanda","raw_affiliation_strings":["Georgia Institute of Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Georgia Institute of Technology","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5031827164","display_name":"S. Easwar","orcid":null},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Siddharth Easwar","raw_affiliation_strings":["Georgia Institute of Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Georgia Institute of Technology","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5052950521","display_name":"Sung Kyu Lim","orcid":"https://orcid.org/0000-0002-2267-5282"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sung Kyu Lim","raw_affiliation_strings":["Georgia Institute of Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Georgia Institute of Technology","institution_ids":["https://openalex.org/I130701444"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I130701444"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":37,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1131","last_page":"1131"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5289295315742493},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.32520490884780884}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5289295315742493},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.32520490884780884}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1145/1120725.1120841","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1120725.1120841","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2005 conference on Asia South Pacific design automation - ASP-DAC '05","raw_type":"proceedings-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.453.9231","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.453.9231","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www.gtcad.gatech.edu/www/papers/asp05a.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.8799999952316284}],"awards":[],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W2002041333","https://openalex.org/W2063343594","https://openalex.org/W2117656819","https://openalex.org/W2120970098","https://openalex.org/W2129192090","https://openalex.org/W2138329321","https://openalex.org/W2143949110","https://openalex.org/W2150872523","https://openalex.org/W2156771075","https://openalex.org/W2157558963"],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W2358668433","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W2382290278","https://openalex.org/W2478288626","https://openalex.org/W2350741829","https://openalex.org/W2530322880","https://openalex.org/W1596801655"],"abstract_inverted_index":{"The":[0],"recent":[1],"popularity":[2],"of":[3,29,47,60],"3D":[4,48],"IC":[5],"technology":[6],"stems":[7],"from":[8],"its":[9],"enhanced":[10],"performance":[11],"capabilities":[12],"and":[13,19,44,54,79,94,101,115],"reduced":[14],"wirelength.":[15],"However,":[16],"wire":[17,45,77,99],"congestion":[18,46,78,100],"thermal":[20,92],"issues":[21],"are":[22],"exacerbated":[23],"due":[24],"to":[25,39],"the":[26,41],"compact":[27],"nature":[28],"these":[30],"layered":[31],"technologies.":[32],"In":[33],"this":[34],"paper,":[35],"we":[36,64,85],"develop":[37],"techniques":[38],"reduce":[40],"maximum":[42,102],"temperature":[43,103],"circuits":[49],"without":[50],"compromising":[51],"total":[52],"wirelength":[53],"via":[55],"count.":[56],"Our":[57,105],"approach":[58],"consists":[59],"two":[61],"phases.":[62],"First,":[63],"use":[65],"a":[66,71],"multi-level":[67],"min-cut":[68],"placement":[69],"with":[70,90],"modified":[72],"gain":[73],"function":[74],"for":[75,97],"local":[76],"dynamic":[80],"power":[81],"consumption":[82],"reduction.":[83,104],"Second,":[84],"perform":[86],"simulated":[87],"annealing":[88],"together":[89],"full-length":[91],"analysis":[93],"global":[95,98],"routing":[96],"experimental":[106],"results":[107],"show":[108],"smooth":[109],"tradeoff":[110],"among":[111],"congestion,":[112],"temperature,":[113],"wirelength,":[114],"via.":[116]},"counts_by_year":[{"year":2020,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":2},{"year":2013,"cited_by_count":3},{"year":2012,"cited_by_count":2}],"updated_date":"2026-07-19T07:52:34.831488","created_date":"2025-10-10T00:00:00"}