{"id":"https://openalex.org/W2012256539","doi":"https://doi.org/10.1145/1117278.1117296","title":"Impact of interconnect resistance increase on system performance of low power and high performance designs","display_name":"Impact of interconnect resistance increase on system performance of low power and high performance designs","publication_year":2006,"publication_date":"2006-03-04","ids":{"openalex":"https://openalex.org/W2012256539","doi":"https://doi.org/10.1145/1117278.1117296","mag":"2012256539"},"language":"en","primary_location":{"id":"doi:10.1145/1117278.1117296","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1117278.1117296","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2006 international workshop on System-level interconnect prediction","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5051052544","display_name":"Mandeep Bamal","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]},{"id":"https://openalex.org/I99464096","display_name":"KU Leuven","ror":"https://ror.org/05f950310","country_code":"BE","type":"education","lineage":["https://openalex.org/I99464096"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Mandeep Bamal","raw_affiliation_strings":["IMEC, Kapeldreef 75, Leuven, Belgium and Katholieke Universiteit Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Kapeldreef 75, Leuven, Belgium and Katholieke Universiteit Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974","https://openalex.org/I99464096"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5016839480","display_name":"Youssef Travaly","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Youssef Travaly","raw_affiliation_strings":["IMEC, Kapeldreef 75, Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Kapeldreef 75, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100457804","display_name":"Wenqi Zhang","orcid":"https://orcid.org/0000-0002-5062-1353"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]},{"id":"https://openalex.org/I99464096","display_name":"KU Leuven","ror":"https://ror.org/05f950310","country_code":"BE","type":"education","lineage":["https://openalex.org/I99464096"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Wenqi Zhang","raw_affiliation_strings":["IMEC, Kapeldreef 75, Leuven, Belgium and Katholieke Universiteit Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Kapeldreef 75, Leuven, Belgium and Katholieke Universiteit Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974","https://openalex.org/I99464096"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027473851","display_name":"Michele Stucchi","orcid":"https://orcid.org/0000-0002-7848-0492"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Michele Stucchi","raw_affiliation_strings":["IMEC, Kapeldreef 75, Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Kapeldreef 75, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5110128571","display_name":"Karen Maex","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]},{"id":"https://openalex.org/I99464096","display_name":"KU Leuven","ror":"https://ror.org/05f950310","country_code":"BE","type":"education","lineage":["https://openalex.org/I99464096"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Karen Maex","raw_affiliation_strings":["IMEC, Kapeldreef 75, Leuven, Belgium and Katholieke Universiteit Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Kapeldreef 75, Leuven, Belgium and Katholieke Universiteit Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974","https://openalex.org/I99464096"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.1181358,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"85","last_page":"90"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7397072911262512},{"id":"https://openalex.org/keywords/scaling","display_name":"Scaling","score":0.673295259475708},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5669628381729126},{"id":"https://openalex.org/keywords/scalability","display_name":"Scalability","score":0.5302887558937073},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4635433852672577},{"id":"https://openalex.org/keywords/scattering","display_name":"Scattering","score":0.4545830488204956},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4541265070438385},{"id":"https://openalex.org/keywords/diffusion","display_name":"Diffusion","score":0.4224197268486023},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.4118233323097229},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3751838803291321},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.3540685176849365},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.30176499485969543},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.21480771899223328},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.12844297289848328},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.11947020888328552},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.08502137660980225}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7397072911262512},{"id":"https://openalex.org/C99844830","wikidata":"https://www.wikidata.org/wiki/Q102441924","display_name":"Scaling","level":2,"score":0.673295259475708},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5669628381729126},{"id":"https://openalex.org/C48044578","wikidata":"https://www.wikidata.org/wiki/Q727490","display_name":"Scalability","level":2,"score":0.5302887558937073},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4635433852672577},{"id":"https://openalex.org/C191486275","wikidata":"https://www.wikidata.org/wiki/Q210028","display_name":"Scattering","level":2,"score":0.4545830488204956},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4541265070438385},{"id":"https://openalex.org/C69357855","wikidata":"https://www.wikidata.org/wiki/Q163214","display_name":"Diffusion","level":2,"score":0.4224197268486023},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.4118233323097229},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3751838803291321},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3540685176849365},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.30176499485969543},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.21480771899223328},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.12844297289848328},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.11947020888328552},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.08502137660980225},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/1117278.1117296","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1117278.1117296","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2006 international workshop on System-level interconnect prediction","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.6600000262260437}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W1556480701","https://openalex.org/W1850104424","https://openalex.org/W1990989521","https://openalex.org/W2013125835","https://openalex.org/W2014919362","https://openalex.org/W2024625835","https://openalex.org/W2028954821","https://openalex.org/W2031360066","https://openalex.org/W2069377610","https://openalex.org/W2098868381","https://openalex.org/W2126970815","https://openalex.org/W2143639388","https://openalex.org/W2144321909","https://openalex.org/W2153274222"],"related_works":["https://openalex.org/W2155019192","https://openalex.org/W2014709025","https://openalex.org/W2389214306","https://openalex.org/W2766970861","https://openalex.org/W3125341812","https://openalex.org/W4235240664","https://openalex.org/W1991674760","https://openalex.org/W1668171714","https://openalex.org/W2889526943","https://openalex.org/W2018755015"],"abstract_inverted_index":{"The":[0,50],"scaling":[1,25],"of":[2,26,31,46,52,57,64,70,104,118],"Cu/Low-k":[3],"interconnects":[4,53],"into":[5],"the":[6,29,37,55,58,62,68,93,102,105,131],"deep":[7],"submicron":[8],"(DSM)":[9],"regime":[10],"is":[11,21,89,110],"characterized":[12],"by":[13,23,129],"a":[14],"significant":[15],"increase":[16,20,39,95],"in":[17,97,133],"resistance.":[18],"This":[19],"caused":[22],"geometrical":[24],"interconnect":[27,136],"dimensions,":[28],"non-scalability":[30],"high":[32,81],"resistivity":[33,38,94],"diffusion":[34],"barrier":[35],"and":[36,43,60,80,107,126],"due":[40],"to":[41,91,100,112],"surface":[42],"grain-boundary":[44],"scattering":[45],"charge":[47],"carrying":[48],"electrons.":[49],"resistance":[51],"impacts":[54],"delay":[56],"circuits":[59],"consequently":[61],"performance":[63,76,82,103],"chips.":[65],"We":[66],"investigate":[67],"impact":[69],"this":[71],"phenomenon":[72],"on":[73],"system":[74],"level":[75],"for":[77],"low":[78],"power":[79],"applications.":[83],"It":[84],"results":[85],"that":[86],"(a)":[87],"it":[88,109],"important":[90],"consider":[92],"early":[96],"design":[98],"phase":[99],"maximize":[101],"chips":[106],"(b)":[108],"possible":[111],"optimally":[113],"trade-off":[114],"between":[115],"various":[116],"metrics":[117],"interest":[119],"such":[120],"as":[121],"clock":[122],"frequency,":[123],"chip":[124,127],"energy":[125],"area":[128],"exploring":[130],"freedom":[132],"choosing":[134],"different":[135],"process":[137],"technology":[138],"options.":[139]},"counts_by_year":[],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}