{"id":"https://openalex.org/W1968296486","doi":"https://doi.org/10.1145/1117278.1117284","title":"An overview of on-chip interconnect variation","display_name":"An overview of on-chip interconnect variation","publication_year":2006,"publication_date":"2006-03-04","ids":{"openalex":"https://openalex.org/W1968296486","doi":"https://doi.org/10.1145/1117278.1117284","mag":"1968296486"},"language":"en","primary_location":{"id":"doi:10.1145/1117278.1117284","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1117278.1117284","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2006 international workshop on System-level interconnect prediction","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5039448967","display_name":"Lou Scheffer","orcid":null},"institutions":[{"id":"https://openalex.org/I66217453","display_name":"Cadence Design Systems (United States)","ror":"https://ror.org/04w8xa018","country_code":"US","type":"company","lineage":["https://openalex.org/I66217453"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Lou Scheffer","raw_affiliation_strings":["Cadence Design Systems, San Jose, California","Cadence Design Systems, San Jose California#TAB#"],"affiliations":[{"raw_affiliation_string":"Cadence Design Systems, San Jose, California","institution_ids":["https://openalex.org/I66217453"]},{"raw_affiliation_string":"Cadence Design Systems, San Jose California#TAB#","institution_ids":["https://openalex.org/I66217453"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5039448967"],"corresponding_institution_ids":["https://openalex.org/I66217453"],"apc_list":null,"apc_paid":null,"fwci":3.02470287,"has_fulltext":false,"cited_by_count":16,"citation_normalized_percentile":{"value":0.91435963,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"27","last_page":"28"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9922000169754028,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9922000169754028,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9851999878883362,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9817000031471252,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7057275772094727},{"id":"https://openalex.org/keywords/variation","display_name":"Variation (astronomy)","score":0.6362065672874451},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5303272604942322},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.49546658992767334},{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.4680668115615845},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3244774341583252},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.2120017111301422},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.07086944580078125}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7057275772094727},{"id":"https://openalex.org/C2778334786","wikidata":"https://www.wikidata.org/wiki/Q1586270","display_name":"Variation (astronomy)","level":2,"score":0.6362065672874451},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5303272604942322},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.49546658992767334},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.4680668115615845},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3244774341583252},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.2120017111301422},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.07086944580078125},{"id":"https://openalex.org/C44870925","wikidata":"https://www.wikidata.org/wiki/Q37547","display_name":"Astrophysics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/1117278.1117284","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1117278.1117284","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2006 international workshop on System-level interconnect prediction","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2018755015","https://openalex.org/W2036806516","https://openalex.org/W1967394420","https://openalex.org/W2565425548","https://openalex.org/W2392009442","https://openalex.org/W2155685366","https://openalex.org/W2142443274","https://openalex.org/W13556768","https://openalex.org/W2912613323","https://openalex.org/W2100663632"],"abstract_inverted_index":{"On":[0],"each":[1,31,101],"manufactured":[2],"chip,":[3],"every":[4],"wire":[5],"and":[6,23,92,121,132,139],"via":[7],"is":[8,17,78],"a":[9,54,63,135],"little":[10],"bit":[11],"different.":[12],"Most":[13],"of":[14,53,108],"this":[15,141],"variation":[16],"accounted":[18],"for":[19,48],"by":[20,129],"chip-to-chip,":[21],"wafer-to-wafer,":[22],"lot-to-lot":[24],"variation.":[25],"These":[26,45],"make":[27],"chips":[28],"different":[29],"from":[30,100],"other,":[32],"but":[33,61],"affect":[34],"all":[35,66],"features":[36],"on":[37,62,68,94],"the":[38,42,51,69,73,95,109,147],"same":[39,43,70,74,96],"chip":[40,65,97],"in":[41,146],"way.":[44],"models":[46],"predict,":[47],"example,":[49],"that":[50],"thickness":[52],"given":[55],"metal":[56],"layer":[57,71],"may":[58],"vary":[59],"considerably,":[60],"single":[64],"wires":[67,91],"are":[72,126],"thickness.":[75],"However,":[76],"there":[77],"also":[79],"on-chip":[80],"(also":[81],"called":[82],"intra-chip,":[83],"or":[84],"cross-chip)":[85],"variation,":[86],"causing":[87],"even":[88],"nominally":[89],"identical":[90],"vias":[93],"to":[98],"differ":[99],"other.":[102],"This":[103],"survey":[104],"looks":[105],"at":[106],"some":[107],"physical":[110],"reasons":[111],"behind":[112],"these":[113,124],"differences":[114,125],"(such":[115],"as":[116],"lithography,":[117],"etching,":[118],"polishing,":[119],"alignment,":[120],"gradients),":[122],"how":[123,140],"currently":[127],"treated":[128],"fabs,":[130],"tools,":[131],"designers":[133],"(in":[134],"very":[136],"ad-hoc":[137],"manner),":[138],"topic":[142],"might":[143],"be":[144],"addressed":[145],"future.":[148]},"counts_by_year":[{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}