{"id":"https://openalex.org/W2034819277","doi":"https://doi.org/10.1145/1055137.1055139","title":"A new era for CAD","display_name":"A new era for CAD","publication_year":2005,"publication_date":"2005-04-03","ids":{"openalex":"https://openalex.org/W2034819277","doi":"https://doi.org/10.1145/1055137.1055139","mag":"2034819277"},"language":"en","primary_location":{"id":"doi:10.1145/1055137.1055139","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1055137.1055139","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2005 international symposium on Physical design","raw_type":"proceedings-article"},"type":"conference-abstract","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5072281558","display_name":"Gary D. Smith","orcid":"https://orcid.org/0000-0003-4377-3348"},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Gary Smith","raw_affiliation_strings":["Gartner Dataquest"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Gartner Dataquest","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":["https://openalex.org/A5072281558"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"101","last_page":"101"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9876999855041504,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9876999855041504,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/node","display_name":"Node (physics)","score":0.6817853450775146},{"id":"https://openalex.org/keywords/cad","display_name":"CAD","score":0.5512097477912903},{"id":"https://openalex.org/keywords/semiconductor-industry","display_name":"Semiconductor industry","score":0.47299155592918396},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4564644396305084},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.4505206346511841},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.4237607419490814},{"id":"https://openalex.org/keywords/silicon-valley","display_name":"Silicon valley","score":0.4143350124359131},{"id":"https://openalex.org/keywords/investment","display_name":"Investment (military)","score":0.41269218921661377},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.3869129717350006},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.19718298316001892},{"id":"https://openalex.org/keywords/business","display_name":"Business","score":0.13067427277565002},{"id":"https://openalex.org/keywords/political-science","display_name":"Political science","score":0.1275915801525116},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.0762968361377716}],"concepts":[{"id":"https://openalex.org/C62611344","wikidata":"https://www.wikidata.org/wiki/Q1062658","display_name":"Node (physics)","level":2,"score":0.6817853450775146},{"id":"https://openalex.org/C194789388","wikidata":"https://www.wikidata.org/wiki/Q17855283","display_name":"CAD","level":2,"score":0.5512097477912903},{"id":"https://openalex.org/C2987888538","wikidata":"https://www.wikidata.org/wiki/Q2986369","display_name":"Semiconductor industry","level":2,"score":0.47299155592918396},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4564644396305084},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.4505206346511841},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.4237607419490814},{"id":"https://openalex.org/C2984737752","wikidata":"https://www.wikidata.org/wiki/Q163820","display_name":"Silicon valley","level":3,"score":0.4143350124359131},{"id":"https://openalex.org/C27548731","wikidata":"https://www.wikidata.org/wiki/Q88272","display_name":"Investment (military)","level":3,"score":0.41269218921661377},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.3869129717350006},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.19718298316001892},{"id":"https://openalex.org/C144133560","wikidata":"https://www.wikidata.org/wiki/Q4830453","display_name":"Business","level":0,"score":0.13067427277565002},{"id":"https://openalex.org/C17744445","wikidata":"https://www.wikidata.org/wiki/Q36442","display_name":"Political science","level":0,"score":0.1275915801525116},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.0762968361377716},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.0},{"id":"https://openalex.org/C10138342","wikidata":"https://www.wikidata.org/wiki/Q43015","display_name":"Finance","level":1,"score":0.0},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0},{"id":"https://openalex.org/C94625758","wikidata":"https://www.wikidata.org/wiki/Q7163","display_name":"Politics","level":2,"score":0.0},{"id":"https://openalex.org/C84309077","wikidata":"https://www.wikidata.org/wiki/Q3908516","display_name":"Entrepreneurship","level":2,"score":0.0},{"id":"https://openalex.org/C199539241","wikidata":"https://www.wikidata.org/wiki/Q7748","display_name":"Law","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1145/1055137.1055139","is_oa":false,"landing_page_url":"https://doi.org/10.1145/1055137.1055139","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2005 international symposium on Physical design","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6100000143051147,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W3004350229","https://openalex.org/W4232646074","https://openalex.org/W2380702446","https://openalex.org/W2953075001","https://openalex.org/W2278755321","https://openalex.org/W2073968121","https://openalex.org/W4401806585","https://openalex.org/W2146237130","https://openalex.org/W3113102347","https://openalex.org/W4233807266"],"abstract_inverted_index":{"It":[0,79],"would":[1],"not":[2],"be":[3],"inaccurate":[4],"to":[5,53,68,93,104],"call":[6],"the":[7,9,20,35,46,88,105,116,122,127],"1990s":[8],"Cream":[10,123],"Puff":[11,124],"era":[12,125],"of":[13,108,126],"semiconductors.":[14],"Plain":[15],"old":[16],"vanilla":[17],"CMOS":[18],"ruled":[19],"land.":[21],"Other":[22],"contenders,":[23],"such":[24],"as":[25],"GAAS":[26],"and":[27,119],"Silicon":[28],"on":[29],"Insulator,":[30],"played":[31],"minor":[32],"roles":[33],"in":[34,85,101],"market":[36],"place.":[37],"The":[38],"RTL":[39],"Methodology":[40],"drove":[41],"EDA":[42,66,69],"tool":[43],"development":[44],"for":[45],"entire":[47],"decade.":[48],"Movement":[49],"from":[50,65],"silicon":[51,54],"node":[52,55],"was":[56],"accomplished":[57],"with":[58],"incremental":[59],"process":[60],"improvements.":[61],"Design":[62],"Tool":[63],"development,":[64],"generation":[67],"generation,":[70],"added":[71],"new":[72,106],"analysis":[73],"capability":[74],"onto":[75],"already":[76],"existing":[77],"tools.":[78],"all":[80],"looked":[81],"easy,":[82],"so":[83],"easy":[84],"fact":[86],"that":[87],"Foundry":[89],"vendors":[90],"were":[91],"able":[92],"make":[94],"great":[95],"strides":[96],"without":[97],"a":[98],"significant":[99],"investment":[100],"R&D.":[102],"Welcome":[103],"ERA":[107],"CAD.":[109],"This":[110],"decade":[111],"looks":[112],"much":[113],"more":[114],"like":[115],"challenging":[117],"1970s":[118],"1980s":[120],"than":[121],"1990s.":[128]},"counts_by_year":[],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2016-06-24T00:00:00"}