{"id":"https://openalex.org/W2036941898","doi":"https://doi.org/10.1142/s1465876303001204","title":"WAFER BONDING PROCESS BASED ON THE TAGUCHI ANALYSIS","display_name":"WAFER BONDING PROCESS BASED ON THE TAGUCHI ANALYSIS","publication_year":2003,"publication_date":"2003-06-01","ids":{"openalex":"https://openalex.org/W2036941898","doi":"https://doi.org/10.1142/s1465876303001204","mag":"2036941898"},"language":"en","primary_location":{"id":"doi:10.1142/s1465876303001204","is_oa":false,"landing_page_url":"https://doi.org/10.1142/s1465876303001204","pdf_url":null,"source":{"id":"https://openalex.org/S107240834","display_name":"International Journal of Computational Engineering Science","issn_l":"1465-8763","issn":["1465-8763","2047-6086"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310311754","host_organization_name":"Imperial College Press","host_organization_lineage":["https://openalex.org/P4310311754"],"host_organization_lineage_names":["Imperial College Press"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Journal of Computational Engineering Science","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5027428789","display_name":"Jianguo Wei","orcid":"https://orcid.org/0000-0002-8964-9759"},"institutions":[{"id":"https://openalex.org/I4210091207","display_name":"Singapore Institute of Manufacturing Technology","ror":"https://ror.org/00f44np30","country_code":"SG","type":"facility","lineage":["https://openalex.org/I115228651","https://openalex.org/I4210091207","https://openalex.org/I91275662"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"J. WEI","raw_affiliation_strings":["Singapore Institute of Manufacturing Technology,  71 Nanyang Drive, Singapore 638075, SingaporeTel: (65) 6793 8575; Fax: (65) 6792 4967"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Singapore Institute of Manufacturing Technology,  71 Nanyang Drive, Singapore 638075, SingaporeTel: (65) 6793 8575; Fax: (65) 6792 4967","institution_ids":["https://openalex.org/I4210091207"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075385875","display_name":"Fern Lan Ng","orcid":"https://orcid.org/0000-0003-1678-1617"},"institutions":[{"id":"https://openalex.org/I4210091207","display_name":"Singapore Institute of Manufacturing Technology","ror":"https://ror.org/00f44np30","country_code":"SG","type":"facility","lineage":["https://openalex.org/I115228651","https://openalex.org/I4210091207","https://openalex.org/I91275662"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"F. L. NG","raw_affiliation_strings":["Singapore Institute of Manufacturing Technology,  71 Nanyang Drive, Singapore 638075, SingaporeTel: (65) 6793 8575; Fax: (65) 6792 4967"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Singapore Institute of Manufacturing Technology,  71 Nanyang Drive, Singapore 638075, SingaporeTel: (65) 6793 8575; Fax: (65) 6792 4967","institution_ids":["https://openalex.org/I4210091207"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5009611141","display_name":"Mui Ling Sharon Nai","orcid":"https://orcid.org/0000-0001-8340-952X"},"institutions":[{"id":"https://openalex.org/I4210091207","display_name":"Singapore Institute of Manufacturing Technology","ror":"https://ror.org/00f44np30","country_code":"SG","type":"facility","lineage":["https://openalex.org/I115228651","https://openalex.org/I4210091207","https://openalex.org/I91275662"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"M. L. NAI","raw_affiliation_strings":["Singapore Institute of Manufacturing Technology,  71 Nanyang Drive, Singapore 638075, SingaporeTel: (65) 6793 8575; Fax: (65) 6792 4967"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Singapore Institute of Manufacturing Technology,  71 Nanyang Drive, Singapore 638075, SingaporeTel: (65) 6793 8575; Fax: (65) 6792 4967","institution_ids":["https://openalex.org/I4210091207"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063476565","display_name":"Hua Xie","orcid":"https://orcid.org/0000-0003-2091-6457"},"institutions":[{"id":"https://openalex.org/I4210091207","display_name":"Singapore Institute of Manufacturing Technology","ror":"https://ror.org/00f44np30","country_code":"SG","type":"facility","lineage":["https://openalex.org/I115228651","https://openalex.org/I4210091207","https://openalex.org/I91275662"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"H. XIE","raw_affiliation_strings":["Singapore Institute of Manufacturing Technology,  71 Nanyang Drive, Singapore 638075, SingaporeTel: (65) 6793 8575; Fax: (65) 6792 4967"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Singapore Institute of Manufacturing Technology,  71 Nanyang Drive, Singapore 638075, SingaporeTel: (65) 6793 8575; Fax: (65) 6792 4967","institution_ids":["https://openalex.org/I4210091207"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5047473921","display_name":"P. C. Lim","orcid":null},"institutions":[{"id":"https://openalex.org/I4210091207","display_name":"Singapore Institute of Manufacturing Technology","ror":"https://ror.org/00f44np30","country_code":"SG","type":"facility","lineage":["https://openalex.org/I115228651","https://openalex.org/I4210091207","https://openalex.org/I91275662"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"P. C. LIM","raw_affiliation_strings":["Singapore Institute of Manufacturing Technology,  71 Nanyang Drive, Singapore 638075, SingaporeTel: (65) 6793 8575; Fax: (65) 6792 4967"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Singapore Institute of Manufacturing Technology,  71 Nanyang Drive, Singapore 638075, SingaporeTel: (65) 6793 8575; Fax: (65) 6792 4967","institution_ids":["https://openalex.org/I4210091207"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5102717367","display_name":"C.K. Wong","orcid":"https://orcid.org/0009-0004-1508-1744"},"institutions":[{"id":"https://openalex.org/I4210091207","display_name":"Singapore Institute of Manufacturing Technology","ror":"https://ror.org/00f44np30","country_code":"SG","type":"facility","lineage":["https://openalex.org/I115228651","https://openalex.org/I4210091207","https://openalex.org/I91275662"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"C. K. WONG","raw_affiliation_strings":["Singapore Institute of Manufacturing Technology,  71 Nanyang Drive, Singapore 638075, SingaporeTel: (65) 6793 8575; Fax: (65) 6792 4967"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Singapore Institute of Manufacturing Technology,  71 Nanyang Drive, Singapore 638075, SingaporeTel: (65) 6793 8575; Fax: (65) 6792 4967","institution_ids":["https://openalex.org/I4210091207"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.13935082,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"04","issue":"02","first_page":"331","last_page":"334"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.9962000250816345,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/taguchi-methods","display_name":"Taguchi methods","score":0.7674002647399902},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.719135582447052},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6207913160324097},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5063990354537964},{"id":"https://openalex.org/keywords/wafer-bonding","display_name":"Wafer bonding","score":0.42796653509140015},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.35910624265670776},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.3309474289417267},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.30906689167022705},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.29686206579208374},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.26264306902885437},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.18182888627052307}],"concepts":[{"id":"https://openalex.org/C83469408","wikidata":"https://www.wikidata.org/wiki/Q2036525","display_name":"Taguchi methods","level":2,"score":0.7674002647399902},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.719135582447052},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6207913160324097},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5063990354537964},{"id":"https://openalex.org/C2779133538","wikidata":"https://www.wikidata.org/wiki/Q677010","display_name":"Wafer bonding","level":3,"score":0.42796653509140015},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.35910624265670776},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3309474289417267},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.30906689167022705},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.29686206579208374},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.26264306902885437},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.18182888627052307},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1142/s1465876303001204","is_oa":false,"landing_page_url":"https://doi.org/10.1142/s1465876303001204","pdf_url":null,"source":{"id":"https://openalex.org/S107240834","display_name":"International Journal of Computational Engineering Science","issn_l":"1465-8763","issn":["1465-8763","2047-6086"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310311754","host_organization_name":"Imperial College Press","host_organization_lineage":["https://openalex.org/P4310311754"],"host_organization_lineage_names":["Imperial College Press"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Journal of Computational Engineering Science","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.550000011920929,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W2009953081","https://openalex.org/W2050148668","https://openalex.org/W2070720201","https://openalex.org/W2105130406"],"related_works":["https://openalex.org/W2053597733","https://openalex.org/W2228105431","https://openalex.org/W2025337696","https://openalex.org/W2073096817","https://openalex.org/W2488020685","https://openalex.org/W3043339446","https://openalex.org/W2540312267","https://openalex.org/W2082419378","https://openalex.org/W2068447932","https://openalex.org/W2936104641"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}