{"id":"https://openalex.org/W2089287076","doi":"https://doi.org/10.1142/s1465876303001137","title":"INVESTIGATION OF LOADING EFFECT IN DEEP TRENCH LISA TECHNOLOGY","display_name":"INVESTIGATION OF LOADING EFFECT IN DEEP TRENCH LISA TECHNOLOGY","publication_year":2003,"publication_date":"2003-06-01","ids":{"openalex":"https://openalex.org/W2089287076","doi":"https://doi.org/10.1142/s1465876303001137","mag":"2089287076"},"language":"en","primary_location":{"id":"doi:10.1142/s1465876303001137","is_oa":false,"landing_page_url":"https://doi.org/10.1142/s1465876303001137","pdf_url":null,"source":{"id":"https://openalex.org/S107240834","display_name":"International Journal of Computational Engineering Science","issn_l":"1465-8763","issn":["1465-8763","2047-6086"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310311754","host_organization_name":"Imperial College Press","host_organization_lineage":["https://openalex.org/P4310311754"],"host_organization_lineage_names":["Imperial College Press"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Journal of Computational Engineering Science","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5042430820","display_name":"Q. X. Zhang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210090209","display_name":"Institute of Microelectronics","ror":"https://ror.org/009rw8n36","country_code":"SG","type":"facility","lineage":["https://openalex.org/I115228651","https://openalex.org/I4210090209","https://openalex.org/I91275662"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Q. X. ZHANG","raw_affiliation_strings":["Institute of Microelectronics, Singapore"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Singapore","institution_ids":["https://openalex.org/I4210090209"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046025037","display_name":"Qiang Guo","orcid":"https://orcid.org/0000-0002-8399-1799"},"institutions":[{"id":"https://openalex.org/I165932596","display_name":"National University of Singapore","ror":"https://ror.org/01tgyzw49","country_code":"SG","type":"education","lineage":["https://openalex.org/I165932596"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Q. Y. GUO","raw_affiliation_strings":["National University of Singapore, Singapore"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National University of Singapore, Singapore","institution_ids":["https://openalex.org/I165932596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033123825","display_name":"J. LI","orcid":null},"institutions":[{"id":"https://openalex.org/I172675005","display_name":"Nanyang Technological University","ror":"https://ror.org/02e7b5302","country_code":"SG","type":"education","lineage":["https://openalex.org/I172675005"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"J. LI","raw_affiliation_strings":["Nanyang Technological University, Singapore"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Nanyang Technological University, Singapore","institution_ids":["https://openalex.org/I172675005"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5078084517","display_name":"Association Liu","orcid":null},"institutions":[{"id":"https://openalex.org/I172675005","display_name":"Nanyang Technological University","ror":"https://ror.org/02e7b5302","country_code":"SG","type":"education","lineage":["https://openalex.org/I172675005"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"A. Q. LIU","raw_affiliation_strings":["Nanyang Technological University, Singapore"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Nanyang Technological University, Singapore","institution_ids":["https://openalex.org/I172675005"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.16319356,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":"04","issue":"02","first_page":"303","last_page":"306"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9945999979972839,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9927999973297119,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/trench","display_name":"Trench","score":0.8158318996429443},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.6999714970588684},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6202706098556519},{"id":"https://openalex.org/keywords/microelectronics","display_name":"Microelectronics","score":0.6073784828186035},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.6055305004119873},{"id":"https://openalex.org/keywords/lagging","display_name":"Lagging","score":0.5462670922279358},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.538025975227356},{"id":"https://openalex.org/keywords/engineering-physics","display_name":"Engineering physics","score":0.4684925973415375},{"id":"https://openalex.org/keywords/silicon-valley","display_name":"Silicon valley","score":0.4492550790309906},{"id":"https://openalex.org/keywords/macro","display_name":"Macro","score":0.43087661266326904},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.33040517568588257},{"id":"https://openalex.org/keywords/geology","display_name":"Geology","score":0.3284362554550171},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.3196207880973816},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2677129805088043},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.21512004733085632},{"id":"https://openalex.org/keywords/law","display_name":"Law","score":0.10471490025520325},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.10348403453826904},{"id":"https://openalex.org/keywords/political-science","display_name":"Political science","score":0.09194424748420715}],"concepts":[{"id":"https://openalex.org/C155310634","wikidata":"https://www.wikidata.org/wiki/Q1852785","display_name":"Trench","level":3,"score":0.8158318996429443},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.6999714970588684},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6202706098556519},{"id":"https://openalex.org/C187937830","wikidata":"https://www.wikidata.org/wiki/Q175403","display_name":"Microelectronics","level":2,"score":0.6073784828186035},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.6055305004119873},{"id":"https://openalex.org/C2776962539","wikidata":"https://www.wikidata.org/wiki/Q6472078","display_name":"Lagging","level":2,"score":0.5462670922279358},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.538025975227356},{"id":"https://openalex.org/C61696701","wikidata":"https://www.wikidata.org/wiki/Q770766","display_name":"Engineering physics","level":1,"score":0.4684925973415375},{"id":"https://openalex.org/C2984737752","wikidata":"https://www.wikidata.org/wiki/Q163820","display_name":"Silicon valley","level":3,"score":0.4492550790309906},{"id":"https://openalex.org/C166955791","wikidata":"https://www.wikidata.org/wiki/Q629579","display_name":"Macro","level":2,"score":0.43087661266326904},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.33040517568588257},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.3284362554550171},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3196207880973816},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2677129805088043},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.21512004733085632},{"id":"https://openalex.org/C199539241","wikidata":"https://www.wikidata.org/wiki/Q7748","display_name":"Law","level":1,"score":0.10471490025520325},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.10348403453826904},{"id":"https://openalex.org/C17744445","wikidata":"https://www.wikidata.org/wiki/Q36442","display_name":"Political science","level":0,"score":0.09194424748420715},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0},{"id":"https://openalex.org/C84309077","wikidata":"https://www.wikidata.org/wiki/Q3908516","display_name":"Entrepreneurship","level":2,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1142/s1465876303001137","is_oa":false,"landing_page_url":"https://doi.org/10.1142/s1465876303001137","pdf_url":null,"source":{"id":"https://openalex.org/S107240834","display_name":"International Journal of Computational Engineering Science","issn_l":"1465-8763","issn":["1465-8763","2047-6086"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310311754","host_organization_name":"Imperial College Press","host_organization_lineage":["https://openalex.org/P4310311754"],"host_organization_lineage_names":["Imperial College Press"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Journal of Computational Engineering Science","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":2,"referenced_works":["https://openalex.org/W2002178129","https://openalex.org/W2112285517"],"related_works":["https://openalex.org/W2135562825","https://openalex.org/W3145783610","https://openalex.org/W2354181859","https://openalex.org/W2757096358","https://openalex.org/W2472614530","https://openalex.org/W2375646802","https://openalex.org/W2052668055","https://openalex.org/W2162038069","https://openalex.org/W627568556","https://openalex.org/W2358087883"],"abstract_inverted_index":null,"counts_by_year":[{"year":2015,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}