{"id":"https://openalex.org/W2974418344","doi":"https://doi.org/10.1142/s0218194019400126","title":"Fault Detection Prediction Using a Deep Belief Network-Based Multi-Classifier in the Semiconductor Manufacturing Process","display_name":"Fault Detection Prediction Using a Deep Belief Network-Based Multi-Classifier in the Semiconductor Manufacturing Process","publication_year":2019,"publication_date":"2019-08-01","ids":{"openalex":"https://openalex.org/W2974418344","doi":"https://doi.org/10.1142/s0218194019400126","mag":"2974418344"},"language":"en","primary_location":{"id":"doi:10.1142/s0218194019400126","is_oa":false,"landing_page_url":"https://doi.org/10.1142/s0218194019400126","pdf_url":null,"source":{"id":"https://openalex.org/S131442419","display_name":"International Journal of Software Engineering and Knowledge Engineering","issn_l":"0218-1940","issn":["0218-1940","1793-6403"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319815","host_organization_name":"World Scientific","host_organization_lineage":["https://openalex.org/P4310319815"],"host_organization_lineage_names":["World Scientific"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Journal of Software Engineering and Knowledge Engineering","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5051127638","display_name":"Jae Kwon Kim","orcid":"https://orcid.org/0000-0001-9982-5413"},"institutions":[{"id":"https://openalex.org/I124633538","display_name":"University of Seoul","ror":"https://ror.org/05en5nh73","country_code":"KR","type":"education","lineage":["https://openalex.org/I124633538"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Jae Kwon Kim","raw_affiliation_strings":["Department of Medical Informatics, College of Medicine, The Catholic University of Seoul, Banpo-daero 222, Seocho-gu, Seoul 06591, South Korea"],"affiliations":[{"raw_affiliation_string":"Department of Medical Informatics, College of Medicine, The Catholic University of Seoul, Banpo-daero 222, Seocho-gu, Seoul 06591, South Korea","institution_ids":["https://openalex.org/I124633538"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5043776204","display_name":"Jong\u2010Sik Lee","orcid":"https://orcid.org/0000-0002-9101-6811"},"institutions":[{"id":"https://openalex.org/I191879574","display_name":"Inha University","ror":"https://ror.org/01easw929","country_code":"KR","type":"education","lineage":["https://openalex.org/I191879574"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jong Sik Lee","raw_affiliation_strings":["Department of Computer Engineering, Inha University, 100 Inha-ro, Michuhol-gu, Incheon 22212, South Korea"],"affiliations":[{"raw_affiliation_string":"Department of Computer Engineering, Inha University, 100 Inha-ro, Michuhol-gu, Incheon 22212, South Korea","institution_ids":["https://openalex.org/I191879574"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5108201457","display_name":"Young Shin Han","orcid":null},"institutions":[{"id":"https://openalex.org/I191879574","display_name":"Inha University","ror":"https://ror.org/01easw929","country_code":"KR","type":"education","lineage":["https://openalex.org/I191879574"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Young Shin Han","raw_affiliation_strings":["Frontier College, Inha University, 100 Inha-ro, Michuhol-gu, Incheon 22212, South Korea"],"affiliations":[{"raw_affiliation_string":"Frontier College, Inha University, 100 Inha-ro, Michuhol-gu, Incheon 22212, South Korea","institution_ids":["https://openalex.org/I191879574"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5051127638"],"corresponding_institution_ids":["https://openalex.org/I124633538"],"apc_list":null,"apc_paid":null,"fwci":2.1754,"has_fulltext":false,"cited_by_count":14,"citation_normalized_percentile":{"value":0.89633058,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":"29","issue":"08","first_page":"1125","last_page":"1139"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9904000163078308,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10876","display_name":"Fault Detection and Control Systems","score":0.9866999983787537,"subfield":{"id":"https://openalex.org/subfields/2207","display_name":"Control and Systems Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.7856087684631348},{"id":"https://openalex.org/keywords/deep-belief-network","display_name":"Deep belief network","score":0.7675195932388306},{"id":"https://openalex.org/keywords/classifier","display_name":"Classifier (UML)","score":0.7385482788085938},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.6573399305343628},{"id":"https://openalex.org/keywords/semiconductor-industry","display_name":"Semiconductor industry","score":0.5069032311439514},{"id":"https://openalex.org/keywords/fault-detection-and-isolation","display_name":"Fault detection and isolation","score":0.49375423789024353},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.49032333493232727},{"id":"https://openalex.org/keywords/machine-learning","display_name":"Machine learning","score":0.4702053666114807},{"id":"https://openalex.org/keywords/pattern-recognition","display_name":"Pattern recognition (psychology)","score":0.46521687507629395},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.37076300382614136},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.3681569993495941},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3522605299949646},{"id":"https://openalex.org/keywords/artificial-neural-network","display_name":"Artificial neural network","score":0.28827863931655884},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.0818142294883728}],"concepts":[{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.7856087684631348},{"id":"https://openalex.org/C97385483","wikidata":"https://www.wikidata.org/wiki/Q16954980","display_name":"Deep belief network","level":3,"score":0.7675195932388306},{"id":"https://openalex.org/C95623464","wikidata":"https://www.wikidata.org/wiki/Q1096149","display_name":"Classifier (UML)","level":2,"score":0.7385482788085938},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.6573399305343628},{"id":"https://openalex.org/C2987888538","wikidata":"https://www.wikidata.org/wiki/Q2986369","display_name":"Semiconductor industry","level":2,"score":0.5069032311439514},{"id":"https://openalex.org/C152745839","wikidata":"https://www.wikidata.org/wiki/Q5438153","display_name":"Fault detection and isolation","level":3,"score":0.49375423789024353},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.49032333493232727},{"id":"https://openalex.org/C119857082","wikidata":"https://www.wikidata.org/wiki/Q2539","display_name":"Machine learning","level":1,"score":0.4702053666114807},{"id":"https://openalex.org/C153180895","wikidata":"https://www.wikidata.org/wiki/Q7148389","display_name":"Pattern recognition (psychology)","level":2,"score":0.46521687507629395},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.37076300382614136},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.3681569993495941},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3522605299949646},{"id":"https://openalex.org/C50644808","wikidata":"https://www.wikidata.org/wiki/Q192776","display_name":"Artificial neural network","level":2,"score":0.28827863931655884},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.0818142294883728},{"id":"https://openalex.org/C172707124","wikidata":"https://www.wikidata.org/wiki/Q423488","display_name":"Actuator","level":2,"score":0.0},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1142/s0218194019400126","is_oa":false,"landing_page_url":"https://doi.org/10.1142/s0218194019400126","pdf_url":null,"source":{"id":"https://openalex.org/S131442419","display_name":"International Journal of Software Engineering and Knowledge Engineering","issn_l":"0218-1940","issn":["0218-1940","1793-6403"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319815","host_organization_name":"World Scientific","host_organization_lineage":["https://openalex.org/P4310319815"],"host_organization_lineage_names":["World Scientific"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Journal of Software Engineering and Knowledge Engineering","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.6100000143051147}],"awards":[{"id":"https://openalex.org/G815666700","display_name":null,"funder_award_id":"NRF-2018R1D1A1B07041663","funder_id":"https://openalex.org/F4320322120","funder_display_name":"National Research Foundation of Korea"}],"funders":[{"id":"https://openalex.org/F4320322120","display_name":"National Research Foundation of Korea","ror":"https://ror.org/013aysd81"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":16,"referenced_works":["https://openalex.org/W44815768","https://openalex.org/W1979336685","https://openalex.org/W1992795012","https://openalex.org/W2020603302","https://openalex.org/W2096697795","https://openalex.org/W2100495367","https://openalex.org/W2124543898","https://openalex.org/W2136922672","https://openalex.org/W2139833307","https://openalex.org/W2148143831","https://openalex.org/W2156242763","https://openalex.org/W2171141701","https://openalex.org/W2425614235","https://openalex.org/W2483664965","https://openalex.org/W4244024126","https://openalex.org/W4255500610"],"related_works":["https://openalex.org/W2992897358","https://openalex.org/W1969801928","https://openalex.org/W1979703647","https://openalex.org/W2796831252","https://openalex.org/W2974418344","https://openalex.org/W2917828100","https://openalex.org/W2361830001","https://openalex.org/W2146075642","https://openalex.org/W1529487987","https://openalex.org/W1483525138"],"abstract_inverted_index":{"The":[0,94,101,125,151],"semiconductor":[1,16,91,114,163],"manufacturing":[2,92,164],"process":[3,165],"is":[4,9,32,56,62,70,83,104,123,128,139,149],"very":[5],"complex,":[6],"and":[7,36,58,119,157],"it":[8],"the":[10,15,44,90,120,131,162],"most":[11],"important":[12],"part":[13],"of":[14,46,98],"industry.":[17],"In":[18,74],"order":[19],"to":[20,64,129],"test":[21,31,69],"whether":[22,66],"or":[23,72],"not":[24],"wafers":[25],"are":[26,117],"functioning":[27],"normally,":[28],"a":[29,52,59,67,77,105],"pass/fail":[30,68],"conducted;":[33],"however,":[34],"time":[35],"cost":[37],"needed":[38,63],"for":[39,85,113,141],"this":[40,75],"testing":[41],"increase":[42],"as":[43],"number":[45],"chips":[47],"increases.":[48],"To":[49],"address":[50],"this,":[51],"machine":[53],"learning":[54],"technique":[55],"adopted":[57],"high-performance":[60],"classifier":[61,138],"determine":[65],"accurate":[71],"not.":[73],"paper,":[76],"deep":[78],"belief":[79],"network":[80],"(DBN)-based":[81],"multi-classifier":[82],"proposed":[84,95,152],"fault":[86,146],"detection":[87,147],"prediction":[88,148],"in":[89,109,161],"process.":[93],"method":[96,153],"consists":[97],"two":[99],"phases:":[100],"first":[102],"phase":[103,108,127],"data":[106,115],"pre-processing":[107],"which":[110],"features":[111],"required":[112],"sets":[116],"extracted":[118],"imbalance":[121],"problem":[122],"solved.":[124],"second":[126],"configure":[130],"multi-DBN":[132],"using":[133],"selected":[134],"features.":[135],"A":[136],"DBN":[137],"created":[140],"each":[142],"feature":[143],"and,":[144],"finally,":[145],"performed.":[150],"showed":[154],"excellent":[155],"performance":[156],"can":[158],"be":[159],"used":[160],"efficiently.":[166]},"counts_by_year":[{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":6},{"year":2021,"cited_by_count":3},{"year":2020,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}