{"id":"https://openalex.org/W2968186377","doi":"https://doi.org/10.1142/s0218126620501157","title":"A Low-Loss and High-Isolation Transformer-Based mm-Wave SPDT with Integrated Fan-out Wafer Level Packaging","display_name":"A Low-Loss and High-Isolation Transformer-Based mm-Wave SPDT with Integrated Fan-out Wafer Level Packaging","publication_year":2019,"publication_date":"2019-08-16","ids":{"openalex":"https://openalex.org/W2968186377","doi":"https://doi.org/10.1142/s0218126620501157","mag":"2968186377"},"language":"en","primary_location":{"id":"doi:10.1142/s0218126620501157","is_oa":false,"landing_page_url":"https://doi.org/10.1142/s0218126620501157","pdf_url":null,"source":{"id":"https://openalex.org/S167602672","display_name":"Journal of Circuits Systems and Computers","issn_l":"0218-1266","issn":["0218-1266","1793-6454"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319815","host_organization_name":"World Scientific","host_organization_lineage":["https://openalex.org/P4310319815"],"host_organization_lineage_names":["World Scientific"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Circuits, Systems and Computers","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5102719428","display_name":"Xing Quan","orcid":"https://orcid.org/0000-0002-6558-0718"},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Xing Quan","raw_affiliation_strings":["School of Mechano-electronic Engineering, Xidian University, Xi\u2019an 710071, P.\u00a0R.\u00a0China"],"raw_orcid":"https://orcid.org/0000-0002-6558-0718","affiliations":[{"raw_affiliation_string":"School of Mechano-electronic Engineering, Xidian University, Xi\u2019an 710071, P.\u00a0R.\u00a0China","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101849813","display_name":"Jiang Luo","orcid":"https://orcid.org/0000-0003-4519-792X"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Jiang Luo","raw_affiliation_strings":["Nanjing Electronic Devices Institute, Nanjing 210016, P.\u00a0R.\u00a0China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Nanjing Electronic Devices Institute, Nanjing 210016, P.\u00a0R.\u00a0China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084150655","display_name":"Guodong Su","orcid":"https://orcid.org/0000-0001-6927-9183"},"institutions":[{"id":"https://openalex.org/I50760025","display_name":"Hangzhou Dianzi University","ror":"https://ror.org/0576gt767","country_code":"CN","type":"education","lineage":["https://openalex.org/I50760025"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Guodong Su","raw_affiliation_strings":["Key Laboratory of RF Circuits and Systems, Ministry of Education, Hangzhou Dianzi University, Hangzhou 310037, P.\u00a0R.\u00a0China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Key Laboratory of RF Circuits and Systems, Ministry of Education, Hangzhou Dianzi University, Hangzhou 310037, P.\u00a0R.\u00a0China","institution_ids":["https://openalex.org/I50760025"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101414145","display_name":"Kai Jing","orcid":"https://orcid.org/0000-0001-9471-6904"},"institutions":[{"id":"https://openalex.org/I4210131919","display_name":"Xi'an University of Technology","ror":"https://ror.org/038avdt50","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210131919"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Kai Jing","raw_affiliation_strings":["School of Automation and Information Engineering, Xi\u2019an University of Technology, Xi\u2019an 710071, P.\u00a0R.\u00a0China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Automation and Information Engineering, Xi\u2019an University of Technology, Xi\u2019an 710071, P.\u00a0R.\u00a0China","institution_ids":["https://openalex.org/I4210131919"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101456138","display_name":"Jinsong Zhan","orcid":"https://orcid.org/0000-0001-6120-2771"},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jinsong Zhan","raw_affiliation_strings":["School of Mechano-electronic Engineering, Xidian University, Xi\u2019an 710071, P.\u00a0R.\u00a0China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Mechano-electronic Engineering, Xidian University, Xi\u2019an 710071, P.\u00a0R.\u00a0China","institution_ids":["https://openalex.org/I149594827"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5102719428"],"corresponding_institution_ids":["https://openalex.org/I149594827"],"apc_list":null,"apc_paid":null,"fwci":0.2335,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.53827504,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"29","issue":"07","first_page":"2050115","last_page":"2050115"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6493744850158691},{"id":"https://openalex.org/keywords/insertion-loss","display_name":"Insertion loss","score":0.5809123516082764},{"id":"https://openalex.org/keywords/return-loss","display_name":"Return loss","score":0.5636533498764038},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.5422106981277466},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.5141523480415344},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5118440985679626},{"id":"https://openalex.org/keywords/transformer","display_name":"Transformer","score":0.4802680015563965},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.4487699866294861},{"id":"https://openalex.org/keywords/wafer-level-packaging","display_name":"Wafer-level packaging","score":0.4399177134037018},{"id":"https://openalex.org/keywords/fan-out","display_name":"Fan-out","score":0.42634913325309753},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.337447851896286},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3290975093841553},{"id":"https://openalex.org/keywords/antenna","display_name":"Antenna (radio)","score":0.28674763441085815},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.26799464225769043}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6493744850158691},{"id":"https://openalex.org/C90327742","wikidata":"https://www.wikidata.org/wiki/Q947396","display_name":"Insertion loss","level":2,"score":0.5809123516082764},{"id":"https://openalex.org/C196901423","wikidata":"https://www.wikidata.org/wiki/Q3933836","display_name":"Return loss","level":3,"score":0.5636533498764038},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.5422106981277466},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.5141523480415344},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5118440985679626},{"id":"https://openalex.org/C66322947","wikidata":"https://www.wikidata.org/wiki/Q11658","display_name":"Transformer","level":3,"score":0.4802680015563965},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.4487699866294861},{"id":"https://openalex.org/C2780288131","wikidata":"https://www.wikidata.org/wiki/Q4017648","display_name":"Wafer-level packaging","level":3,"score":0.4399177134037018},{"id":"https://openalex.org/C68812741","wikidata":"https://www.wikidata.org/wiki/Q636609","display_name":"Fan-out","level":3,"score":0.42634913325309753},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.337447851896286},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3290975093841553},{"id":"https://openalex.org/C21822782","wikidata":"https://www.wikidata.org/wiki/Q131214","display_name":"Antenna (radio)","level":2,"score":0.28674763441085815},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.26799464225769043},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1142/s0218126620501157","is_oa":false,"landing_page_url":"https://doi.org/10.1142/s0218126620501157","pdf_url":null,"source":{"id":"https://openalex.org/S167602672","display_name":"Journal of Circuits Systems and Computers","issn_l":"0218-1266","issn":["0218-1266","1793-6454"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319815","host_organization_name":"World Scientific","host_organization_lineage":["https://openalex.org/P4310319815"],"host_organization_lineage_names":["World Scientific"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Circuits, Systems and Computers","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G3660863094","display_name":null,"funder_award_id":"2018M643577","funder_id":"https://openalex.org/F4320321543","funder_display_name":"China Postdoctoral Science Foundation"},{"id":"https://openalex.org/G7592728318","display_name":null,"funder_award_id":"JB190406","funder_id":"https://openalex.org/F4320335787","funder_display_name":"Fundamental Research Funds for the Central Universities"}],"funders":[{"id":"https://openalex.org/F4320321543","display_name":"China Postdoctoral Science Foundation","ror":"https://ror.org/0426zh255"},{"id":"https://openalex.org/F4320335787","display_name":"Fundamental Research Funds for the Central Universities","ror":null}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":28,"referenced_works":["https://openalex.org/W148967368","https://openalex.org/W1968018528","https://openalex.org/W2055592726","https://openalex.org/W2058459217","https://openalex.org/W2072686067","https://openalex.org/W2092091566","https://openalex.org/W2096824964","https://openalex.org/W2132493763","https://openalex.org/W2145013632","https://openalex.org/W2154054983","https://openalex.org/W2168839162","https://openalex.org/W2204031324","https://openalex.org/W2317588302","https://openalex.org/W2329274862","https://openalex.org/W2589509156","https://openalex.org/W2744170514","https://openalex.org/W2744706769","https://openalex.org/W2782605303","https://openalex.org/W2788414676","https://openalex.org/W2793595461","https://openalex.org/W2794115803","https://openalex.org/W2886618417","https://openalex.org/W2892019017","https://openalex.org/W2894419025","https://openalex.org/W2897571916","https://openalex.org/W2897883899","https://openalex.org/W2922196175","https://openalex.org/W2940283667"],"related_works":["https://openalex.org/W2124725464","https://openalex.org/W1973870453","https://openalex.org/W2086351729","https://openalex.org/W4313451576","https://openalex.org/W2772649333","https://openalex.org/W2106709610","https://openalex.org/W2008701935","https://openalex.org/W1821229267","https://openalex.org/W2090384652","https://openalex.org/W2160821924"],"abstract_inverted_index":{"This":[0,167],"paper":[1],"proposes":[2],"a":[3,90,138,170],"low-loss":[4],"and":[5,54,97,122,130,150,178,188],"high-isolation":[6],"transformer":[7],"(TF)-based":[8],"mm-wave":[9],"single-pole":[10,129],"double-throw":[11,120,131],"(SPDT)":[12],"switch.":[13],"The":[14,29,67,82,110,134],"center-tapped":[15],"technique":[16],"is":[17,31,73,100],"employed":[18],"at":[19,106,162],"the":[20,34,59,63,71,86,98,176,184],"secondary":[21],"coil":[22],"of":[23,65,70,93,142,186],"TF":[24,30,60],"to":[25,48],"improve":[26],"isolation":[27],"performance.":[28],"implemented":[32],"with":[33],"metals":[35],"in":[36,40,75,190],"redistribution":[37],"layers":[38],"(RDLs)":[39],"integrated":[41],"fan-out":[42],"(InFO)":[43],"wafer":[44],"level":[45],"packaging":[46],"technology":[47],"obtain":[49],"low":[50],"insertion":[51],"loss":[52],"(IL)":[53],"small":[55],"chip":[56],"size":[57,141],"as":[58],"usually":[61],"dominates":[62],"area":[64],"SPDT.":[66],"control":[68],"device":[69],"SPDT":[72,88,136,177,187],"realized":[74],"40[Formula:":[76],"see":[77,95,104,108,116,126,144,146,158,160,164],"text]nm":[78],"bulk":[79],"CMOS":[80],"process.":[81],"simulated":[83],"result":[84],"shows":[85],"proposed":[87,135],"achieves":[89],"minimum":[91],"IL":[92,99],"1.34[Formula:":[94],"text]dB":[96,105,117,127,161],"less":[101],"than":[102,114,124,156],"2.2[Formula:":[103],"24\u201331[Formula:":[107,163],"text]GHz.":[109],"isolations":[111],"are":[112,154],"better":[113,123,155],"27[Formula:":[115],"between":[118,128],"two":[119],"ports":[121],"20[Formula:":[125],"ports,":[132],"respectively.":[133],"has":[137],"compact":[139],"silicon":[140],"220[Formula:":[143],"text][Formula:":[145],"text]":[147],"(with":[148],"PADs)":[149],"its":[151],"return":[152],"losses":[153],"[Formula:":[157],"text]9[Formula:":[159],"text]GHz":[165],"and.":[166],"work":[168],"explores":[169],"new":[171],"chip-package":[172],"co-design":[173,185],"method":[174],"for":[175,183],"may":[179],"have":[180],"some":[181],"guidance":[182],"antenna":[189],"package":[191],"(AiP).":[192]},"counts_by_year":[{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1}],"updated_date":"2026-05-21T06:26:12.895304","created_date":"2025-10-10T00:00:00"}