{"id":"https://openalex.org/W2142698611","doi":"https://doi.org/10.1142/s0218126602000677","title":"INTEGRATED PERFORMANCE, POWER, AND THERMAL MODELING","display_name":"INTEGRATED PERFORMANCE, POWER, AND THERMAL MODELING","publication_year":2002,"publication_date":"2002-12-01","ids":{"openalex":"https://openalex.org/W2142698611","doi":"https://doi.org/10.1142/s0218126602000677","mag":"2142698611"},"language":"en","primary_location":{"id":"doi:10.1142/s0218126602000677","is_oa":false,"landing_page_url":"https://doi.org/10.1142/s0218126602000677","pdf_url":null,"source":{"id":"https://openalex.org/S167602672","display_name":"Journal of Circuits Systems and Computers","issn_l":"0218-1266","issn":["0218-1266","1793-6454"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319815","host_organization_name":"World Scientific","host_organization_lineage":["https://openalex.org/P4310319815"],"host_organization_lineage_names":["World Scientific"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Circuits, Systems and Computers","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5110202494","display_name":"George Cai","orcid":null},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"GEORGE CAI","raw_affiliation_strings":["Intel Corporation, MS JF411, 2111 NE 25th Ave., Hillsboro, OR 97124, USA"],"affiliations":[{"raw_affiliation_string":"Intel Corporation, MS JF411, 2111 NE 25th Ave., Hillsboro, OR 97124, USA","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5007343492","display_name":"A.S. Dhodapkar","orcid":null},"institutions":[{"id":"https://openalex.org/I135310074","display_name":"University of Wisconsin\u2013Madison","ror":"https://ror.org/01y2jtd41","country_code":"US","type":"education","lineage":["https://openalex.org/I135310074"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"ASHUTOSH S. DHODAPKAR","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Wisconsin-Madison, 1415 Engineering Drive, Madison, WI 53706, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Wisconsin-Madison, 1415 Engineering Drive, Madison, WI 53706, USA","institution_ids":["https://openalex.org/I135310074"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5017566347","display_name":"James E. Smith","orcid":"https://orcid.org/0000-0001-7908-1859"},"institutions":[{"id":"https://openalex.org/I135310074","display_name":"University of Wisconsin\u2013Madison","ror":"https://ror.org/01y2jtd41","country_code":"US","type":"education","lineage":["https://openalex.org/I135310074"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"JAMES E. SMITH","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Wisconsin-Madison, 1415 Engineering Drive, Madison, WI 53706, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Wisconsin-Madison, 1415 Engineering Drive, Madison, WI 53706, USA","institution_ids":["https://openalex.org/I135310074"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5110202494"],"corresponding_institution_ids":["https://openalex.org/I1343180700"],"apc_list":null,"apc_paid":null,"fwci":0.3394,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.6176217,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"11","issue":"06","first_page":"659","last_page":"675"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microarchitecture","display_name":"Microarchitecture","score":0.644689679145813},{"id":"https://openalex.org/keywords/microprocessor","display_name":"Microprocessor","score":0.61656254529953},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5994846820831299},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.5874929428100586},{"id":"https://openalex.org/keywords/dynamic-demand","display_name":"Dynamic demand","score":0.4908042848110199},{"id":"https://openalex.org/keywords/energy-consumption","display_name":"Energy consumption","score":0.4820038378238678},{"id":"https://openalex.org/keywords/interface","display_name":"Interface (matter)","score":0.4800642430782318},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.45832952857017517},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4437181353569031},{"id":"https://openalex.org/keywords/constraint","display_name":"Constraint (computer-aided design)","score":0.4417828321456909},{"id":"https://openalex.org/keywords/power-optimization","display_name":"Power optimization","score":0.4257383644580841},{"id":"https://openalex.org/keywords/dissipation","display_name":"Dissipation","score":0.42297428846359253},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.4061015844345093},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.35853224992752075},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.344662070274353},{"id":"https://openalex.org/keywords/power-consumption","display_name":"Power consumption","score":0.322733998298645},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2826078534126282},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.12150216102600098},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.11725136637687683},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.10662972927093506}],"concepts":[{"id":"https://openalex.org/C107598950","wikidata":"https://www.wikidata.org/wiki/Q259864","display_name":"Microarchitecture","level":2,"score":0.644689679145813},{"id":"https://openalex.org/C2780728072","wikidata":"https://www.wikidata.org/wiki/Q5297","display_name":"Microprocessor","level":2,"score":0.61656254529953},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5994846820831299},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.5874929428100586},{"id":"https://openalex.org/C45872418","wikidata":"https://www.wikidata.org/wiki/Q5318966","display_name":"Dynamic demand","level":3,"score":0.4908042848110199},{"id":"https://openalex.org/C2780165032","wikidata":"https://www.wikidata.org/wiki/Q16869822","display_name":"Energy consumption","level":2,"score":0.4820038378238678},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.4800642430782318},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.45832952857017517},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4437181353569031},{"id":"https://openalex.org/C2776036281","wikidata":"https://www.wikidata.org/wiki/Q48769818","display_name":"Constraint (computer-aided design)","level":2,"score":0.4417828321456909},{"id":"https://openalex.org/C168292644","wikidata":"https://www.wikidata.org/wiki/Q10860336","display_name":"Power optimization","level":4,"score":0.4257383644580841},{"id":"https://openalex.org/C135402231","wikidata":"https://www.wikidata.org/wiki/Q898440","display_name":"Dissipation","level":2,"score":0.42297428846359253},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.4061015844345093},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.35853224992752075},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.344662070274353},{"id":"https://openalex.org/C2984118289","wikidata":"https://www.wikidata.org/wiki/Q29954","display_name":"Power consumption","level":3,"score":0.322733998298645},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2826078534126282},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.12150216102600098},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.11725136637687683},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.10662972927093506},{"id":"https://openalex.org/C129307140","wikidata":"https://www.wikidata.org/wiki/Q6795880","display_name":"Maximum bubble pressure method","level":3,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C157915830","wikidata":"https://www.wikidata.org/wiki/Q2928001","display_name":"Bubble","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1142/s0218126602000677","is_oa":false,"landing_page_url":"https://doi.org/10.1142/s0218126602000677","pdf_url":null,"source":{"id":"https://openalex.org/S167602672","display_name":"Journal of Circuits Systems and Computers","issn_l":"0218-1266","issn":["0218-1266","1793-6454"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319815","host_organization_name":"World Scientific","host_organization_lineage":["https://openalex.org/P4310319815"],"host_organization_lineage_names":["World Scientific"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Circuits, Systems and Computers","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.8999999761581421,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W2053828888","https://openalex.org/W2080498121","https://openalex.org/W2149743155","https://openalex.org/W2154433299","https://openalex.org/W2158832448","https://openalex.org/W2534292192","https://openalex.org/W4241665042"],"related_works":["https://openalex.org/W2503229030","https://openalex.org/W2359093654","https://openalex.org/W32488798","https://openalex.org/W2130127169","https://openalex.org/W1999476393","https://openalex.org/W2385444123","https://openalex.org/W4247159817","https://openalex.org/W2107419853","https://openalex.org/W4254183379","https://openalex.org/W2008937153"],"abstract_inverted_index":{"In":[0,19],"current":[1],"microprocessor":[2],"designs,":[3],"power":[4,23,82,96,128],"dissipation":[5],"has":[6,134],"become":[7],"a":[8,49,90,108,135],"first":[9],"class":[10],"design":[11,22,44],"constraint":[12],"alongside":[13],"performance":[14],"and":[15,36,66,83,97,124,148],"total":[16],"chip":[17],"cost.":[18],"order":[20],"to":[21,31,55,118,140],"efficient":[24],"microprocessors,":[25],"it":[26],"is":[27,139],"essential":[28],"for":[29,73,93,127,144],"architects":[30],"estimate":[32],"the":[33,43,60,75],"power/energy":[34],"consumption":[35],"study":[37,56,120],"thermal":[38,84,98],"effects":[39,76],"early":[40],"on":[41,80,111],"in":[42],"process.":[45],"This":[46],"paper":[47,106],"describes":[48],"method":[50,87,113],"that":[51,114],"can":[52,115],"be":[53,116,141],"used":[54,117],"power/performance":[57,146],"tradeoffs":[58],"during":[59],"microarchitecture":[61],"definition":[62],"phase.":[63],"The":[64,86,105,131],"modeling":[65],"simulation":[67],"methods":[68],"provide":[69],"an":[70],"integrated":[71],"framework":[72],"evaluating":[74],"of":[77,100,103],"microarchitectural":[78],"parameters":[79],"performance,":[81],"behavior.":[85],"also":[88,133],"provides":[89],"flexible":[91,136],"interface":[92,137],"supporting":[94],"several":[95],"models":[99],"varying":[101],"degrees":[102],"detail.":[104],"introduces":[107],"tool":[109,132],"based":[110],"this":[112],"systematically":[119],"new":[121],"architectures,":[122],"designs":[123],"optimize":[125],"them":[126],"and/or":[129],"performance.":[130],"which":[138],"easily":[142],"extended":[143],"future":[145],"analysis":[147],"optimization":[149],"techniques.":[150]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}