{"id":"https://openalex.org/W2157805606","doi":"https://doi.org/10.1137/s0036144596308546","title":"Case Study from Industry:Process Modeling in Resin Transfer Molding as a Method to Enhance Product Quality","display_name":"Case Study from Industry:Process Modeling in Resin Transfer Molding as a Method to Enhance Product Quality","publication_year":1997,"publication_date":"1997-01-01","ids":{"openalex":"https://openalex.org/W2157805606","doi":"https://doi.org/10.1137/s0036144596308546","mag":"2157805606"},"language":"en","primary_location":{"id":"doi:10.1137/s0036144596308546","is_oa":false,"landing_page_url":"https://doi.org/10.1137/s0036144596308546","pdf_url":null,"source":{"id":"https://openalex.org/S160107561","display_name":"SIAM Review","issn_l":"0036-1445","issn":["0036-1445","1095-7200"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320508","host_organization_name":"Society for Industrial and Applied Mathematics","host_organization_lineage":["https://openalex.org/P4310320508"],"host_organization_lineage_names":["Society for Industrial and Applied Mathematics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SIAM Review","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5001714139","display_name":"Wai\u2010Keung Chui","orcid":"https://orcid.org/0000-0003-2568-6021"},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"W. K. Chui","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5038334215","display_name":"James Glimm","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"J. Glimm","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030008307","display_name":"F. M. Tangerman","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"F. M. Tangerman","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5066160213","display_name":"A. P. Jardine","orcid":"https://orcid.org/0000-0002-6682-1763"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"A. P. Jardine","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5011812098","display_name":"John Madsen","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"J. S. Madsen","raw_affiliation_strings":[],"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5082613745","display_name":"T. M. Donnellan","orcid":null},"institutions":[{"id":"https://openalex.org/I4210096458","display_name":"Applied Research (United States)","ror":"https://ror.org/00qw43163","country_code":"US","type":"company","lineage":["https://openalex.org/I4210096458"]},{"id":"https://openalex.org/I4388482701","display_name":"Applied Research Laboratory at the University of Hawai\u2018i","ror":"https://ror.org/046s2rf49","country_code":null,"type":"facility","lineage":["https://openalex.org/I4388482701"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"T. M. Donnellan","raw_affiliation_strings":["Applied Research Laboratory (ARL)"],"affiliations":[{"raw_affiliation_string":"Applied Research Laboratory (ARL)","institution_ids":["https://openalex.org/I4210096458","https://openalex.org/I4388482701"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5002964998","display_name":"R. Leek","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"R. Leek","raw_affiliation_strings":[],"affiliations":[]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5001714139"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":3.9502,"has_fulltext":false,"cited_by_count":32,"citation_normalized_percentile":{"value":0.93618468,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":"39","issue":"4","first_page":"714","last_page":"727"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11145","display_name":"Epoxy Resin Curing Processes","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11145","display_name":"Epoxy Resin Curing Processes","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12080","display_name":"Injection Molding Process and Properties","score":0.9976999759674072,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12084","display_name":"Synthesis and properties of polymers","score":0.9850000143051147,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/transfer-molding","display_name":"Transfer molding","score":0.8685383796691895},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.6201573610305786},{"id":"https://openalex.org/keywords/molding","display_name":"Molding (decorative)","score":0.5703074932098389},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5335716605186462},{"id":"https://openalex.org/keywords/quality","display_name":"Quality (philosophy)","score":0.5127776265144348},{"id":"https://openalex.org/keywords/product","display_name":"Product (mathematics)","score":0.4888131320476532},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.4582151770591736},{"id":"https://openalex.org/keywords/process-engineering","display_name":"Process engineering","score":0.4097558259963989},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.264274537563324},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2588849365711212},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.2479557991027832},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.10768511891365051},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.07591098546981812}],"concepts":[{"id":"https://openalex.org/C37696544","wikidata":"https://www.wikidata.org/wiki/Q382824","display_name":"Transfer molding","level":3,"score":0.8685383796691895},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.6201573610305786},{"id":"https://openalex.org/C67558686","wikidata":"https://www.wikidata.org/wiki/Q1770806","display_name":"Molding (decorative)","level":2,"score":0.5703074932098389},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5335716605186462},{"id":"https://openalex.org/C2779530757","wikidata":"https://www.wikidata.org/wiki/Q1207505","display_name":"Quality (philosophy)","level":2,"score":0.5127776265144348},{"id":"https://openalex.org/C90673727","wikidata":"https://www.wikidata.org/wiki/Q901718","display_name":"Product (mathematics)","level":2,"score":0.4888131320476532},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.4582151770591736},{"id":"https://openalex.org/C21880701","wikidata":"https://www.wikidata.org/wiki/Q2144042","display_name":"Process engineering","level":1,"score":0.4097558259963989},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.264274537563324},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2588849365711212},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2479557991027832},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.10768511891365051},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.07591098546981812},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C2780566776","wikidata":"https://www.wikidata.org/wiki/Q159341","display_name":"Mold","level":2,"score":0.0},{"id":"https://openalex.org/C111472728","wikidata":"https://www.wikidata.org/wiki/Q9471","display_name":"Epistemology","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1137/s0036144596308546","is_oa":false,"landing_page_url":"https://doi.org/10.1137/s0036144596308546","pdf_url":null,"source":{"id":"https://openalex.org/S160107561","display_name":"SIAM Review","issn_l":"0036-1445","issn":["0036-1445","1095-7200"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320508","host_organization_name":"Society for Industrial and Applied Mathematics","host_organization_lineage":["https://openalex.org/P4310320508"],"host_organization_lineage_names":["Society for Industrial and Applied Mathematics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SIAM Review","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6499999761581421,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":19,"referenced_works":["https://openalex.org/W656657393","https://openalex.org/W1553703513","https://openalex.org/W1580192384","https://openalex.org/W1977148992","https://openalex.org/W1977361859","https://openalex.org/W2005754838","https://openalex.org/W2014402117","https://openalex.org/W2017890773","https://openalex.org/W2036431175","https://openalex.org/W2037673983","https://openalex.org/W2055908589","https://openalex.org/W2062389073","https://openalex.org/W2074379480","https://openalex.org/W2077106134","https://openalex.org/W2506139098","https://openalex.org/W3017370189","https://openalex.org/W3044656254","https://openalex.org/W3155918544","https://openalex.org/W4235973454"],"related_works":["https://openalex.org/W2009206460","https://openalex.org/W2080979385","https://openalex.org/W1599327342","https://openalex.org/W2883324043","https://openalex.org/W4256361922","https://openalex.org/W2913894168","https://openalex.org/W3130189623","https://openalex.org/W2531780059","https://openalex.org/W2491060300","https://openalex.org/W566188680"],"abstract_inverted_index":{"Resin":[0],"transfer":[1],"molding":[2],"(RTM)":[3],"has":[4],"drawn":[5],"interest":[6],"in":[7,25,53,103,108,170],"recent":[8,104],"years":[9,105],"as":[10,115,155],"an":[11,81,116],"attractive":[12],"technique":[13],"for":[14],"the":[15,31,36,58,69,84,126,132,137,150,167],"manufacture":[16],"of":[17,33,63,71,83,98,136,146,152,160],"advanced":[18],"fiber-reinforced":[19],"composite":[20],"materials.":[21],"A":[22,96],"major":[23,140,157],"issue":[24],"this":[26,64,77,109,147],"new":[27],"manufacturing":[28,88,141],"process":[29,39,59],"is":[30,50,66,94,128,149,164,169],"reduction":[32],"voids":[34],"during":[35],"resin":[37],"fill":[38],"so":[40],"that":[41,166],"products":[42],"with":[43,173],"high":[44],"quality":[45],"are":[46,111],"manufactured.":[47],"Process":[48],"modeling":[49,75],"particularly":[51],"useful":[52],"understanding,":[54],"designing,":[55],"and":[56,73,90,134],"optimizing":[57],"conditions.":[60],"The":[61,143],"purpose":[62],"paper":[65],"to":[67,76,130],"illustrate":[68],"importance":[70],"mathematical":[72],"numerical":[74],"industrial":[78],"problem.":[79,142],"First,":[80],"overview":[82],"RTM":[85,100],"process,":[86],"its":[87],"problems,":[89],"related":[91],"background":[92],"issues":[93],"given.":[95],"survey":[97],"various":[99],"models":[101],"developed":[102,123],"by":[106,125],"researchers":[107],"field":[110],"then":[112],"presented.":[113],"Finally,":[114],"application,":[117],"a":[118,139,156],"novel":[119],"two-phase":[120],"flow":[121],"model,":[122],"recently":[124],"authors,":[127],"proposed":[129],"study":[131],"formation":[133],"migration":[135],"macrovoids,":[138],"unique":[144],"feature":[145],"model":[148,168],"identification":[151],"local":[153],"pressure":[154],"mobilization":[158],"factor":[159],"these":[161],"macrovoids.":[162],"It":[163],"demonstrated":[165],"good":[171],"agreement":[172],"experimental":[174],"results.":[175]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":2},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":4},{"year":2014,"cited_by_count":2},{"year":2013,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}