{"id":"https://openalex.org/W4220921179","doi":"https://doi.org/10.1117/12.2622457","title":"The high variety of image wafer inspection field","display_name":"The high variety of image wafer inspection field","publication_year":2022,"publication_date":"2022-03-05","ids":{"openalex":"https://openalex.org/W4220921179","doi":"https://doi.org/10.1117/12.2622457"},"language":"en","primary_location":{"id":"doi:10.1117/12.2622457","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.2622457","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Fourteenth International Conference on Machine Vision (ICMV 2021)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5109064750","display_name":"M. Barone","orcid":null},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"massimiliano barone","raw_affiliation_strings":["STMicroelectronics (Italy)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics (Italy)","institution_ids":["https://openalex.org/I4210154781"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5087662674","display_name":"Matteo Fedeli","orcid":"https://orcid.org/0000-0002-7083-6183"},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Matteo Fedeli","raw_affiliation_strings":["STMicroelectronics (Italy)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics (Italy)","institution_ids":["https://openalex.org/I4210154781"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4210154781"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.01756153,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"1571","issue":null,"first_page":"6","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12549","display_name":"Image and Object Detection Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12549","display_name":"Image and Object Detection Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9969000220298767,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9968000054359436,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.9365614652633667},{"id":"https://openalex.org/keywords/variety","display_name":"Variety (cybernetics)","score":0.6056159138679504},{"id":"https://openalex.org/keywords/field","display_name":"Field (mathematics)","score":0.6016376614570618},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5442902445793152},{"id":"https://openalex.org/keywords/wafer-scale-integration","display_name":"Wafer-scale integration","score":0.5408334136009216},{"id":"https://openalex.org/keywords/image","display_name":"Image (mathematics)","score":0.4546350836753845},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.43669548630714417},{"id":"https://openalex.org/keywords/wafer-level-packaging","display_name":"Wafer-level packaging","score":0.4366464614868164},{"id":"https://openalex.org/keywords/computer-vision","display_name":"Computer vision","score":0.42562180757522583},{"id":"https://openalex.org/keywords/scale","display_name":"Scale (ratio)","score":0.4139782190322876},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.3434944152832031},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.29501664638519287},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.15823134779930115},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.13297471404075623},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.0943804681301117}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.9365614652633667},{"id":"https://openalex.org/C136197465","wikidata":"https://www.wikidata.org/wiki/Q1729295","display_name":"Variety (cybernetics)","level":2,"score":0.6056159138679504},{"id":"https://openalex.org/C9652623","wikidata":"https://www.wikidata.org/wiki/Q190109","display_name":"Field (mathematics)","level":2,"score":0.6016376614570618},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5442902445793152},{"id":"https://openalex.org/C2778638305","wikidata":"https://www.wikidata.org/wiki/Q7406100","display_name":"Wafer-scale integration","level":3,"score":0.5408334136009216},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.4546350836753845},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.43669548630714417},{"id":"https://openalex.org/C2780288131","wikidata":"https://www.wikidata.org/wiki/Q4017648","display_name":"Wafer-level packaging","level":3,"score":0.4366464614868164},{"id":"https://openalex.org/C31972630","wikidata":"https://www.wikidata.org/wiki/Q844240","display_name":"Computer vision","level":1,"score":0.42562180757522583},{"id":"https://openalex.org/C2778755073","wikidata":"https://www.wikidata.org/wiki/Q10858537","display_name":"Scale (ratio)","level":2,"score":0.4139782190322876},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.3434944152832031},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.29501664638519287},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.15823134779930115},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.13297471404075623},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0943804681301117},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C202444582","wikidata":"https://www.wikidata.org/wiki/Q837863","display_name":"Pure mathematics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1117/12.2622457","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.2622457","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Fourteenth International Conference on Machine Vision (ICMV 2021)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W1975419982","https://openalex.org/W2095905764","https://openalex.org/W2149659501","https://openalex.org/W4247465271","https://openalex.org/W4248384978"],"related_works":["https://openalex.org/W2156194080","https://openalex.org/W2070188681","https://openalex.org/W2140660040","https://openalex.org/W2171369689","https://openalex.org/W4400034431","https://openalex.org/W2970498257","https://openalex.org/W2041316527","https://openalex.org/W2146366317","https://openalex.org/W2036313051","https://openalex.org/W2164231539"],"abstract_inverted_index":{"This":[0,54],"paper":[1],"contains":[2],"three":[3],"different":[4,59],"problems":[5],"and":[6,36,60,68],"solutions":[7,57],"for":[8],"detecting":[9],"defects":[10],"in":[11],"very":[12,58],"large-scale":[13],"integration":[14],"of":[15,26,63],"wafer":[16,27,33,51],"images.":[17],"The":[18],"goal":[19],"is":[20],"to":[21,42],"explain":[22],"the":[23,44,49],"typical":[24],"categories":[25],"inspection":[28,52],"problems:":[29],"topology,":[30],"device":[31],"inspection,":[32],"analysis.":[34],"Unusual":[35],"particular":[37],"cases":[38],"have":[39],"been":[40],"selected":[41],"show":[43],"high":[45],"problem":[46],"variety":[47],"into":[48],"same":[50],"field.":[53],"aspect":[55],"implies":[56],"specific":[61],"variations":[62],"classic":[64],"image":[65],"analysis":[66],"techniques":[67],"computer":[69],"vision":[70],"methods.":[71]},"counts_by_year":[],"updated_date":"2026-07-30T17:31:21.811387","created_date":"2025-10-10T00:00:00"}