{"id":"https://openalex.org/W2467585673","doi":"https://doi.org/10.1115/1.4034010","title":"Mass Customization: Reuse of Digital Slicing for Additive Manufacturing","display_name":"Mass Customization: Reuse of Digital Slicing for Additive Manufacturing","publication_year":2016,"publication_date":"2016-07-01","ids":{"openalex":"https://openalex.org/W2467585673","doi":"https://doi.org/10.1115/1.4034010","mag":"2467585673"},"language":"en","primary_location":{"id":"doi:10.1115/1.4034010","is_oa":false,"landing_page_url":"https://doi.org/10.1115/1.4034010","pdf_url":null,"source":{"id":"https://openalex.org/S173178594","display_name":"Journal of Computing and Information Science in Engineering","issn_l":"1530-9827","issn":["1530-9827","1944-7078"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310316053","host_organization_name":"ASM International","host_organization_lineage":["https://openalex.org/P4310316053"],"host_organization_lineage_names":["ASM International"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Computing and Information Science in Engineering","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5003860243","display_name":"Tsz-Ho Kwok","orcid":"https://orcid.org/0000-0001-7240-1426"},"institutions":[{"id":"https://openalex.org/I1174212","display_name":"University of Southern California","ror":"https://ror.org/03taz7m60","country_code":"US","type":"education","lineage":["https://openalex.org/I1174212"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Tsz-Ho Kwok","raw_affiliation_strings":["Epstein Department of Industrial and Systems Engineering, University of Southern California, Los Angeles, CA 90089 e-mail:"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Epstein Department of Industrial and Systems Engineering, University of Southern California, Los Angeles, CA 90089 e-mail:","institution_ids":["https://openalex.org/I1174212"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101981436","display_name":"Hang Ye","orcid":"https://orcid.org/0000-0001-7618-2128"},"institutions":[{"id":"https://openalex.org/I63190737","display_name":"University at Buffalo, State University of New York","ror":"https://ror.org/01y64my43","country_code":"US","type":"education","lineage":["https://openalex.org/I63190737"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Hang Ye","raw_affiliation_strings":["Department of Industrial and Systems Engineering, University at Buffalo, The State University of New York, Buffalo, NY 14260 e-mail:"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Industrial and Systems Engineering, University at Buffalo, The State University of New York, Buffalo, NY 14260 e-mail:","institution_ids":["https://openalex.org/I63190737"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100454424","display_name":"Yong Chen","orcid":"https://orcid.org/0000-0002-8377-5914"},"institutions":[{"id":"https://openalex.org/I1174212","display_name":"University of Southern California","ror":"https://ror.org/03taz7m60","country_code":"US","type":"education","lineage":["https://openalex.org/I1174212"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Yong Chen","raw_affiliation_strings":["Epstein Department of Industrial and Systems Engineering, University of Southern California, Los Angeles, CA 90089 e-mail:"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Epstein Department of Industrial and Systems Engineering, University of Southern California, Los Angeles, CA 90089 e-mail:","institution_ids":["https://openalex.org/I1174212"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5005807077","display_name":"Chi Zhou","orcid":"https://orcid.org/0000-0001-7230-3754"},"institutions":[{"id":"https://openalex.org/I63190737","display_name":"University at Buffalo, State University of New York","ror":"https://ror.org/01y64my43","country_code":"US","type":"education","lineage":["https://openalex.org/I63190737"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Chi Zhou","raw_affiliation_strings":["Department of Industrial and Systems Engineering, University at Buffalo, The State University of New York, Buffalo, NY 14260 e-mail:"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Industrial and Systems Engineering, University at Buffalo, The State University of New York, Buffalo, NY 14260 e-mail:","institution_ids":["https://openalex.org/I63190737"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5035679293","display_name":"Wenyao Xu","orcid":"https://orcid.org/0000-0001-6444-9411"},"institutions":[{"id":"https://openalex.org/I63190737","display_name":"University at Buffalo, State University of New York","ror":"https://ror.org/01y64my43","country_code":"US","type":"education","lineage":["https://openalex.org/I63190737"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Wenyao Xu","raw_affiliation_strings":["Department of Computer Science and Engineering, University at Buffalo, The State University of New York, Buffalo, NY 14260 e-mail:"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Computer Science and Engineering, University at Buffalo, The State University of New York, Buffalo, NY 14260 e-mail:","institution_ids":["https://openalex.org/I63190737"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5003860243","https://openalex.org/A5005807077","https://openalex.org/A5035679293","https://openalex.org/A5100454424","https://openalex.org/A5101981436"],"corresponding_institution_ids":["https://openalex.org/I1174212","https://openalex.org/I63190737"],"apc_list":null,"apc_paid":null,"fwci":2.8919,"has_fulltext":false,"cited_by_count":24,"citation_normalized_percentile":{"value":0.91229217,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":"17","issue":"2","first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.995199978351593,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10789","display_name":"Interactive and Immersive Displays","score":0.9943000078201294,"subfield":{"id":"https://openalex.org/subfields/1709","display_name":"Human-Computer Interaction"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/slicing","display_name":"Slicing","score":0.9548238515853882},{"id":"https://openalex.org/keywords/mass-customization","display_name":"Mass customization","score":0.8657154440879822},{"id":"https://openalex.org/keywords/reuse","display_name":"Reuse","score":0.7337159514427185},{"id":"https://openalex.org/keywords/prefabrication","display_name":"Prefabrication","score":0.7125037908554077},{"id":"https://openalex.org/keywords/fixture","display_name":"Fixture","score":0.6871545314788818},{"id":"https://openalex.org/keywords/bottleneck","display_name":"Bottleneck","score":0.6078977584838867},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.594545304775238},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5164037346839905},{"id":"https://openalex.org/keywords/personalization","display_name":"Personalization","score":0.5155906081199646},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.47828778624534607},{"id":"https://openalex.org/keywords/3d-printing","display_name":"3D printing","score":0.47434771060943604},{"id":"https://openalex.org/keywords/modular-design","display_name":"Modular design","score":0.4692302346229553},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.462552934885025},{"id":"https://openalex.org/keywords/digital-manufacturing","display_name":"Digital manufacturing","score":0.4452296495437622},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3016418218612671},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.23805680871009827},{"id":"https://openalex.org/keywords/computer-graphics","display_name":"Computer graphics (images)","score":0.14125829935073853},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.13345032930374146},{"id":"https://openalex.org/keywords/programming-language","display_name":"Programming language","score":0.11304262280464172}],"concepts":[{"id":"https://openalex.org/C2776190703","wikidata":"https://www.wikidata.org/wiki/Q488148","display_name":"Slicing","level":2,"score":0.9548238515853882},{"id":"https://openalex.org/C72414096","wikidata":"https://www.wikidata.org/wiki/Q1367461","display_name":"Mass customization","level":3,"score":0.8657154440879822},{"id":"https://openalex.org/C206588197","wikidata":"https://www.wikidata.org/wiki/Q846574","display_name":"Reuse","level":2,"score":0.7337159514427185},{"id":"https://openalex.org/C40011592","wikidata":"https://www.wikidata.org/wiki/Q2086008","display_name":"Prefabrication","level":2,"score":0.7125037908554077},{"id":"https://openalex.org/C2781122048","wikidata":"https://www.wikidata.org/wiki/Q15983064","display_name":"Fixture","level":2,"score":0.6871545314788818},{"id":"https://openalex.org/C2780513914","wikidata":"https://www.wikidata.org/wiki/Q18210350","display_name":"Bottleneck","level":2,"score":0.6078977584838867},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.594545304775238},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5164037346839905},{"id":"https://openalex.org/C183003079","wikidata":"https://www.wikidata.org/wiki/Q1000371","display_name":"Personalization","level":2,"score":0.5155906081199646},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.47828778624534607},{"id":"https://openalex.org/C524769229","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3D printing","level":2,"score":0.47434771060943604},{"id":"https://openalex.org/C101468663","wikidata":"https://www.wikidata.org/wiki/Q1620158","display_name":"Modular design","level":2,"score":0.4692302346229553},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.462552934885025},{"id":"https://openalex.org/C2780841897","wikidata":"https://www.wikidata.org/wiki/Q25349015","display_name":"Digital manufacturing","level":2,"score":0.4452296495437622},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3016418218612671},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.23805680871009827},{"id":"https://openalex.org/C121684516","wikidata":"https://www.wikidata.org/wiki/Q7600677","display_name":"Computer graphics (images)","level":1,"score":0.14125829935073853},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.13345032930374146},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.11304262280464172},{"id":"https://openalex.org/C147176958","wikidata":"https://www.wikidata.org/wiki/Q77590","display_name":"Civil engineering","level":1,"score":0.0},{"id":"https://openalex.org/C136764020","wikidata":"https://www.wikidata.org/wiki/Q466","display_name":"World Wide Web","level":1,"score":0.0},{"id":"https://openalex.org/C548081761","wikidata":"https://www.wikidata.org/wiki/Q180388","display_name":"Waste management","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1115/1.4034010","is_oa":false,"landing_page_url":"https://doi.org/10.1115/1.4034010","pdf_url":null,"source":{"id":"https://openalex.org/S173178594","display_name":"Journal of Computing and Information Science in Engineering","issn_l":"1530-9827","issn":["1530-9827","1944-7078"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310316053","host_organization_name":"ASM International","host_organization_lineage":["https://openalex.org/P4310316053"],"host_organization_lineage_names":["ASM International"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Computing and Information Science in Engineering","raw_type":"journal-article"},{"id":"pmh:oai:repository.hkust.edu.hk:1783.1-168140","is_oa":false,"landing_page_url":"http://repository.hkust.edu.hk/ir/Record/1783.1-168140","pdf_url":null,"source":{"id":"https://openalex.org/S4306401796","display_name":"Rare & Special e-Zone (The Hong Kong University of Science and Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I200769079","host_organization_name":"Hong Kong University of Science and Technology","host_organization_lineage":["https://openalex.org/I200769079"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"Article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":30,"referenced_works":["https://openalex.org/W1586219442","https://openalex.org/W1972964777","https://openalex.org/W1982613041","https://openalex.org/W2003566876","https://openalex.org/W2005999035","https://openalex.org/W2021167140","https://openalex.org/W2026952216","https://openalex.org/W2034328776","https://openalex.org/W2047155108","https://openalex.org/W2048454024","https://openalex.org/W2054907434","https://openalex.org/W2057435075","https://openalex.org/W2077927386","https://openalex.org/W2079556076","https://openalex.org/W2098443654","https://openalex.org/W2104313947","https://openalex.org/W2111501452","https://openalex.org/W2123910845","https://openalex.org/W2127310512","https://openalex.org/W2136757884","https://openalex.org/W2143030836","https://openalex.org/W2149458426","https://openalex.org/W2155943302","https://openalex.org/W2160692760","https://openalex.org/W2184312624","https://openalex.org/W2186712078","https://openalex.org/W2802042737","https://openalex.org/W3009720000","https://openalex.org/W4233370650","https://openalex.org/W4239223006"],"related_works":["https://openalex.org/W2012466698","https://openalex.org/W3127554906","https://openalex.org/W2740744134","https://openalex.org/W2467585673","https://openalex.org/W2943103049","https://openalex.org/W2735996861","https://openalex.org/W1579486013","https://openalex.org/W1971052392","https://openalex.org/W4321353534","https://openalex.org/W4206555819"],"abstract_inverted_index":{"Additive":[0],"manufacturing,":[1],"also":[2],"known":[3],"as":[4],"three-dimensional":[5],"(3D)":[6],"printing,":[7,41],"enables":[8],"production":[9,62],"of":[10,35,96,115,127,152,158],"complex":[11],"customized":[12,106],"shapes":[13],"without":[14],"requiring":[15],"specialized":[16],"tooling":[17],"and":[18,20,42,162],"fixture,":[19],"mass":[21,90],"customization":[22],"can":[23,130],"then":[24,69],"be":[25,48,100,131],"realized":[26],"with":[27,117],"larger":[28],"adoption.":[29],"The":[30,65],"slicing":[31,44,66,125,153],"procedure":[32,67],"is":[33,68,165],"one":[34,82,128],"the":[36,43,56,71,74,105,124,137,150,176],"fundamental":[37],"tasks":[38],"for":[39,51,81,133],"3D":[40],"resolution":[45],"has":[46,155],"to":[47,99,171],"very":[49],"high":[50],"fine":[52],"fabrication,":[53],"especially":[54],"in":[55,73,89,110,136,175],"recent":[57],"developed":[58],"continuous":[59],"liquid":[60],"interface":[61],"(CLIP)":[63],"process.":[64,178],"becoming":[70],"bottleneck":[72],"prefabrication":[75,177],"process,":[76],"which":[77],"could":[78],"take":[79],"hours":[80],"model.":[83],"This":[84],"becomes":[85],"even":[86],"more":[87,168],"significant":[88],"customization,":[91],"where":[92],"hundreds":[93],"or":[94],"thousands":[95],"models":[97,135],"have":[98],"fabricated.":[101],"We":[102],"observe":[103],"that":[104,123,149],"products":[107],"are":[108],"generally":[109],"a":[111,142,156],"same":[112,138],"homogeneous":[113,139],"class":[114],"shape":[116],"small":[118],"variation.":[119],"Our":[120],"study":[121],"finds":[122],"information":[126,154],"model":[129],"reused":[132],"other":[134],"group":[140],"under":[141],"properly":[143],"defined":[144],"parameterization.":[145],"Experimental":[146],"results":[147],"show":[148],"reuse":[151],"maximum":[157],"50":[159],"times":[160],"speedup,":[161],"its":[163],"utilization":[164],"dropped":[166],"from":[167],"than":[169,173],"90%":[170],"less":[172],"50%":[174]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":3},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":4},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":6},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":1}],"updated_date":"2026-05-23T08:51:43.019350","created_date":"2025-10-10T00:00:00"}