{"id":"https://openalex.org/W3193966704","doi":"https://doi.org/10.1109/whc49131.2021.9517139","title":"Pneumatic Concave Deformable Device and Finger Deformation-Based Evaluation for Hardness Perception","display_name":"Pneumatic Concave Deformable Device and Finger Deformation-Based Evaluation for Hardness Perception","publication_year":2021,"publication_date":"2021-07-06","ids":{"openalex":"https://openalex.org/W3193966704","doi":"https://doi.org/10.1109/whc49131.2021.9517139","mag":"3193966704"},"language":"en","primary_location":{"id":"doi:10.1109/whc49131.2021.9517139","is_oa":false,"landing_page_url":"https://doi.org/10.1109/whc49131.2021.9517139","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE World Haptics Conference (WHC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101620980","display_name":"Kentaro Yoshida","orcid":"https://orcid.org/0000-0003-4201-8682"},"institutions":[{"id":"https://openalex.org/I4210122684","display_name":"Sony Computer Science Laboratories","ror":"https://ror.org/02nc46417","country_code":"JP","type":"facility","lineage":["https://openalex.org/I4210122684"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Kentaro Yoshida","raw_affiliation_strings":["R&D Center, Sony Group Corporation,Tokyo Laboratory 25,Tokyo,Japan"],"affiliations":[{"raw_affiliation_string":"R&D Center, Sony Group Corporation,Tokyo Laboratory 25,Tokyo,Japan","institution_ids":["https://openalex.org/I4210122684"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5002113575","display_name":"Hiroshi Suzuki","orcid":"https://orcid.org/0000-0001-5371-6385"},"institutions":[{"id":"https://openalex.org/I4210122684","display_name":"Sony Computer Science Laboratories","ror":"https://ror.org/02nc46417","country_code":"JP","type":"facility","lineage":["https://openalex.org/I4210122684"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hiroshi Suzuki","raw_affiliation_strings":["R&D Center, Sony Group Corporation,Tokyo Laboratory 25,Tokyo,Japan"],"affiliations":[{"raw_affiliation_string":"R&D Center, Sony Group Corporation,Tokyo Laboratory 25,Tokyo,Japan","institution_ids":["https://openalex.org/I4210122684"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110127411","display_name":"Hironobu Abe","orcid":null},"institutions":[{"id":"https://openalex.org/I4210122684","display_name":"Sony Computer Science Laboratories","ror":"https://ror.org/02nc46417","country_code":"JP","type":"facility","lineage":["https://openalex.org/I4210122684"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hironobu Abe","raw_affiliation_strings":["R&D Center, Sony Group Corporation,Tokyo Laboratory 25,Tokyo,Japan"],"affiliations":[{"raw_affiliation_string":"R&D Center, Sony Group Corporation,Tokyo Laboratory 25,Tokyo,Japan","institution_ids":["https://openalex.org/I4210122684"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102179857","display_name":"Akira Ono","orcid":null},"institutions":[{"id":"https://openalex.org/I4210122684","display_name":"Sony Computer Science Laboratories","ror":"https://ror.org/02nc46417","country_code":"JP","type":"facility","lineage":["https://openalex.org/I4210122684"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Akira Ono","raw_affiliation_strings":["R&D Center, Sony Group Corporation,Tokyo Laboratory 25,Tokyo,Japan"],"affiliations":[{"raw_affiliation_string":"R&D Center, Sony Group Corporation,Tokyo Laboratory 25,Tokyo,Japan","institution_ids":["https://openalex.org/I4210122684"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080142109","display_name":"Hiroto Kawaguchi","orcid":null},"institutions":[{"id":"https://openalex.org/I4210122684","display_name":"Sony Computer Science Laboratories","ror":"https://ror.org/02nc46417","country_code":"JP","type":"facility","lineage":["https://openalex.org/I4210122684"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hiroto Kawaguchi","raw_affiliation_strings":["R&D Center, Sony Group Corporation,Tokyo Laboratory 25,Tokyo,Japan"],"affiliations":[{"raw_affiliation_string":"R&D Center, Sony Group Corporation,Tokyo Laboratory 25,Tokyo,Japan","institution_ids":["https://openalex.org/I4210122684"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026575535","display_name":"Masahiro Sato","orcid":"https://orcid.org/0000-0003-0000-6341"},"institutions":[{"id":"https://openalex.org/I4210122684","display_name":"Sony Computer Science Laboratories","ror":"https://ror.org/02nc46417","country_code":"JP","type":"facility","lineage":["https://openalex.org/I4210122684"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Masahiro Sato","raw_affiliation_strings":["R&D Center, Sony Group Corporation,Tokyo Laboratory 25,Tokyo,Japan"],"affiliations":[{"raw_affiliation_string":"R&D Center, Sony Group Corporation,Tokyo Laboratory 25,Tokyo,Japan","institution_ids":["https://openalex.org/I4210122684"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081556756","display_name":"Yota Komoriya","orcid":null},"institutions":[{"id":"https://openalex.org/I4210122684","display_name":"Sony Computer Science Laboratories","ror":"https://ror.org/02nc46417","country_code":"JP","type":"facility","lineage":["https://openalex.org/I4210122684"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yota Komoriya","raw_affiliation_strings":["R&D Center, Sony Group Corporation,Tokyo Laboratory 25,Tokyo,Japan"],"affiliations":[{"raw_affiliation_string":"R&D Center, Sony Group Corporation,Tokyo Laboratory 25,Tokyo,Japan","institution_ids":["https://openalex.org/I4210122684"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5035167247","display_name":"Kazunobu Ohkuri","orcid":null},"institutions":[{"id":"https://openalex.org/I4210122684","display_name":"Sony Computer Science Laboratories","ror":"https://ror.org/02nc46417","country_code":"JP","type":"facility","lineage":["https://openalex.org/I4210122684"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Kazunobu Ohkuri","raw_affiliation_strings":["R&D Center, Sony Group Corporation,Tokyo Laboratory 25,Tokyo,Japan"],"affiliations":[{"raw_affiliation_string":"R&D Center, Sony Group Corporation,Tokyo Laboratory 25,Tokyo,Japan","institution_ids":["https://openalex.org/I4210122684"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":8,"corresponding_author_ids":["https://openalex.org/A5101620980"],"corresponding_institution_ids":["https://openalex.org/I4210122684"],"apc_list":null,"apc_paid":null,"fwci":0.4661,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.58956451,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10914","display_name":"Tactile and Sensory Interactions","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2805","display_name":"Cognitive Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},"topics":[{"id":"https://openalex.org/T10914","display_name":"Tactile and Sensory Interactions","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2805","display_name":"Cognitive Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T11687","display_name":"Teleoperation and Haptic Systems","score":0.9865000247955322,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10982","display_name":"Motor Control and Adaptation","score":0.9848999977111816,"subfield":{"id":"https://openalex.org/subfields/2805","display_name":"Cognitive Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/deformation","display_name":"Deformation (meteorology)","score":0.6355971097946167},{"id":"https://openalex.org/keywords/stiffness","display_name":"Stiffness","score":0.6097363829612732},{"id":"https://openalex.org/keywords/silicone-rubber","display_name":"Silicone rubber","score":0.55012047290802},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5429278612136841},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5160519480705261},{"id":"https://openalex.org/keywords/indentation-hardness","display_name":"Indentation hardness","score":0.4715298116207123},{"id":"https://openalex.org/keywords/haptic-technology","display_name":"Haptic technology","score":0.4619797468185425},{"id":"https://openalex.org/keywords/set","display_name":"Set (abstract data type)","score":0.4133566617965698},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.3844773769378662},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.3660394251346588},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.3498704135417938},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.2785692811012268},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1659969985485077},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.13182750344276428}],"concepts":[{"id":"https://openalex.org/C204366326","wikidata":"https://www.wikidata.org/wiki/Q3027650","display_name":"Deformation (meteorology)","level":2,"score":0.6355971097946167},{"id":"https://openalex.org/C2779372316","wikidata":"https://www.wikidata.org/wiki/Q569057","display_name":"Stiffness","level":2,"score":0.6097363829612732},{"id":"https://openalex.org/C2776290925","wikidata":"https://www.wikidata.org/wiki/Q4115245","display_name":"Silicone rubber","level":2,"score":0.55012047290802},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5429278612136841},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5160519480705261},{"id":"https://openalex.org/C165720898","wikidata":"https://www.wikidata.org/wiki/Q3150000","display_name":"Indentation hardness","level":3,"score":0.4715298116207123},{"id":"https://openalex.org/C152086174","wikidata":"https://www.wikidata.org/wiki/Q3030571","display_name":"Haptic technology","level":2,"score":0.4619797468185425},{"id":"https://openalex.org/C177264268","wikidata":"https://www.wikidata.org/wiki/Q1514741","display_name":"Set (abstract data type)","level":2,"score":0.4133566617965698},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.3844773769378662},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3660394251346588},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.3498704135417938},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.2785692811012268},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1659969985485077},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.13182750344276428},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/whc49131.2021.9517139","is_oa":false,"landing_page_url":"https://doi.org/10.1109/whc49131.2021.9517139","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE World Haptics Conference (WHC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":18,"referenced_works":["https://openalex.org/W166788368","https://openalex.org/W966060558","https://openalex.org/W1543518438","https://openalex.org/W1965519186","https://openalex.org/W1982398658","https://openalex.org/W2010523787","https://openalex.org/W2049928807","https://openalex.org/W2051530567","https://openalex.org/W2071356986","https://openalex.org/W2074112147","https://openalex.org/W2153999925","https://openalex.org/W2340935928","https://openalex.org/W2346706974","https://openalex.org/W2462263954","https://openalex.org/W2970587642","https://openalex.org/W3094950365","https://openalex.org/W4235910938","https://openalex.org/W6784576841"],"related_works":["https://openalex.org/W8168029","https://openalex.org/W8042011","https://openalex.org/W9481008","https://openalex.org/W6745180","https://openalex.org/W8829849","https://openalex.org/W6910841","https://openalex.org/W8904193","https://openalex.org/W2007563","https://openalex.org/W5544438","https://openalex.org/W5084714"],"abstract_inverted_index":{"Modifying":[0],"and":[1,14,38,48,55,71],"controlling":[2],"hardness":[3,47,102],"on":[4,83],"the":[5,35,39,98,126,143],"same":[6],"surface":[7],"are":[8],"very":[9],"useful":[10],"for":[11,17],"digitizing":[12],"realistic":[13,46],"intuitive":[15],"interactions":[16],"many":[18],"use":[19],"cases.":[20],"We":[21,92,130],"propose":[22,78],"a":[23,28,61,79,104,109,116,133],"novel":[24],"haptic":[25],"device":[26,54,96,140],"with":[27,58,89,123],"dual-layered":[29],"air":[30],"structure":[31],"to":[32,67,100,115,136],"control":[33],"both":[34,69],"reaction":[36],"force":[37],"three-dimensional":[40],"(3-D)":[41],"concave":[42],"deformation":[43,85],"that":[44,94,138],"provides":[45],"softness.":[49],"To":[50],"physically":[51],"evaluate":[52],"this":[53],"other":[56],"objects":[57,88],"various":[59,90],"hardness,":[60],"measurement":[62,128],"system":[63],"is":[64],"set":[65],"up":[66],"acquire":[68],"kinesthetic":[70],"cutaneous":[72,80],"profiles":[73],"simultaneously.":[74],"In":[75],"particular,":[76],"we":[77],"profile":[81],"based":[82],"finger":[84],"when":[86],"pushing":[87],"hardnesses.":[91],"show":[93],"our":[95,139],"has":[97],"potential":[99],"present":[101],"over":[103],"high":[105],"dynamic":[106],"range":[107],"from":[108],"sponge":[110],"specimen":[111],"(stiffness:":[112,120],"0.544":[113],"N/mm)":[114,122],"hard":[117],"silicone":[118],"rubber":[119],"5.304":[121],"evaluation":[124],"using":[125],"aforementioned":[127],"system.":[129],"also":[131],"conduct":[132],"psychophysical":[134],"experiment":[135],"confirm":[137],"can":[141],"change":[142],"perception":[144],"of":[145],"hardness.":[146]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}