{"id":"https://openalex.org/W2023976101","doi":"https://doi.org/10.1109/test.2012.6401566","title":"A unified method for parametric fault characterization of post-bond TSVs","display_name":"A unified method for parametric fault characterization of post-bond TSVs","publication_year":2012,"publication_date":"2012-11-01","ids":{"openalex":"https://openalex.org/W2023976101","doi":"https://doi.org/10.1109/test.2012.6401566","mag":"2023976101"},"language":"en","primary_location":{"id":"doi:10.1109/test.2012.6401566","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2012.6401566","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 IEEE International Test Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5110832349","display_name":"Yu-Hsiang Lin","orcid":"https://orcid.org/0000-0003-0581-257X"},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"Yu-Hsiang Lin","raw_affiliation_strings":["Electrical Engineering Department, National Tsing Hua University, Taiwan","Electrical Engineering Dept., National Tsing Hua University, Taiwan"],"affiliations":[{"raw_affiliation_string":"Electrical Engineering Department, National Tsing Hua University, Taiwan","institution_ids":["https://openalex.org/I25846049"]},{"raw_affiliation_string":"Electrical Engineering Dept., National Tsing Hua University, Taiwan","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040618488","display_name":"Shi-Yu Huang","orcid":null},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Shi-Yu Huang","raw_affiliation_strings":["Electrical Engineering Department, National Tsing Hua University, Taiwan","Electrical Engineering Dept., National Tsing Hua University, Taiwan"],"affiliations":[{"raw_affiliation_string":"Electrical Engineering Department, National Tsing Hua University, Taiwan","institution_ids":["https://openalex.org/I25846049"]},{"raw_affiliation_string":"Electrical Engineering Dept., National Tsing Hua University, Taiwan","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064587514","display_name":"Kun-Han Tsai","orcid":"https://orcid.org/0000-0001-8919-8663"},"institutions":[{"id":"https://openalex.org/I4210099704","display_name":"Mentor","ror":"https://ror.org/016grqh48","country_code":"GB","type":"nonprofit","lineage":["https://openalex.org/I4210099704"]},{"id":"https://openalex.org/I105695857","display_name":"Siemens (Hungary)","ror":"https://ror.org/01rk7mv85","country_code":"HU","type":"company","lineage":["https://openalex.org/I105695857","https://openalex.org/I1325886976"]}],"countries":["GB","HU"],"is_corresponding":false,"raw_author_name":"Kun-Han Tsai","raw_affiliation_strings":["Silicon Test Solutions, Mentor Graphics"],"affiliations":[{"raw_affiliation_string":"Silicon Test Solutions, Mentor Graphics","institution_ids":["https://openalex.org/I105695857","https://openalex.org/I4210099704"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5020407423","display_name":"Wu-Tung Cheng","orcid":"https://orcid.org/0000-0001-6327-2394"},"institutions":[{"id":"https://openalex.org/I4210099704","display_name":"Mentor","ror":"https://ror.org/016grqh48","country_code":"GB","type":"nonprofit","lineage":["https://openalex.org/I4210099704"]},{"id":"https://openalex.org/I105695857","display_name":"Siemens (Hungary)","ror":"https://ror.org/01rk7mv85","country_code":"HU","type":"company","lineage":["https://openalex.org/I105695857","https://openalex.org/I1325886976"]}],"countries":["GB","HU"],"is_corresponding":false,"raw_author_name":"Wu-Tung Cheng","raw_affiliation_strings":["Silicon Test Solutions, Mentor Graphics","Silicon Test Solutions, Mentor Graphics#TAB#"],"affiliations":[{"raw_affiliation_string":"Silicon Test Solutions, Mentor Graphics","institution_ids":["https://openalex.org/I105695857","https://openalex.org/I4210099704"]},{"raw_affiliation_string":"Silicon Test Solutions, Mentor Graphics#TAB#","institution_ids":["https://openalex.org/I105695857"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5063906167","display_name":"Stephen Sunter","orcid":null},"institutions":[{"id":"https://openalex.org/I4210099704","display_name":"Mentor","ror":"https://ror.org/016grqh48","country_code":"GB","type":"nonprofit","lineage":["https://openalex.org/I4210099704"]},{"id":"https://openalex.org/I105695857","display_name":"Siemens (Hungary)","ror":"https://ror.org/01rk7mv85","country_code":"HU","type":"company","lineage":["https://openalex.org/I105695857","https://openalex.org/I1325886976"]}],"countries":["GB","HU"],"is_corresponding":false,"raw_author_name":"Stephen Sunter","raw_affiliation_strings":["Silicon Test Solutions, Mentor Graphics","Silicon Test Solutions, Mentor Graphics#TAB#"],"affiliations":[{"raw_affiliation_string":"Silicon Test Solutions, Mentor Graphics","institution_ids":["https://openalex.org/I105695857","https://openalex.org/I4210099704"]},{"raw_affiliation_string":"Silicon Test Solutions, Mentor Graphics#TAB#","institution_ids":["https://openalex.org/I105695857"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5110832349"],"corresponding_institution_ids":["https://openalex.org/I25846049"],"apc_list":null,"apc_paid":null,"fwci":2.2095,"has_fulltext":false,"cited_by_count":15,"citation_normalized_percentile":{"value":0.88412062,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"10"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/parametric-statistics","display_name":"Parametric statistics","score":0.8285740613937378},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5317935347557068},{"id":"https://openalex.org/keywords/fault","display_name":"Fault (geology)","score":0.5155320167541504},{"id":"https://openalex.org/keywords/fault-coverage","display_name":"Fault coverage","score":0.4452294111251831},{"id":"https://openalex.org/keywords/characterization","display_name":"Characterization (materials science)","score":0.42028215527534485},{"id":"https://openalex.org/keywords/leakage","display_name":"Leakage (economics)","score":0.4200558662414551},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.41899290680885315},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.37130671739578247},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.09395316243171692},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.092529296875},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.07176801562309265},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.06167513132095337}],"concepts":[{"id":"https://openalex.org/C117251300","wikidata":"https://www.wikidata.org/wiki/Q1849855","display_name":"Parametric statistics","level":2,"score":0.8285740613937378},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5317935347557068},{"id":"https://openalex.org/C175551986","wikidata":"https://www.wikidata.org/wiki/Q47089","display_name":"Fault (geology)","level":2,"score":0.5155320167541504},{"id":"https://openalex.org/C126953365","wikidata":"https://www.wikidata.org/wiki/Q5438152","display_name":"Fault coverage","level":3,"score":0.4452294111251831},{"id":"https://openalex.org/C2780841128","wikidata":"https://www.wikidata.org/wiki/Q5073781","display_name":"Characterization (materials science)","level":2,"score":0.42028215527534485},{"id":"https://openalex.org/C2777042071","wikidata":"https://www.wikidata.org/wiki/Q6509304","display_name":"Leakage (economics)","level":2,"score":0.4200558662414551},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.41899290680885315},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.37130671739578247},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.09395316243171692},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.092529296875},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.07176801562309265},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.06167513132095337},{"id":"https://openalex.org/C162324750","wikidata":"https://www.wikidata.org/wiki/Q8134","display_name":"Economics","level":0,"score":0.0},{"id":"https://openalex.org/C165205528","wikidata":"https://www.wikidata.org/wiki/Q83371","display_name":"Seismology","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.0},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0},{"id":"https://openalex.org/C139719470","wikidata":"https://www.wikidata.org/wiki/Q39680","display_name":"Macroeconomics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.2012.6401566","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2012.6401566","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 IEEE International Test Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":28,"referenced_works":["https://openalex.org/W1583788531","https://openalex.org/W1985664729","https://openalex.org/W1987638749","https://openalex.org/W2009282987","https://openalex.org/W2013679798","https://openalex.org/W2055841712","https://openalex.org/W2064712157","https://openalex.org/W2095790208","https://openalex.org/W2102304175","https://openalex.org/W2107304970","https://openalex.org/W2115150721","https://openalex.org/W2116426145","https://openalex.org/W2122592588","https://openalex.org/W2122750932","https://openalex.org/W2124414146","https://openalex.org/W2130727809","https://openalex.org/W2132155220","https://openalex.org/W2133276614","https://openalex.org/W2143502515","https://openalex.org/W2143875880","https://openalex.org/W2150113875","https://openalex.org/W2154221003","https://openalex.org/W2158323053","https://openalex.org/W3144072891","https://openalex.org/W3148506408","https://openalex.org/W4245501382","https://openalex.org/W4254966959","https://openalex.org/W4255435342"],"related_works":["https://openalex.org/W3107994849","https://openalex.org/W4247143848","https://openalex.org/W2009883749","https://openalex.org/W2735573198","https://openalex.org/W29442446","https://openalex.org/W330727063","https://openalex.org/W2896904446","https://openalex.org/W1483407203","https://openalex.org/W4206825956","https://openalex.org/W2383699822"],"abstract_inverted_index":{"A":[0],"TSV":[1,37],"in":[2,118],"a":[3,16,21,36,52,60,89,100,110,115],"3D":[4],"IC":[5],"could":[6],"suffer":[7],"from":[8],"two":[9],"major":[10],"types":[11,98],"of":[12,35,99,114],"parametric":[13,27,96,116],"faults":[14,28],"\u2014":[15],"resistive":[17],"open":[18],"fault,":[19],"or":[20,44],"leakage":[22],"fault.":[23,54],"Dealing":[24],"with":[25,51],"these":[26],"(which":[29],"do":[30],"not":[31,58],"destroy":[32],"the":[33],"functionality":[34],"completely":[38],"but":[39],"only":[40],"degrade":[41],"its":[42],"quality":[43],"performance)":[45],"is":[46],"often":[47],"trickier":[48],"than":[49],"dealing":[50],"stuck-at":[53],"Previous":[55],"works":[56],"have":[57],"proposed":[59],"unified":[61,90],"test":[62,76],"structure":[63],"and":[64],"method":[65],"that":[66],"can":[67,107],"characterize":[68],"their":[69],"respective":[70],"effects.":[71],"Based":[72],"on":[73],"our":[74],"previous":[75],"structure,":[77],"called":[78],"VOT":[79],"(Variable":[80],"Output":[81],"Threshold)":[82],"scheme":[83],"for":[84,94],"delay":[85],"faults,":[86],"we":[87],"propose":[88],"in-situ":[91],"characterization":[92],"flow":[93],"both":[95],"fault":[97,117],"post-bond":[101],"TSV.":[102],"With":[103],"this":[104],"flow,":[105],"one":[106],"easily":[108],"derive":[109],"more":[111],"insightful":[112],"assessment":[113],"production":[119],"test,":[120],"process":[121],"monitoring,":[122],"and/or":[123],"diagnosis-driven":[124],"yield":[125],"learning.":[126]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":2},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":5},{"year":2013,"cited_by_count":3},{"year":2012,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}