{"id":"https://openalex.org/W1965342624","doi":"https://doi.org/10.1109/test.2010.5699233","title":"RADPro: Automatic RF analyzer and diagnostic program generation tool","display_name":"RADPro: Automatic RF analyzer and diagnostic program generation tool","publication_year":2010,"publication_date":"2010-11-01","ids":{"openalex":"https://openalex.org/W1965342624","doi":"https://doi.org/10.1109/test.2010.5699233","mag":"1965342624"},"language":"en","primary_location":{"id":"doi:10.1109/test.2010.5699233","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2010.5699233","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE International Test Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5016961561","display_name":"Sukeshwar Kannan","orcid":"https://orcid.org/0000-0003-4107-2126"},"institutions":[{"id":"https://openalex.org/I17301866","display_name":"University of Alabama","ror":"https://ror.org/03xrrjk67","country_code":"US","type":"education","lineage":["https://openalex.org/I17301866"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Sukeshwar Kannan","raw_affiliation_strings":["University of Alabama, Tuscaloosa, AL, USA"],"affiliations":[{"raw_affiliation_string":"University of Alabama, Tuscaloosa, AL, USA","institution_ids":["https://openalex.org/I17301866"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5038200638","display_name":"Bruce Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I17301866","display_name":"University of Alabama","ror":"https://ror.org/03xrrjk67","country_code":"US","type":"education","lineage":["https://openalex.org/I17301866"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Bruce Kim","raw_affiliation_strings":["University of Alabama, Tuscaloosa, AL, USA"],"affiliations":[{"raw_affiliation_string":"University of Alabama, Tuscaloosa, AL, USA","institution_ids":["https://openalex.org/I17301866"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Ganesh Srinivasan","orcid":null},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ganesh Srinivasan","raw_affiliation_strings":["Texas Instruments Inc., Dallas, TX, USA"],"affiliations":[{"raw_affiliation_string":"Texas Instruments Inc., Dallas, TX, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5059687445","display_name":"Friedrich Taenzlar","orcid":null},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Friedrich Taenzlar","raw_affiliation_strings":["Texas Instruments Inc., Dallas, TX, USA"],"affiliations":[{"raw_affiliation_string":"Texas Instruments Inc., Dallas, TX, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039436237","display_name":"Richard Antley","orcid":null},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Richard Antley","raw_affiliation_strings":["Texas Instruments Inc., Dallas, TX, USA"],"affiliations":[{"raw_affiliation_string":"Texas Instruments Inc., Dallas, TX, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111519825","display_name":"C. Force","orcid":null},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Craig Force","raw_affiliation_strings":["Texas Instruments Inc., Dallas, TX, USA"],"affiliations":[{"raw_affiliation_string":"Texas Instruments Inc., Dallas, TX, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5055390099","display_name":"Falah Mohammed","orcid":"https://orcid.org/0000-0002-6127-6292"},"institutions":[{"id":"https://openalex.org/I17533244","display_name":"An-Najah National University","ror":"https://ror.org/0046mja08","country_code":"PS","type":"education","lineage":["https://openalex.org/I17533244"]}],"countries":["PS"],"is_corresponding":false,"raw_author_name":"Falah Mohammed","raw_affiliation_strings":["AN-Najah National University","An-Najah\uc2a0National\uc2a0University, UAE"],"affiliations":[{"raw_affiliation_string":"AN-Najah National University","institution_ids":["https://openalex.org/I17533244"]},{"raw_affiliation_string":"An-Najah\uc2a0National\uc2a0University, UAE","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5016961561"],"corresponding_institution_ids":["https://openalex.org/I17301866"],"apc_list":null,"apc_paid":null,"fwci":0.7581,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.71491024,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"40","issue":null,"first_page":"1","last_page":"9"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6545674800872803},{"id":"https://openalex.org/keywords/spectrum-analyzer","display_name":"Spectrum analyzer","score":0.6519417762756348},{"id":"https://openalex.org/keywords/fault","display_name":"Fault (geology)","score":0.5762283205986023},{"id":"https://openalex.org/keywords/software","display_name":"Software","score":0.5612552165985107},{"id":"https://openalex.org/keywords/interface","display_name":"Interface (matter)","score":0.5202904343605042},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.47135037183761597},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.42878013849258423},{"id":"https://openalex.org/keywords/radio-frequency","display_name":"Radio frequency","score":0.4244334399700165},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.39293497800827026},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.37055477499961853},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.35627278685569763},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2567194998264313},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.24727565050125122},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.12414869666099548},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.0897531807422638}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6545674800872803},{"id":"https://openalex.org/C158007255","wikidata":"https://www.wikidata.org/wiki/Q1055222","display_name":"Spectrum analyzer","level":2,"score":0.6519417762756348},{"id":"https://openalex.org/C175551986","wikidata":"https://www.wikidata.org/wiki/Q47089","display_name":"Fault (geology)","level":2,"score":0.5762283205986023},{"id":"https://openalex.org/C2777904410","wikidata":"https://www.wikidata.org/wiki/Q7397","display_name":"Software","level":2,"score":0.5612552165985107},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.5202904343605042},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.47135037183761597},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.42878013849258423},{"id":"https://openalex.org/C74064498","wikidata":"https://www.wikidata.org/wiki/Q3396184","display_name":"Radio frequency","level":2,"score":0.4244334399700165},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.39293497800827026},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.37055477499961853},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.35627278685569763},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2567194998264313},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.24727565050125122},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.12414869666099548},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0897531807422638},{"id":"https://openalex.org/C129307140","wikidata":"https://www.wikidata.org/wiki/Q6795880","display_name":"Maximum bubble pressure method","level":3,"score":0.0},{"id":"https://openalex.org/C165205528","wikidata":"https://www.wikidata.org/wiki/Q83371","display_name":"Seismology","level":1,"score":0.0},{"id":"https://openalex.org/C157915830","wikidata":"https://www.wikidata.org/wiki/Q2928001","display_name":"Bubble","level":2,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.2010.5699233","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2010.5699233","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE International Test Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320306087","display_name":"Semiconductor Research Corporation","ror":"https://ror.org/047z4n946"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1570112013","https://openalex.org/W2009655452","https://openalex.org/W2097987516","https://openalex.org/W2098748406","https://openalex.org/W2143430176","https://openalex.org/W2147950732","https://openalex.org/W2150295846","https://openalex.org/W2154349525","https://openalex.org/W2158422339","https://openalex.org/W2171824977","https://openalex.org/W2206810374"],"related_works":["https://openalex.org/W2391061712","https://openalex.org/W2599361292","https://openalex.org/W2094171095","https://openalex.org/W4252608911","https://openalex.org/W4231462422","https://openalex.org/W2184913151","https://openalex.org/W2018394392","https://openalex.org/W2360439310","https://openalex.org/W2389426768","https://openalex.org/W2546380746"],"abstract_inverted_index":{"This":[0],"paper":[1],"provides":[2,38],"development":[3],"of":[4],"an":[5],"RF":[6,28],"circuit":[7,33],"software":[8],"tool":[9,21,37],"that":[10],"generates":[11],"diagnostic":[12,20,36],"programs":[13],"automatically":[14],"for":[15],"device":[16],"interface":[17],"boards.":[18,34],"The":[19,35],"utilizes":[22],"novel":[23],"techniques":[24],"to":[25,49],"differentiate":[26],"faulty":[27],"circuits":[29],"embedded":[30],"in":[31],"printed":[32],"user-transparent":[39],"pseudocodes":[40],"with":[41],"high":[42],"fault":[43],"coverage":[44],"and":[45],"significantly":[46],"decreases":[47],"time":[48],"market.":[50]},"counts_by_year":[],"updated_date":"2026-04-16T08:26:57.006410","created_date":"2025-10-10T00:00:00"}