{"id":"https://openalex.org/W2095836882","doi":"https://doi.org/10.1109/test.2007.4437599","title":"Implementing bead probe technology for in-circuit test: A case study","display_name":"Implementing bead probe technology for in-circuit test: A case study","publication_year":2007,"publication_date":"2007-01-01","ids":{"openalex":"https://openalex.org/W2095836882","doi":"https://doi.org/10.1109/test.2007.4437599","mag":"2095836882"},"language":"en","primary_location":{"id":"doi:10.1109/test.2007.4437599","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2007.4437599","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2007 IEEE International Test Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5061551460","display_name":"M.P. Farrell","orcid":null},"institutions":[{"id":"https://openalex.org/I138285227","display_name":"Agilent Technologies (United States)","ror":"https://ror.org/02tryst02","country_code":"US","type":"company","lineage":["https://openalex.org/I138285227"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Mike Farrell","raw_affiliation_strings":["Agilent Technologies, Inc., Loveland, CO, USA","Agilent Technol., Loveland, CO"],"affiliations":[{"raw_affiliation_string":"Agilent Technologies, Inc., Loveland, CO, USA","institution_ids":["https://openalex.org/I138285227"]},{"raw_affiliation_string":"Agilent Technol., Loveland, CO","institution_ids":["https://openalex.org/I138285227"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5097036758","display_name":"Glen Leinbach","orcid":null},"institutions":[{"id":"https://openalex.org/I78801874","display_name":"Phoenix Contact (United States)","ror":"https://ror.org/02av1as94","country_code":"US","type":"company","lineage":["https://openalex.org/I4210155348","https://openalex.org/I78801874"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Glen Leinbach","raw_affiliation_strings":["Caber Contacts Limited Liability Company, Fort Collins, CO, USA","Caber Contacts, LLC, Fort Collins, Colorado, USA"],"affiliations":[{"raw_affiliation_string":"Caber Contacts Limited Liability Company, Fort Collins, CO, USA","institution_ids":["https://openalex.org/I78801874"]},{"raw_affiliation_string":"Caber Contacts, LLC, Fort Collins, Colorado, USA","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5061551460"],"corresponding_institution_ids":["https://openalex.org/I138285227"],"apc_list":null,"apc_paid":null,"fwci":0.3512,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.65704752,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"8"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/bead","display_name":"Bead","score":0.7375354766845703},{"id":"https://openalex.org/keywords/fixture","display_name":"Fixture","score":0.7277209758758545},{"id":"https://openalex.org/keywords/debugging","display_name":"Debugging","score":0.6024629473686218},{"id":"https://openalex.org/keywords/original-equipment-manufacturer","display_name":"Original equipment manufacturer","score":0.5967416167259216},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.5761659145355225},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5031830668449402},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.4776774048805237},{"id":"https://openalex.org/keywords/test-fixture","display_name":"Test fixture","score":0.46700891852378845},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.4434196650981903},{"id":"https://openalex.org/keywords/wafer-testing","display_name":"Wafer testing","score":0.435829758644104},{"id":"https://openalex.org/keywords/test","display_name":"Test (biology)","score":0.42056310176849365},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.36350613832473755},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.351461261510849},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.244276225566864},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.2274894416332245},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.20379865169525146},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.17280590534210205},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.09548348188400269}],"concepts":[{"id":"https://openalex.org/C109386097","wikidata":"https://www.wikidata.org/wiki/Q1053956","display_name":"Bead","level":2,"score":0.7375354766845703},{"id":"https://openalex.org/C2781122048","wikidata":"https://www.wikidata.org/wiki/Q15983064","display_name":"Fixture","level":2,"score":0.7277209758758545},{"id":"https://openalex.org/C168065819","wikidata":"https://www.wikidata.org/wiki/Q845566","display_name":"Debugging","level":2,"score":0.6024629473686218},{"id":"https://openalex.org/C68694590","wikidata":"https://www.wikidata.org/wiki/Q267558","display_name":"Original equipment manufacturer","level":2,"score":0.5967416167259216},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.5761659145355225},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5031830668449402},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.4776774048805237},{"id":"https://openalex.org/C2778502540","wikidata":"https://www.wikidata.org/wiki/Q1141613","display_name":"Test fixture","level":2,"score":0.46700891852378845},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4434196650981903},{"id":"https://openalex.org/C44445679","wikidata":"https://www.wikidata.org/wiki/Q2538844","display_name":"Wafer testing","level":3,"score":0.435829758644104},{"id":"https://openalex.org/C2777267654","wikidata":"https://www.wikidata.org/wiki/Q3519023","display_name":"Test (biology)","level":2,"score":0.42056310176849365},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.36350613832473755},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.351461261510849},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.244276225566864},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.2274894416332245},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.20379865169525146},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.17280590534210205},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.09548348188400269},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.2007.4437599","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2007.4437599","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2007 IEEE International Test Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.5699999928474426}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W1983461458","https://openalex.org/W1992903374","https://openalex.org/W2060267258","https://openalex.org/W2102447831","https://openalex.org/W2166556330","https://openalex.org/W2170265555","https://openalex.org/W4246604342"],"related_works":["https://openalex.org/W2520989350","https://openalex.org/W2043574796","https://openalex.org/W2528338088","https://openalex.org/W2122638535","https://openalex.org/W2392619146","https://openalex.org/W2946005993","https://openalex.org/W1917079085","https://openalex.org/W4313176842","https://openalex.org/W2171539806","https://openalex.org/W2114914214"],"abstract_inverted_index":{"A":[0],"major":[1],"OEM":[2],"implements":[3],"bead":[4,41],"probe":[5,42],"technology":[6,43],"on":[7],"a":[8,37],"new":[9],"design":[10],"to":[11,68],"gain":[12],"test":[13,53,62],"access":[14],"and":[15,28,56,61],"coverage":[16],"of":[17,31,36,40],"high-speed":[18],"circuits.":[19],"Conventional":[20],"probing":[21,63],"techniques":[22],"are":[23,44],"incompatible":[24],"with":[25],"the":[26,32,66],"density":[27],"speed":[29],"requirements":[30],"board.":[33],"The":[34],"experiences":[35],"first":[38],"implementation":[39],"discussed":[45],"here,":[46],"including":[47],"CAD":[48],"issues":[49],"at":[50],"board":[51],"layout,":[52],"fixture":[54],"construction":[55],"debug,":[57],"soldering":[58],"process":[59],"difficulties,":[60],"problems":[64],"during":[65],"ramp":[67],"high-volume":[69],"production.":[70]},"counts_by_year":[{"year":2017,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}