{"id":"https://openalex.org/W1593636933","doi":"https://doi.org/10.1109/test.1999.805872","title":"Static Component Interconnection Test Technology (SCITT)","display_name":"Static Component Interconnection Test Technology (SCITT)","publication_year":2005,"publication_date":"2005-08-24","ids":{"openalex":"https://openalex.org/W1593636933","doi":"https://doi.org/10.1109/test.1999.805872","mag":"1593636933"},"language":"en","primary_location":{"id":"doi:10.1109/test.1999.805872","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.1999.805872","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Test Conference 1999. Proceedings (IEEE Cat. No.99CH37034)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5063090251","display_name":"S. Hellmold","orcid":null},"institutions":[{"id":"https://openalex.org/I4210094759","display_name":"Fujitsu (United States)","ror":"https://ror.org/0073whr05","country_code":"US","type":"company","lineage":["https://openalex.org/I2252096349","https://openalex.org/I4210094759"]},{"id":"https://openalex.org/I4210159607","display_name":"Fujitsu (China)","ror":"https://ror.org/04w4yzw62","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210159607"]}],"countries":["CN","US"],"is_corresponding":true,"raw_author_name":"S. Hellmold","raw_affiliation_strings":["Fujitsu Microelectronics, Inc., San Jose, CA, USA","FUJITSU MICROELECTRONICS INC"],"affiliations":[{"raw_affiliation_string":"Fujitsu Microelectronics, Inc., San Jose, CA, USA","institution_ids":["https://openalex.org/I4210094759"]},{"raw_affiliation_string":"FUJITSU MICROELECTRONICS INC","institution_ids":["https://openalex.org/I4210159607"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5063090251"],"corresponding_institution_ids":["https://openalex.org/I4210094759","https://openalex.org/I4210159607"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.06212768,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1140","last_page":"1140"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9961000084877014,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9961000084877014,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9932000041007996,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9921000003814697,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7326486110687256},{"id":"https://openalex.org/keywords/component","display_name":"Component (thermodynamics)","score":0.6850596070289612},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5293479561805725},{"id":"https://openalex.org/keywords/test","display_name":"Test (biology)","score":0.4960063397884369},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.3379243314266205},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.18703320622444153},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.17627659440040588},{"id":"https://openalex.org/keywords/geology","display_name":"Geology","score":0.1596640944480896},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.07338413596153259}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7326486110687256},{"id":"https://openalex.org/C168167062","wikidata":"https://www.wikidata.org/wiki/Q1117970","display_name":"Component (thermodynamics)","level":2,"score":0.6850596070289612},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5293479561805725},{"id":"https://openalex.org/C2777267654","wikidata":"https://www.wikidata.org/wiki/Q3519023","display_name":"Test (biology)","level":2,"score":0.4960063397884369},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.3379243314266205},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.18703320622444153},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.17627659440040588},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.1596640944480896},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.07338413596153259},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.1999.805872","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.1999.805872","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Test Conference 1999. Proceedings (IEEE Cat. No.99CH37034)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.5400000214576721}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W2155019192","https://openalex.org/W2014709025","https://openalex.org/W2358668433","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W4249035840","https://openalex.org/W2766970861","https://openalex.org/W2382290278"],"abstract_inverted_index":{"In":[0],"a":[1,12,34],"collaboration":[2],"initiated":[3],"in":[4],"1997,":[5],"Fujitsu":[6],"and":[7,38,48,57,72],"Philips":[8],"have":[9],"jointly":[10],"developed":[11],"Design-for-Test":[13],"methodology":[14],"to":[15],"facilitate":[16],"assembly":[17,41],"interconnection":[18],"testing":[19,64],"of":[20,65],"complex":[21,36],"memory":[22],"devices.":[23],"Complex":[24],"memories":[25],"require":[26],"an":[27],"initialisation":[28],"sequence":[29],"or":[30],"are":[31,45],"accessed":[32],"by":[33],"more":[35,70],"protocol":[37],"therefore":[39],"complicate":[40],"test":[42],"\u2013":[43],"examples":[44],"SDRAM,":[46],"FCRAM":[47],"Flash.":[49],"With":[50],"the":[51],"trend":[52],"towards":[53],"smaller":[54],"pin":[55],"pitch":[56],"chip":[58],"scale":[59],"packages":[60],"(CSP)":[61],"for":[62],"memories,":[63],"solder":[66],"connections":[67],"becomes":[68],"ever":[69],"complicated":[71],"expensive.":[73]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}