{"id":"https://openalex.org/W1900193705","doi":"https://doi.org/10.1109/test.1999.805761","title":"Probe contact resistance variations during elevated temperature wafer test","display_name":"Probe contact resistance variations during elevated temperature wafer test","publication_year":2003,"publication_date":"2003-01-20","ids":{"openalex":"https://openalex.org/W1900193705","doi":"https://doi.org/10.1109/test.1999.805761","mag":"1900193705"},"language":"en","primary_location":{"id":"doi:10.1109/test.1999.805761","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.1999.805761","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Test Conference 1999. Proceedings (IEEE Cat. No.99CH37034)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5073589060","display_name":"Jan Bro\u017e","orcid":"https://orcid.org/0000-0003-2465-7333"},"institutions":[{"id":"https://openalex.org/I188538660","display_name":"University of Colorado Boulder","ror":"https://ror.org/02ttsq026","country_code":"US","type":"education","lineage":["https://openalex.org/I188538660"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"J.J. Broz","raw_affiliation_strings":["Advanced Probing Systems, Inc., Boulder, CO, USA","Adv. Probing Syst. Inc., Boulder, CO, USA"],"affiliations":[{"raw_affiliation_string":"Advanced Probing Systems, Inc., Boulder, CO, USA","institution_ids":["https://openalex.org/I188538660"]},{"raw_affiliation_string":"Adv. Probing Syst. Inc., Boulder, CO, USA","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5064108017","display_name":"R.M. Rincon","orcid":"https://orcid.org/0000-0001-6827-2158"},"institutions":[{"id":"https://openalex.org/I4210090635","display_name":"Texas Instruments (France)","ror":"https://ror.org/0018whg19","country_code":"FR","type":"company","lineage":["https://openalex.org/I4210090635","https://openalex.org/I74760111"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"R.M. Rincon","raw_affiliation_strings":["TEXAS INSTRUMENTS, CORPORATION"],"affiliations":[{"raw_affiliation_string":"TEXAS INSTRUMENTS, CORPORATION","institution_ids":["https://openalex.org/I4210090635"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5073589060"],"corresponding_institution_ids":["https://openalex.org/I188538660"],"apc_list":null,"apc_paid":null,"fwci":2.0865,"has_fulltext":false,"cited_by_count":20,"citation_normalized_percentile":{"value":0.86301578,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"396","last_page":"405"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9919000267982483,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12737","display_name":"Electrical Fault Detection and Protection","score":0.9916999936103821,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/tungsten","display_name":"Tungsten","score":0.8395733833312988},{"id":"https://openalex.org/keywords/contact-resistance","display_name":"Contact resistance","score":0.8315708637237549},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7849828004837036},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.606490969657898},{"id":"https://openalex.org/keywords/aluminium","display_name":"Aluminium","score":0.5384417176246643},{"id":"https://openalex.org/keywords/alloy","display_name":"Alloy","score":0.5358774662017822},{"id":"https://openalex.org/keywords/refractory-metals","display_name":"Refractory metals","score":0.5220791697502136},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.4927254021167755},{"id":"https://openalex.org/keywords/rhenium","display_name":"Rhenium","score":0.49028924107551575},{"id":"https://openalex.org/keywords/copper","display_name":"Copper","score":0.4820747971534729},{"id":"https://openalex.org/keywords/beryllium","display_name":"Beryllium","score":0.42708495259284973},{"id":"https://openalex.org/keywords/oxidizing-agent","display_name":"Oxidizing agent","score":0.4248339533805847},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3812805414199829},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.24598708748817444},{"id":"https://openalex.org/keywords/chemistry","display_name":"Chemistry","score":0.12854960560798645},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.07762187719345093}],"concepts":[{"id":"https://openalex.org/C542268612","wikidata":"https://www.wikidata.org/wiki/Q743","display_name":"Tungsten","level":2,"score":0.8395733833312988},{"id":"https://openalex.org/C123671423","wikidata":"https://www.wikidata.org/wiki/Q332329","display_name":"Contact resistance","level":3,"score":0.8315708637237549},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7849828004837036},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.606490969657898},{"id":"https://openalex.org/C513153333","wikidata":"https://www.wikidata.org/wiki/Q663","display_name":"Aluminium","level":2,"score":0.5384417176246643},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.5358774662017822},{"id":"https://openalex.org/C95627916","wikidata":"https://www.wikidata.org/wiki/Q428932","display_name":"Refractory metals","level":2,"score":0.5220791697502136},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.4927254021167755},{"id":"https://openalex.org/C505216180","wikidata":"https://www.wikidata.org/wiki/Q737","display_name":"Rhenium","level":2,"score":0.49028924107551575},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.4820747971534729},{"id":"https://openalex.org/C506630978","wikidata":"https://www.wikidata.org/wiki/Q569","display_name":"Beryllium","level":2,"score":0.42708495259284973},{"id":"https://openalex.org/C77176794","wikidata":"https://www.wikidata.org/wiki/Q187689","display_name":"Oxidizing agent","level":2,"score":0.4248339533805847},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3812805414199829},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.24598708748817444},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.12854960560798645},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.07762187719345093},{"id":"https://openalex.org/C178790620","wikidata":"https://www.wikidata.org/wiki/Q11351","display_name":"Organic chemistry","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.1999.805761","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.1999.805761","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Test Conference 1999. Proceedings (IEEE Cat. No.99CH37034)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.49000000953674316,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320338291","display_name":"Sandia National Laboratories","ror":"https://ror.org/01apwpt12"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W1979913529","https://openalex.org/W2591181672","https://openalex.org/W4237716869"],"related_works":["https://openalex.org/W1993881130","https://openalex.org/W2746645383","https://openalex.org/W2052117432","https://openalex.org/W1978807715","https://openalex.org/W2023130851","https://openalex.org/W2181628351","https://openalex.org/W1629253117","https://openalex.org/W1998453409","https://openalex.org/W2254776752","https://openalex.org/W1995538075"],"abstract_inverted_index":{"Localized":[0],"electrical":[1],"contact":[2,10,32,77],"phenomena":[3],"during":[4,36],"wafer":[5,38],"test":[6,39],"can":[7],"significantly":[8,79],"affect":[9],"resistance":[11,33],"magnitude":[12],"and":[13,24,30,46,94,124],"stability":[14],"of":[15,87],"tungsten":[16,44],"(W),":[17],"tungsten-rhenium":[18,47],"(WRe),":[19],"beryllium-copper":[20],"(BeCu),":[21],"Pd-alloy":[22],"(Paliney-7),":[23],"metallic-alloy":[25],"(NewTek-Probe)":[26],"probes.":[27],"Typically,":[28],"increased":[29],"unstable":[31],"(C/sub":[34],"RES/)":[35],"aluminum":[37,58],"at":[40,73,102],"85/spl":[41],"deg/C":[42],"with":[43,98],"(W)":[45],"(WRe)":[48],"probe":[49,75,89],"needles":[50],"is":[51],"attributed":[52],"to":[53,69,81],"adherent":[54],"oxides":[55],"from":[56],"the":[57,74,82],"bond":[59],"pads.":[60],"New":[61],"experimental":[62],"data":[63],"indicates":[64],"that":[65],"oxide":[66],"formation":[67],"due":[68],"localized":[70],"Joule":[71],"heating":[72],"tip":[76],"\"a-Spots\"":[78],"contributes":[80],"C/sub":[83,96],"RES/":[84,97],"variations.":[85],"Use":[86],"non-oxidizing":[88],"materials":[90],"could":[91],"provide":[92],"low":[93],"stable":[95],"reduced":[99],"cleaning":[100,122],"frequency":[101],"elevated":[103],"temperatures.":[104],"Preliminary":[105],"production":[106],"level":[107],"beta":[108],"testing":[109],"on":[110],"actual":[111],"devices":[112],"using":[113],"NewTek":[114],"probes":[115],"demonstrated":[116],"significant":[117],"reductions":[118],"in":[119],"continuity":[120],"failures,":[121],"frequency,":[123],"operator":[125],"intervention.":[126]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2014,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}