{"id":"https://openalex.org/W2047400812","doi":"https://doi.org/10.1109/tcad.1987.1270343","title":"SPIDER -- A CAD System for Modeling VLSI Metallization Patterns","display_name":"SPIDER -- A CAD System for Modeling VLSI Metallization Patterns","publication_year":1987,"publication_date":"1987-11-01","ids":{"openalex":"https://openalex.org/W2047400812","doi":"https://doi.org/10.1109/tcad.1987.1270343","mag":"2047400812"},"language":"en","primary_location":{"id":"doi:10.1109/tcad.1987.1270343","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.1987.1270343","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5076936216","display_name":"James E. Hall","orcid":"https://orcid.org/0000-0002-9843-7520"},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"J.E. Hall","raw_affiliation_strings":["Semiconductor Process and Design Center, MS 369, Texas Instruments, Inc., Dallas, TX, USA"],"affiliations":[{"raw_affiliation_string":"Semiconductor Process and Design Center, MS 369, Texas Instruments, Inc., Dallas, TX, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5025259539","display_name":"D.E. Hocevar","orcid":null},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D.E. Hocevar","raw_affiliation_strings":["Semiconductor Process and Design Center, MS 369, Texas Instruments, Inc., Dallas, TX, USA"],"affiliations":[{"raw_affiliation_string":"Semiconductor Process and Design Center, MS 369, Texas Instruments, Inc., Dallas, TX, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100602962","display_name":"Ping Yang","orcid":"https://orcid.org/0000-0002-1061-3383"},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ping Yang","raw_affiliation_strings":["Semiconductor Process and Design Center, MS 369, Texas Instruments, Inc., Dallas, TX, USA"],"affiliations":[{"raw_affiliation_string":"Semiconductor Process and Design Center, MS 369, Texas Instruments, Inc., Dallas, TX, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5036770466","display_name":"M.J. McGraw","orcid":null},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M.J. McGraw","raw_affiliation_strings":["Design Automation Division, MS 3668, Texas Instruments, Inc., Dallas, TX, USA"],"affiliations":[{"raw_affiliation_string":"Design Automation Division, MS 3668, Texas Instruments, Inc., Dallas, TX, USA","institution_ids":["https://openalex.org/I74760111"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5076936216"],"corresponding_institution_ids":["https://openalex.org/I74760111"],"apc_list":null,"apc_paid":null,"fwci":3.663,"has_fulltext":false,"cited_by_count":63,"citation_normalized_percentile":{"value":0.92522953,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":"6","issue":"6","first_page":"1023","last_page":"1031"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9955999851226807,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9955999851226807,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9933000206947327,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9908999800682068,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/very-large-scale-integration","display_name":"Very-large-scale integration","score":0.7727181315422058},{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.6758686304092407},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5976439118385315},{"id":"https://openalex.org/keywords/transient","display_name":"Transient (computer programming)","score":0.5795886516571045},{"id":"https://openalex.org/keywords/waveform","display_name":"Waveform","score":0.5581122636795044},{"id":"https://openalex.org/keywords/node","display_name":"Node (physics)","score":0.5571004152297974},{"id":"https://openalex.org/keywords/cad","display_name":"CAD","score":0.5057854652404785},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.47085779905319214},{"id":"https://openalex.org/keywords/voltage-drop","display_name":"Voltage drop","score":0.45595622062683105},{"id":"https://openalex.org/keywords/spider","display_name":"Spider","score":0.4503733217716217},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.42956656217575073},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.40629181265830994},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.3228384256362915},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.22815534472465515},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.19572630524635315},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.15564486384391785},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.14554154872894287}],"concepts":[{"id":"https://openalex.org/C14580979","wikidata":"https://www.wikidata.org/wiki/Q876049","display_name":"Very-large-scale integration","level":2,"score":0.7727181315422058},{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.6758686304092407},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5976439118385315},{"id":"https://openalex.org/C2780799671","wikidata":"https://www.wikidata.org/wiki/Q17087362","display_name":"Transient (computer programming)","level":2,"score":0.5795886516571045},{"id":"https://openalex.org/C197424946","wikidata":"https://www.wikidata.org/wiki/Q1165717","display_name":"Waveform","level":3,"score":0.5581122636795044},{"id":"https://openalex.org/C62611344","wikidata":"https://www.wikidata.org/wiki/Q1062658","display_name":"Node (physics)","level":2,"score":0.5571004152297974},{"id":"https://openalex.org/C194789388","wikidata":"https://www.wikidata.org/wiki/Q17855283","display_name":"CAD","level":2,"score":0.5057854652404785},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.47085779905319214},{"id":"https://openalex.org/C82178898","wikidata":"https://www.wikidata.org/wiki/Q166839","display_name":"Voltage drop","level":3,"score":0.45595622062683105},{"id":"https://openalex.org/C2780181586","wikidata":"https://www.wikidata.org/wiki/Q3966705","display_name":"Spider","level":2,"score":0.4503733217716217},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.42956656217575073},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.40629181265830994},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.3228384256362915},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22815534472465515},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.19572630524635315},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.15564486384391785},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.14554154872894287},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C90856448","wikidata":"https://www.wikidata.org/wiki/Q431","display_name":"Zoology","level":1,"score":0.0},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tcad.1987.1270343","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.1987.1270343","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W1482483952","https://openalex.org/W1649893123","https://openalex.org/W2010649596","https://openalex.org/W2033498905","https://openalex.org/W2120553722","https://openalex.org/W2150343967","https://openalex.org/W4243990420","https://openalex.org/W6637052813","https://openalex.org/W6659065956"],"related_works":["https://openalex.org/W2004615523","https://openalex.org/W2055638565","https://openalex.org/W2138118262","https://openalex.org/W2542708587","https://openalex.org/W4229007131","https://openalex.org/W2364197307","https://openalex.org/W4381800218","https://openalex.org/W2034853009","https://openalex.org/W2381557379","https://openalex.org/W2046020806"],"abstract_inverted_index":{"A":[0],"system":[1,38],"of":[2,28,85],"CAD":[3],"programs,":[4],"called":[5],"SPIDER,":[6],"for":[7,52,59,82],"ensuring":[8],"adequate":[9],"current-carrying":[10],"capacity":[11],"in":[12],"VLSI":[13],"circuits":[14],"has":[15],"been":[16],"developed.":[17],"The":[18,37],"approach":[19],"is":[20],"hierarchical,":[21],"and":[22,25,48,76],"it":[23],"automates":[24],"simplifies":[26],"many":[27],"the":[29,34,54],"tasks":[30],"previously":[31],"performed":[32],"by":[33],"circuit":[35],"designer.":[36],"converts":[39],"transient":[40],"current":[41],"waveforms":[42],"into":[43],"dc":[44],"electromigration":[45],"equivalent":[46],"values,":[47],"includes":[49],"an":[50,79],"algorithm":[51,81],"determining":[53],"line":[55],"width":[56],"adjustments":[57],"necessary":[58],"meeting":[60],"specified":[61],"median-time-to-failure":[62],"(MTF)":[63],"requirements.":[64],"SPIDER":[65],"also":[66],"computes":[67],"voltage":[68,87],"drops":[69],"with":[70],"respect":[71],"to":[72],"a":[73,86],"reference":[74],"node":[75],"calls":[77],"upon":[78],"optimization":[80],"correcting":[83],"violations":[84],"drop":[88],"specification.":[89]},"counts_by_year":[{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2012,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}