{"id":"https://openalex.org/W2023930274","doi":"https://doi.org/10.1109/nocs.2014.7008780","title":"Introduction to the special session on “Interconnect enhances architecture: Evolution of wireless NoC from planar to 3D”","display_name":"Introduction to the special session on “Interconnect enhances architecture: Evolution of wireless NoC from planar to 3D”","publication_year":2014,"publication_date":"2014-09-01","ids":{"openalex":"https://openalex.org/W2023930274","doi":"https://doi.org/10.1109/nocs.2014.7008780","mag":"2023930274"},"language":"en","primary_location":{"id":"doi:10.1109/nocs.2014.7008780","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nocs.2014.7008780","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 Eighth IEEE/ACM International Symposium on Networks-on-Chip (NoCS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5036227385","display_name":"Radu M\u0103rculescu","orcid":"https://orcid.org/0000-0003-1826-7646"},"institutions":[{"id":"https://openalex.org/I74973139","display_name":"Carnegie Mellon University","ror":"https://ror.org/05x2bcf33","country_code":"US","type":"education","lineage":["https://openalex.org/I74973139"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Radu Marculescu","raw_affiliation_strings":["Carnegie Mellon University, United States","Carnegie-Mellon University (United States)"],"affiliations":[{"raw_affiliation_string":"Carnegie Mellon University, United States","institution_ids":["https://openalex.org/I74973139"]},{"raw_affiliation_string":"Carnegie-Mellon University (United States)","institution_ids":["https://openalex.org/I74973139"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078441163","display_name":"Partha Pratim Pande","orcid":"https://orcid.org/0000-0002-5930-8531"},"institutions":[{"id":"https://openalex.org/I72951846","display_name":"Washington State University","ror":"https://ror.org/05dk0ce17","country_code":"US","type":"education","lineage":["https://openalex.org/I72951846"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Partha Pratim Pande","raw_affiliation_strings":["Washington State University, United States","Washington state university, United States"],"affiliations":[{"raw_affiliation_string":"Washington State University, United States","institution_ids":["https://openalex.org/I72951846"]},{"raw_affiliation_string":"Washington state university, United States","institution_ids":["https://openalex.org/I72951846"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5086461408","display_name":"Deukhyoun Heo","orcid":"https://orcid.org/0000-0002-1152-1739"},"institutions":[{"id":"https://openalex.org/I72951846","display_name":"Washington State University","ror":"https://ror.org/05dk0ce17","country_code":"US","type":"education","lineage":["https://openalex.org/I72951846"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Deukhyoun Heo","raw_affiliation_strings":["Washington State University, United States","Washington state university, United States"],"affiliations":[{"raw_affiliation_string":"Washington State University, United States","institution_ids":["https://openalex.org/I72951846"]},{"raw_affiliation_string":"Washington state university, United States","institution_ids":["https://openalex.org/I72951846"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5041549339","display_name":"Hiroki Matsutani","orcid":"https://orcid.org/0000-0001-9578-3842"},"institutions":[{"id":"https://openalex.org/I203951103","display_name":"Keio University","ror":"https://ror.org/02kn6nx58","country_code":"JP","type":"education","lineage":["https://openalex.org/I203951103"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hiroki Matsutani","raw_affiliation_strings":["Keio University, Japan","(Keio University, Japan)"],"affiliations":[{"raw_affiliation_string":"Keio University, Japan","institution_ids":["https://openalex.org/I203951103"]},{"raw_affiliation_string":"(Keio University, Japan)","institution_ids":["https://openalex.org/I203951103"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5036227385"],"corresponding_institution_ids":["https://openalex.org/I74973139"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.11717287,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"174","last_page":"175"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10179","display_name":"Supercapacitor Materials and Fabrication","score":0.9921000003814697,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":0.9828000068664551,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7602581977844238},{"id":"https://openalex.org/keywords/scalability","display_name":"Scalability","score":0.6793268322944641},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.6407153606414795},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5862004160881042},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.5621471405029297},{"id":"https://openalex.org/keywords/wireless","display_name":"Wireless","score":0.5504216551780701},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.471365362405777},{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.4413851797580719},{"id":"https://openalex.org/keywords/session","display_name":"Session (web analytics)","score":0.4291263222694397},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.40685829520225525},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.39687371253967285},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.30520448088645935},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.08492740988731384}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7602581977844238},{"id":"https://openalex.org/C48044578","wikidata":"https://www.wikidata.org/wiki/Q727490","display_name":"Scalability","level":2,"score":0.6793268322944641},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.6407153606414795},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5862004160881042},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.5621471405029297},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.5504216551780701},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.471365362405777},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.4413851797580719},{"id":"https://openalex.org/C2779182362","wikidata":"https://www.wikidata.org/wiki/Q17126187","display_name":"Session (web analytics)","level":2,"score":0.4291263222694397},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.40685829520225525},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.39687371253967285},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.30520448088645935},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.08492740988731384},{"id":"https://openalex.org/C136764020","wikidata":"https://www.wikidata.org/wiki/Q466","display_name":"World Wide Web","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nocs.2014.7008780","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nocs.2014.7008780","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 Eighth IEEE/ACM International Symposium on Networks-on-Chip (NoCS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.6200000047683716}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2889526943","https://openalex.org/W2018755015","https://openalex.org/W121182129","https://openalex.org/W2502691491","https://openalex.org/W2115579119","https://openalex.org/W2017236304","https://openalex.org/W3142211975","https://openalex.org/W1879443270","https://openalex.org/W2018912978","https://openalex.org/W2119122672"],"abstract_inverted_index":{"Continuing":[0],"progress":[1],"and":[2,40,47,84],"unprecedented":[3],"integration":[4],"levels":[5],"in":[6,58],"current":[7],"silicon":[8],"technologies":[9],"make":[10],"possible":[11],"complete":[12],"end-user":[13],"systems":[14],"consisting":[15],"of":[16,21,50,65,67],"an":[17,97],"extremely":[18,76],"high":[19,85,106],"number":[20,66],"cores":[22,69],"integrated":[23],"on":[24,70],"a":[25,71,80,102],"single":[26,72],"chip":[27],"for":[28,38,110],"embedded":[29,68],"or":[30],"high-performance":[31],"computing.":[32],"However,":[33],"without":[34],"developing":[35],"new":[36],"paradigms":[37],"energy-":[39],"thermally-efficient":[41],"design,":[42],"meeting":[43],"the":[44,51,62],"computing,":[45],"storage,":[46],"communication":[48,88],"demands":[49],"emerging":[52,98],"applications":[53],"is":[54,75],"highly":[55],"unlikely.":[56],"Moreover,":[57],"order":[59],"to":[60,78,100],"sustain":[61],"predicted":[63],"growth":[64],"die,":[73],"it":[74],"important":[77],"have":[79],"scalable,":[81],"low":[82,103],"power,":[83],"bandwidth":[86,107],"on-chip":[87],"infrastructure.":[89],"Towards":[90],"this":[91],"end,":[92],"wireless":[93],"Network-on-Chip":[94],"(WiNoC)":[95],"represents":[96],"paradigm":[99],"design":[101],"power":[104],"yet":[105],"interconnect":[108],"infrastructure":[109],"multicore":[111],"chips.":[112]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}