{"id":"https://openalex.org/W4415821538","doi":"https://doi.org/10.1109/itc58126.2025.00009","title":"Chiplets\u2019 Die-to-Die Interconnect Repair Language (IRL)","display_name":"Chiplets\u2019 Die-to-Die Interconnect Repair Language (IRL)","publication_year":2025,"publication_date":"2025-09-20","ids":{"openalex":"https://openalex.org/W4415821538","doi":"https://doi.org/10.1109/itc58126.2025.00009"},"language":null,"primary_location":{"id":"doi:10.1109/itc58126.2025.00009","is_oa":false,"landing_page_url":"https://doi.org/10.1109/itc58126.2025.00009","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE International Test Conference (ITC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5016515404","display_name":"Po-Yao Chuang","orcid":"https://orcid.org/0000-0001-7325-8836"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":true,"raw_author_name":"Po-Yao Chuang","raw_affiliation_strings":["IMEC,Leuven,Belgium,3001"],"affiliations":[{"raw_affiliation_string":"IMEC,Leuven,Belgium,3001","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5044629739","display_name":"Erik Jan Marinissen","orcid":"https://orcid.org/0000-0002-5058-8303"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Erik Jan Marinissen","raw_affiliation_strings":["IMEC,Leuven,Belgium,3001"],"affiliations":[{"raw_affiliation_string":"IMEC,Leuven,Belgium,3001","institution_ids":["https://openalex.org/I4210114974"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5016515404"],"corresponding_institution_ids":["https://openalex.org/I4210114974"],"apc_list":null,"apc_paid":null,"fwci":0.8194,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.80291444,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"37","last_page":"44"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.4916999936103821,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.4916999936103821,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.1257999986410141,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.11829999834299088,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/spare-part","display_name":"Spare part","score":0.7089999914169312},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.5909000039100647},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.3578000068664551},{"id":"https://openalex.org/keywords/integrated-circuit-packaging","display_name":"Integrated circuit packaging","score":0.34540000557899475},{"id":"https://openalex.org/keywords/protocol","display_name":"Protocol (science)","score":0.33180001378059387},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.32330000400543213}],"concepts":[{"id":"https://openalex.org/C194648553","wikidata":"https://www.wikidata.org/wiki/Q1364774","display_name":"Spare part","level":2,"score":0.7089999914169312},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.5909000039100647},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5511000156402588},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.4512999951839447},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.41119998693466187},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.4106999933719635},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.3578000068664551},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.34540000557899475},{"id":"https://openalex.org/C2780385302","wikidata":"https://www.wikidata.org/wiki/Q367158","display_name":"Protocol (science)","level":3,"score":0.33180001378059387},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.32330000400543213},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.31529998779296875},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.298799991607666},{"id":"https://openalex.org/C23725684","wikidata":"https://www.wikidata.org/wiki/Q616377","display_name":"Maintenance engineering","level":2,"score":0.2736999988555908},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.2522999942302704}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/itc58126.2025.00009","is_oa":false,"landing_page_url":"https://doi.org/10.1109/itc58126.2025.00009","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE International Test Conference (ITC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1967186250","https://openalex.org/W2062899780","https://openalex.org/W2151755625","https://openalex.org/W2168584827","https://openalex.org/W2809894419","https://openalex.org/W3139679949","https://openalex.org/W3144072891","https://openalex.org/W4231021813","https://openalex.org/W4282983237","https://openalex.org/W4400034200","https://openalex.org/W4402742838"],"related_works":[],"abstract_inverted_index":{"Chips":[0],"with":[1,13,128],"multiple":[2],"interconnected":[3],"dies":[4],"in":[5,29],"a":[6,15,97,129,139],"package":[7],"offer":[8],"significant":[9],"advantages":[10],"over":[11],"those":[12],"only":[14],"single":[16],"monolithic":[17],"die":[18],"and":[19,56,107,118,124],"this":[20],"is":[21],"driving":[22],"the":[23,30,105,125,136,147],"rapid":[24],"adoption":[25],"of":[26,44,96,141],"multi-die":[27],"packages":[28],"market.":[31],"In":[32],"such":[33],"packages,":[34],"die-to-die":[35],"interconnects":[36,64],"are":[37,65,112],"typically":[38,61],"realized":[39],"as":[40,114],"large,":[41],"dense":[42],"arrays":[43],"fine-pitch":[45],"micro-bumps":[46],"or":[47],"hybrid":[48],"bonds,":[49],"prone":[50],"to":[51,67,84],"manufacturing":[52],"defects":[53],"like":[54],"shorts":[55],"opens.":[57],"To":[58],"address":[59],"this,":[60],"some":[62],"spare":[63,106],"included":[66],"\"repair\"":[68],"defective":[69],"ones.":[70],"This":[71],"paper":[72,137],"introduces":[73],"an":[74],"Interconnect":[75],"Repair":[76],"Language":[77],"(IRL),":[78],"based":[79,145],"on":[80,146],"Google\u2019s":[81],"Protocol":[82],"Buffers,":[83],"describe":[85],"all":[86],"repair":[87,98,108],"provisions.":[88],"It":[89],"also":[90],"presents":[91,138],"benefit/cost":[92],"metrics":[93,127],"for":[94],"evaluation":[95],"solution.":[99],"As":[100],"benefit":[101],"metric,":[102],"we":[103],"use":[104],"ratios,":[109],"while":[110],"costs":[111],"expressed":[113],"additional":[115],"silicon":[116],"area":[117],"propagation":[119],"delay.":[120],"We":[121],"illustrate":[122],"IRL":[123],"various":[126],"running":[130],"example":[131],"from":[132],"UCIe-Advanced":[133],"2.0.":[134],"Finally,":[135],"list":[140],"potential":[142],"EDA":[143],"tools":[144],"proposed":[148],"IRL.":[149]},"counts_by_year":[{"year":2025,"cited_by_count":1}],"updated_date":"2026-03-07T16:01:11.037858","created_date":"2025-11-03T00:00:00"}