{"id":"https://openalex.org/W3005341772","doi":"https://doi.org/10.1109/isse46696.2019.8984490","title":"Transformers: Delivering Innovative Data Center High performance computing (HPC) and Artificial Intelligence (AI) Intel\u00ae Server Systems","display_name":"Transformers: Delivering Innovative Data Center High performance computing (HPC) and Artificial Intelligence (AI) Intel\u00ae Server Systems","publication_year":2019,"publication_date":"2019-10-01","ids":{"openalex":"https://openalex.org/W3005341772","doi":"https://doi.org/10.1109/isse46696.2019.8984490","mag":"3005341772"},"language":"en","primary_location":{"id":"doi:10.1109/isse46696.2019.8984490","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isse46696.2019.8984490","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 International Symposium on Systems Engineering (ISSE)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5108727742","display_name":"Anupama Balasubramanian","orcid":null},"institutions":[{"id":"https://openalex.org/I4210158342","display_name":"Intel (United Kingdom)","ror":"https://ror.org/058cxws58","country_code":"GB","type":"company","lineage":["https://openalex.org/I1343180700","https://openalex.org/I4210158342"]}],"countries":["GB"],"is_corresponding":true,"raw_author_name":"Anupama Balasubramanian","raw_affiliation_strings":["Intel Corporation"],"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I4210158342"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080194869","display_name":"Drew Damm","orcid":null},"institutions":[{"id":"https://openalex.org/I4210158342","display_name":"Intel (United Kingdom)","ror":"https://ror.org/058cxws58","country_code":"GB","type":"company","lineage":["https://openalex.org/I1343180700","https://openalex.org/I4210158342"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Drew Damm","raw_affiliation_strings":["Intel Corporation"],"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I4210158342"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064455698","display_name":"Sam Melhem","orcid":null},"institutions":[{"id":"https://openalex.org/I4210158342","display_name":"Intel (United Kingdom)","ror":"https://ror.org/058cxws58","country_code":"GB","type":"company","lineage":["https://openalex.org/I1343180700","https://openalex.org/I4210158342"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Sam Melhem","raw_affiliation_strings":["Intel Corporation"],"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I4210158342"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060419291","display_name":"Andrew C Dausman","orcid":null},"institutions":[{"id":"https://openalex.org/I4210158342","display_name":"Intel (United Kingdom)","ror":"https://ror.org/058cxws58","country_code":"GB","type":"company","lineage":["https://openalex.org/I1343180700","https://openalex.org/I4210158342"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Andrew C Dausman","raw_affiliation_strings":["Intel Corporation"],"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I4210158342"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5011248545","display_name":"Joshua T Linden Levy","orcid":null},"institutions":[{"id":"https://openalex.org/I4210158342","display_name":"Intel (United Kingdom)","ror":"https://ror.org/058cxws58","country_code":"GB","type":"company","lineage":["https://openalex.org/I1343180700","https://openalex.org/I4210158342"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Joshua T Linden Levy","raw_affiliation_strings":["Intel Corporation"],"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I4210158342"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5029920580","display_name":"Yingqiong Bu","orcid":null},"institutions":[{"id":"https://openalex.org/I4210158342","display_name":"Intel (United Kingdom)","ror":"https://ror.org/058cxws58","country_code":"GB","type":"company","lineage":["https://openalex.org/I1343180700","https://openalex.org/I4210158342"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Yingqiong Bu","raw_affiliation_strings":["Intel Corporation"],"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I4210158342"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075808679","display_name":"Brian Mao","orcid":null},"institutions":[{"id":"https://openalex.org/I4210158342","display_name":"Intel (United Kingdom)","ror":"https://ror.org/058cxws58","country_code":"GB","type":"company","lineage":["https://openalex.org/I1343180700","https://openalex.org/I4210158342"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Brian Mao","raw_affiliation_strings":["Intel Corporation"],"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I4210158342"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5066570915","display_name":"Craig S Cauvel","orcid":null},"institutions":[{"id":"https://openalex.org/I4210158342","display_name":"Intel (United Kingdom)","ror":"https://ror.org/058cxws58","country_code":"GB","type":"company","lineage":["https://openalex.org/I1343180700","https://openalex.org/I4210158342"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Craig S Cauvel","raw_affiliation_strings":["Intel Corporation"],"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I4210158342"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":8,"corresponding_author_ids":["https://openalex.org/A5108727742"],"corresponding_institution_ids":["https://openalex.org/I4210158342"],"apc_list":null,"apc_paid":null,"fwci":0.2175,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.65714569,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.824400007724762,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.824400007724762,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10101","display_name":"Cloud Computing and Resource Management","score":0.7944999933242798,"subfield":{"id":"https://openalex.org/subfields/1710","display_name":"Information Systems"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10763","display_name":"Digital Transformation in Industry","score":0.7346000075340271,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/chassis","display_name":"Chassis","score":0.7610207796096802},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6123175621032715},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.5418004393577576},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.5124395489692688},{"id":"https://openalex.org/keywords/workbench","display_name":"Workbench","score":0.5005078315734863},{"id":"https://openalex.org/keywords/avionics","display_name":"Avionics","score":0.4919554889202118},{"id":"https://openalex.org/keywords/concurrent-engineering","display_name":"Concurrent engineering","score":0.4294787049293518},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2517854571342468}],"concepts":[{"id":"https://openalex.org/C512993513","wikidata":"https://www.wikidata.org/wiki/Q1068107","display_name":"Chassis","level":2,"score":0.7610207796096802},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6123175621032715},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5418004393577576},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.5124395489692688},{"id":"https://openalex.org/C2779145975","wikidata":"https://www.wikidata.org/wiki/Q347690","display_name":"Workbench","level":3,"score":0.5005078315734863},{"id":"https://openalex.org/C15792166","wikidata":"https://www.wikidata.org/wiki/Q221329","display_name":"Avionics","level":2,"score":0.4919554889202118},{"id":"https://openalex.org/C78382760","wikidata":"https://www.wikidata.org/wiki/Q2288649","display_name":"Concurrent engineering","level":3,"score":0.4294787049293518},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2517854571342468},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0},{"id":"https://openalex.org/C54725748","wikidata":"https://www.wikidata.org/wiki/Q7247277","display_name":"Process integration","level":2,"score":0.0},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.0},{"id":"https://openalex.org/C36464697","wikidata":"https://www.wikidata.org/wiki/Q451553","display_name":"Visualization","level":2,"score":0.0},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.0},{"id":"https://openalex.org/C21880701","wikidata":"https://www.wikidata.org/wiki/Q2144042","display_name":"Process engineering","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isse46696.2019.8984490","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isse46696.2019.8984490","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 International Symposium on Systems Engineering (ISSE)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.4300000071525574,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2388509490","https://openalex.org/W2051851664","https://openalex.org/W2378268140","https://openalex.org/W2059239878","https://openalex.org/W2109648960","https://openalex.org/W2935843774","https://openalex.org/W2050384624","https://openalex.org/W2166015079","https://openalex.org/W2658066576","https://openalex.org/W2356399074"],"abstract_inverted_index":{"In":[0],"an":[1],"environment":[2],"where":[3],"the":[4,12,40,105,121,129,148,153,173,180],"most":[5],"power":[6,198],"and":[7,33,44,54,85,89,111,158,164,170,179,193,205],"performance":[8,51],"is":[9,16,27],"needed":[10],"at":[11,19],"least":[13],"cost,":[14],"engineering":[15,31],"always":[17],"looking":[18],"how":[20,48],"to":[21,114,127,132,137,155],"optimize":[22],"existing":[23],"hardware":[24],"features.":[25],"This":[26,36,70],"done":[28],"through":[29],"system":[30],"solutions":[32],"optimized":[34],"software.":[35],"paper":[37,102],"will":[38,103],"describe":[39],"concept":[41],"architecture,":[42],"design":[43,76,191],"development":[45],"cycle":[46,131],"of":[47,202],"a":[49,72],"High":[50],"computing":[52],"(HPC)":[53],"Artificial":[55],"Intelligence":[56],"(AI)":[57],"Intel\u00ae":[58,64],"Server":[59],"System":[60],"product":[61,150,162],"family":[62],"featuring":[63],"Xeon\u00ae":[65],"Platinum":[66],"processors":[67],"was":[68,71],"manufactured.":[69],"grounds-up":[73],"server":[74],"chassis":[75,79,187],"with":[77,83,172,196],"one":[78,97],"supporting":[80],"multiple":[81],"skus":[82],"air":[84],"liquid":[86],"cooling,":[87],"half":[88],"full":[90],"width,":[91],"&":[92],"1U/2U":[93],"options":[94],"all":[95],"in":[96,184],"highly":[98],"configurable":[99],"system.":[100],"The":[101,116],"cover":[104],"unique":[106],"features":[107],"including":[108],"front":[109],"I/O":[110],"shared":[112],"cooling":[113],"start.":[115],"next":[117],"section":[118],"dives":[119],"into":[120],"modeling":[122],"techniques":[123],"used":[124],"that":[125],"allowed":[126],"compress":[128],"manufacturing":[130,194],"permit":[133],"going":[134],"from":[135],"prototype":[136],"Hard":[138],"Tool":[139],"Chassis":[140],"within":[141],"20":[142],"weeks.":[143],"Using":[144],"HT":[145],"samples":[146],"for":[147],"entire":[149],"qualification":[151],"enabled":[152],"team":[154],"shift":[156],"left":[157],"build":[159],"confidence":[160],"on":[161],"quality":[163],"reliability.":[165,206],"We":[166],"then":[167],"deep":[168],"dive":[169],"conclude":[171],"Outsource":[174],"Design":[175],"Manufacturer":[176],"(ODM)":[177],"engagement":[178],"technical":[181],"challenges":[182],"encountered":[183],"delivering":[185],"this":[186],"backed":[188],"by":[189],"Intel's":[190],"excellence":[192],"expertise":[195],"processing":[197],"enabling":[199],"high":[200],"levels":[201],"flexibility,":[203],"manageability,":[204]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2021,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}