{"id":"https://openalex.org/W2610648557","doi":"https://doi.org/10.1109/isqed.2017.7918313","title":"Evaluating the benefits of relaxed BEOL pitch for deeply scaled ICs","display_name":"Evaluating the benefits of relaxed BEOL pitch for deeply scaled ICs","publication_year":2017,"publication_date":"2017-03-01","ids":{"openalex":"https://openalex.org/W2610648557","doi":"https://doi.org/10.1109/isqed.2017.7918313","mag":"2610648557"},"language":"en","primary_location":{"id":"doi:10.1109/isqed.2017.7918313","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2017.7918313","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 18th International Symposium on Quality Electronic Design (ISQED)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5008489466","display_name":"Mehmet Meric Isgenc","orcid":"https://orcid.org/0000-0003-3601-5530"},"institutions":[{"id":"https://openalex.org/I74973139","display_name":"Carnegie Mellon University","ror":"https://ror.org/05x2bcf33","country_code":"US","type":"education","lineage":["https://openalex.org/I74973139"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Mehmet Meric Isgenc","raw_affiliation_strings":["Carnegie Mellon University, Pittsburgh, PA, US"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Carnegie Mellon University, Pittsburgh, PA, US","institution_ids":["https://openalex.org/I74973139"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060594809","display_name":"Samuel Pagliarini","orcid":"https://orcid.org/0000-0002-5294-0606"},"institutions":[{"id":"https://openalex.org/I74973139","display_name":"Carnegie Mellon University","ror":"https://ror.org/05x2bcf33","country_code":"US","type":"education","lineage":["https://openalex.org/I74973139"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Samuel Pagliarini","raw_affiliation_strings":["Carnegie Mellon University, Pittsburgh, PA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Carnegie Mellon University, Pittsburgh, PA, USA","institution_ids":["https://openalex.org/I74973139"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102842702","display_name":"Renzhi Liu","orcid":"https://orcid.org/0000-0002-4462-8006"},"institutions":[{"id":"https://openalex.org/I74973139","display_name":"Carnegie Mellon University","ror":"https://ror.org/05x2bcf33","country_code":"US","type":"education","lineage":["https://openalex.org/I74973139"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Renzhi Liu","raw_affiliation_strings":["Carnegie Mellon University, Pittsburgh, PA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Carnegie Mellon University, Pittsburgh, PA, USA","institution_ids":["https://openalex.org/I74973139"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5033242808","display_name":"Larry Pileggi","orcid":"https://orcid.org/0000-0002-8605-8240"},"institutions":[{"id":"https://openalex.org/I74973139","display_name":"Carnegie Mellon University","ror":"https://ror.org/05x2bcf33","country_code":"US","type":"education","lineage":["https://openalex.org/I74973139"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Larry Pileggi","raw_affiliation_strings":["Carnegie Mellon University, Pittsburgh, PA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Carnegie Mellon University, Pittsburgh, PA, USA","institution_ids":["https://openalex.org/I74973139"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5008489466"],"corresponding_institution_ids":["https://openalex.org/I74973139"],"apc_list":null,"apc_paid":null,"fwci":0.2694,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.47724645,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":"57","issue":null,"first_page":"180","last_page":"185"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/design-for-manufacturability","display_name":"Design for manufacturability","score":0.8808259963989258},{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.7594188451766968},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.6864776015281677},{"id":"https://openalex.org/keywords/capacitance","display_name":"Capacitance","score":0.5718132853507996},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.5448841452598572},{"id":"https://openalex.org/keywords/transistor","display_name":"Transistor","score":0.5287840962409973},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5114135146141052},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.46047133207321167},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.43934303522109985},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4103763997554779},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.40360337495803833},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.30694037675857544},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.2515206038951874},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.19504863023757935},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.13823610544204712},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.09003746509552002}],"concepts":[{"id":"https://openalex.org/C62064638","wikidata":"https://www.wikidata.org/wiki/Q553878","display_name":"Design for manufacturability","level":2,"score":0.8808259963989258},{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.7594188451766968},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.6864776015281677},{"id":"https://openalex.org/C30066665","wikidata":"https://www.wikidata.org/wiki/Q164399","display_name":"Capacitance","level":3,"score":0.5718132853507996},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5448841452598572},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.5287840962409973},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5114135146141052},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.46047133207321167},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.43934303522109985},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4103763997554779},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.40360337495803833},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.30694037675857544},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2515206038951874},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.19504863023757935},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.13823610544204712},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.09003746509552002},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/isqed.2017.7918313","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2017.7918313","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 18th International Symposium on Quality Electronic Design (ISQED)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320332180","display_name":"Defense Advanced Research Projects Agency","ror":"https://ror.org/02caytj08"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W1530625153","https://openalex.org/W1986598762","https://openalex.org/W1990215011","https://openalex.org/W1996766784","https://openalex.org/W2113222277","https://openalex.org/W2152389226","https://openalex.org/W2188437953","https://openalex.org/W2344193394","https://openalex.org/W3204577689","https://openalex.org/W6682341114"],"related_works":["https://openalex.org/W2004615523","https://openalex.org/W2055638565","https://openalex.org/W2138118262","https://openalex.org/W2542708587","https://openalex.org/W4229007131","https://openalex.org/W2364197307","https://openalex.org/W4381800218","https://openalex.org/W2034853009","https://openalex.org/W2381557379","https://openalex.org/W2046020806"],"abstract_inverted_index":{"CMOS":[0,31,83],"scaling":[1],"improves":[2],"transistor":[3,10],"density":[4],"and":[5,39,47,85,108,116,133,140],"lower":[6],"the":[7,28,50,57,65,69,100,138,145,148],"cost":[8,13,113,118,142,146],"per":[9],"at":[11,111],"a":[12,79,127],"to":[14,114,119],"other":[15],"factors.":[16],"Tall,":[17],"narrowly":[18],"spaced":[19],"wires":[20,42],"have":[21],"made":[22],"lateral":[23],"coupling":[24],"capacitance":[25],"dominant":[26],"for":[27,131],"deeply":[29],"scaled":[30],"back-end-of-line":[32],"(BEOL)":[33],"metals,":[34],"which":[35],"impacts":[36,66],"worst-case":[37],"timing":[38,109],"noise.":[40],"Narrow":[41],"further":[43],"impact":[44],"electromigration,":[45],"yield":[46],"reliability.":[48],"Since":[49],"densest":[51],"routing":[52],"does":[53],"not":[54],"certainly":[55],"provide":[56],"best":[58],"overall":[59],"design":[60,139],"quality,":[61],"we":[62,77],"systematically":[63],"evaluate":[64],"of":[67,91,147],"relaxing":[68,99],"BEOL":[70],"(r-BEOL)":[71],"pitch.":[72],"To":[73],"implement":[74],"sample":[75,93],"designs,":[76],"used":[78],"commercial":[80],"28":[81,94],"nm":[82,95],"technology":[84],"standard":[86],"physical":[87],"synthesis":[88],"tools.":[89],"Evaluation":[90],"these":[92],"designs":[96],"show":[97],"that":[98,123],"pitch":[101],"brings":[102],"improved":[103],"signal":[104],"integrity,":[105],"design-for-manufacturability":[106],"(DFM),":[107],"closure,":[110],"modest":[112],"area":[115],"no":[117],"performance.":[120],"This":[121],"suggests":[122],"r-BEOL":[124],"might":[125],"be":[126],"more":[128],"optimal":[129],"approach":[130],"low":[132],"medium":[134],"volume":[135],"products":[136],"where":[137],"masks":[141],"can":[143],"dominate":[144],"wafers.":[149]},"counts_by_year":[{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":1}],"updated_date":"2026-04-28T14:05:53.105641","created_date":"2025-10-10T00:00:00"}