{"id":"https://openalex.org/W1982802100","doi":"https://doi.org/10.1109/isqed.2012.6187497","title":"Methodology for analysis of TSV stress induced transistor variation and circuit performance","display_name":"Methodology for analysis of TSV stress induced transistor variation and circuit performance","publication_year":2012,"publication_date":"2012-03-01","ids":{"openalex":"https://openalex.org/W1982802100","doi":"https://doi.org/10.1109/isqed.2012.6187497","mag":"1982802100"},"language":"en","primary_location":{"id":"doi:10.1109/isqed.2012.6187497","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2012.6187497","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Thirteenth International Symposium on Quality Electronic Design (ISQED)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"http://hdl.handle.net/1721.1/92361","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100754132","display_name":"Yu Li","orcid":"https://orcid.org/0000-0002-4975-4896"},"institutions":[{"id":"https://openalex.org/I63966007","display_name":"Massachusetts Institute of Technology","ror":"https://ror.org/042nb2s44","country_code":"US","type":"education","lineage":["https://openalex.org/I63966007"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Li Yu","raw_affiliation_strings":["Microsystems Technology Laboratories, Massachusetts Institute of Technology, USA"],"affiliations":[{"raw_affiliation_string":"Microsystems Technology Laboratories, Massachusetts Institute of Technology, USA","institution_ids":["https://openalex.org/I63966007"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5023489172","display_name":"W. W. Chang","orcid":null},"institutions":[{"id":"https://openalex.org/I63966007","display_name":"Massachusetts Institute of Technology","ror":"https://ror.org/042nb2s44","country_code":"US","type":"education","lineage":["https://openalex.org/I63966007"]},{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW","US"],"is_corresponding":false,"raw_author_name":"Wen-Yao Chang","raw_affiliation_strings":["Microsystems Technology Laboratories, Massachusetts Institute of Technology, USA","Taiwan Semiconductor Manufacturing Company Limited, Taiwan"],"affiliations":[{"raw_affiliation_string":"Microsystems Technology Laboratories, Massachusetts Institute of Technology, USA","institution_ids":["https://openalex.org/I63966007"]},{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Company Limited, Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5043384840","display_name":"Kewei Zuo","orcid":null},"institutions":[{"id":"https://openalex.org/I63966007","display_name":"Massachusetts Institute of Technology","ror":"https://ror.org/042nb2s44","country_code":"US","type":"education","lineage":["https://openalex.org/I63966007"]},{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW","US"],"is_corresponding":false,"raw_author_name":"Kewei Zuo","raw_affiliation_strings":["Microsystems Technology Laboratories, Massachusetts Institute of Technology, USA","Taiwan Semiconductor Manufacturing Company Limited, Taiwan"],"affiliations":[{"raw_affiliation_string":"Microsystems Technology Laboratories, Massachusetts Institute of Technology, USA","institution_ids":["https://openalex.org/I63966007"]},{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Company Limited, Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5048739197","display_name":"Jean Wang","orcid":"https://orcid.org/0000-0001-7543-3917"},"institutions":[{"id":"https://openalex.org/I63966007","display_name":"Massachusetts Institute of Technology","ror":"https://ror.org/042nb2s44","country_code":"US","type":"education","lineage":["https://openalex.org/I63966007"]},{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW","US"],"is_corresponding":false,"raw_author_name":"Jean Wang","raw_affiliation_strings":["Microsystems Technology Laboratories, Massachusetts Institute of Technology, USA","Taiwan Semiconductor Manufacturing Company Limited, Taiwan"],"affiliations":[{"raw_affiliation_string":"Microsystems Technology Laboratories, Massachusetts Institute of Technology, USA","institution_ids":["https://openalex.org/I63966007"]},{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Company Limited, Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110022863","display_name":"Douglas Yu","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]},{"id":"https://openalex.org/I63966007","display_name":"Massachusetts Institute of Technology","ror":"https://ror.org/042nb2s44","country_code":"US","type":"education","lineage":["https://openalex.org/I63966007"]}],"countries":["TW","US"],"is_corresponding":false,"raw_author_name":"Douglas Yu","raw_affiliation_strings":["Microsystems Technology Laboratories, Massachusetts Institute of Technology, USA","Taiwan Semiconductor Manufacturing Company Limited, Taiwan"],"affiliations":[{"raw_affiliation_string":"Microsystems Technology Laboratories, Massachusetts Institute of Technology, USA","institution_ids":["https://openalex.org/I63966007"]},{"raw_affiliation_string":"Taiwan Semiconductor Manufacturing Company Limited, Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5066048721","display_name":"Duane S. Boning","orcid":"https://orcid.org/0000-0002-0417-445X"},"institutions":[{"id":"https://openalex.org/I63966007","display_name":"Massachusetts Institute of Technology","ror":"https://ror.org/042nb2s44","country_code":"US","type":"education","lineage":["https://openalex.org/I63966007"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Duane Boning","raw_affiliation_strings":["Microsystems Technology Laboratories, Massachusetts Institute of Technology, USA"],"affiliations":[{"raw_affiliation_string":"Microsystems Technology Laboratories, Massachusetts Institute of Technology, USA","institution_ids":["https://openalex.org/I63966007"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5100754132"],"corresponding_institution_ids":["https://openalex.org/I63966007"],"apc_list":null,"apc_paid":null,"fwci":3.9837,"has_fulltext":false,"cited_by_count":23,"citation_normalized_percentile":{"value":0.93857183,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"216","last_page":"222"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/transistor","display_name":"Transistor","score":0.674960196018219},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.5622546672821045},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5422776937484741},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.5369837880134583},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.5084273219108582},{"id":"https://openalex.org/keywords/superposition-principle","display_name":"Superposition principle","score":0.5015108585357666},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4946534335613251},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.4670986533164978},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.340352863073349},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.33208024501800537},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.26618438959121704},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.2612342834472656},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2535156011581421},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.133766770362854},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.08230102062225342}],"concepts":[{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.674960196018219},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.5622546672821045},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5422776937484741},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.5369837880134583},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.5084273219108582},{"id":"https://openalex.org/C27753989","wikidata":"https://www.wikidata.org/wiki/Q284885","display_name":"Superposition principle","level":2,"score":0.5015108585357666},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4946534335613251},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.4670986533164978},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.340352863073349},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.33208024501800537},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.26618438959121704},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2612342834472656},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2535156011581421},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.133766770362854},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.08230102062225342},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/isqed.2012.6187497","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2012.6187497","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Thirteenth International Symposium on Quality Electronic Design (ISQED)","raw_type":"proceedings-article"},{"id":"pmh:oai:dspace.mit.edu:1721.1/92361","is_oa":true,"landing_page_url":"http://hdl.handle.net/1721.1/92361","pdf_url":null,"source":{"id":"https://openalex.org/S4306400425","display_name":"DSpace@MIT (Massachusetts Institute of Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I63966007","host_organization_name":"Massachusetts Institute of Technology","host_organization_lineage":["https://openalex.org/I63966007"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-nc-sa","license_id":"https://openalex.org/licenses/cc-by-nc-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Boning","raw_type":"http://purl.org/eprint/type/ConferencePaper"}],"best_oa_location":{"id":"pmh:oai:dspace.mit.edu:1721.1/92361","is_oa":true,"landing_page_url":"http://hdl.handle.net/1721.1/92361","pdf_url":null,"source":{"id":"https://openalex.org/S4306400425","display_name":"DSpace@MIT (Massachusetts Institute of Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I63966007","host_organization_name":"Massachusetts Institute of Technology","host_organization_lineage":["https://openalex.org/I63966007"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-nc-sa","license_id":"https://openalex.org/licenses/cc-by-nc-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Boning","raw_type":"http://purl.org/eprint/type/ConferencePaper"},"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.8100000023841858,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":12,"referenced_works":["https://openalex.org/W1503603236","https://openalex.org/W2002257666","https://openalex.org/W2082499523","https://openalex.org/W2107868198","https://openalex.org/W2118294059","https://openalex.org/W2120693500","https://openalex.org/W2124955733","https://openalex.org/W2126084661","https://openalex.org/W2133543885","https://openalex.org/W2135939597","https://openalex.org/W2150620980","https://openalex.org/W2151287973"],"related_works":["https://openalex.org/W4308749380","https://openalex.org/W2037841693","https://openalex.org/W2372481764","https://openalex.org/W1977264433","https://openalex.org/W2746368218","https://openalex.org/W4308448008","https://openalex.org/W2347371661","https://openalex.org/W2012943989","https://openalex.org/W3005471417","https://openalex.org/W4221123398"],"abstract_inverted_index":{"As":[0],"continued":[1],"scaling":[2],"becomes":[3],"increasingly":[4],"difficult,":[5],"3D":[6,43],"integration":[7],"with":[8,80],"through":[9,85],"silicon":[10,36,78],"vias":[11],"(TSVs)":[12],"has":[13],"emerged":[14],"as":[15,159],"a":[16,46,54,134,141,148,160],"viable":[17],"solution":[18],"to":[19,57,101,124,129],"achieve":[20],"higher":[21],"bandwidth":[22],"and":[23,34,42,66,82,91,103,111,116,146],"power":[24],"efficiency.":[25],"Mechanical":[26],"stress":[27,63,74,98,131],"induced":[28],"by":[29],"thermal":[30,73],"mismatch":[31],"between":[32,114],"TSVs":[33,84,115],"the":[35,59,72,77,96,164],"bulk":[37],"arising":[38],"during":[39],"wafer":[40],"fabrication":[41],"integration,":[44],"is":[45,99],"key":[47],"constraint.":[48],"In":[49],"this":[50],"work,":[51],"we":[52,70,119,139],"propose":[53,120],"complete":[55],"flow":[56],"characterize":[58],"influence":[60],"of":[61,150],"TSV":[62,130,142],"on":[64,108,133],"transistor":[65,109],"circuit":[67,126],"performance.":[68],"First,":[69],"analyze":[71],"contour":[75],"near":[76],"surface":[79],"single":[81],"multiple":[83],"both":[86],"finite":[87],"element":[88],"analysis":[89],"(FEA)":[90],"linear":[92],"superposition":[93],"methods.":[94],"Then,":[95],"biaxial":[97],"converted":[100],"mobility":[102],"threshold":[104],"voltage":[105],"variations":[106],"depending":[107],"type":[110],"geometric":[112],"relation":[113],"transistors.":[117],"Next,":[118],"an":[121],"efficient":[122],"algorithm":[123],"calculate":[125],"variation":[127],"corresponding":[128],"based":[132],"grid":[135],"partition":[136],"approach.":[137,166],"Finally,":[138],"discuss":[140],"pattern":[143],"optimization":[144],"strategy,":[145],"employ":[147],"series":[149],"17-stage":[151],"ring":[152],"oscillators":[153],"using":[154],"40":[155],"nm":[156],"CMOS":[157],"technology":[158],"test":[161],"case":[162],"for":[163],"proposed":[165]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":3},{"year":2014,"cited_by_count":5},{"year":2013,"cited_by_count":6},{"year":2012,"cited_by_count":2}],"updated_date":"2026-04-04T16:13:02.066488","created_date":"2025-10-10T00:00:00"}