{"id":"https://openalex.org/W2165833230","doi":"https://doi.org/10.1109/isqed.2003.1194760","title":"Coupled simulation of circuit and piezoelectric laminates","display_name":"Coupled simulation of circuit and piezoelectric laminates","publication_year":2004,"publication_date":"2004-03-22","ids":{"openalex":"https://openalex.org/W2165833230","doi":"https://doi.org/10.1109/isqed.2003.1194760","mag":"2165833230"},"language":"en","primary_location":{"id":"doi:10.1109/isqed.2003.1194760","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2003.1194760","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Fourth International Symposium on Quality Electronic Design, 2003. Proceedings.","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101149930","display_name":"Chenggang X\u00fc","orcid":null},"institutions":[{"id":"https://openalex.org/I131249849","display_name":"Oregon State University","ror":"https://ror.org/00ysfqy60","country_code":"US","type":"education","lineage":["https://openalex.org/I131249849"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Cheng-Gang Xu","raw_affiliation_strings":["Department of ECE, Oregon State University, Corvallis, OR, USA"],"affiliations":[{"raw_affiliation_string":"Department of ECE, Oregon State University, Corvallis, OR, USA","institution_ids":["https://openalex.org/I131249849"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5015514585","display_name":"T.S. Fiez","orcid":"https://orcid.org/0000-0003-3596-2472"},"institutions":[{"id":"https://openalex.org/I131249849","display_name":"Oregon State University","ror":"https://ror.org/00ysfqy60","country_code":"US","type":"education","lineage":["https://openalex.org/I131249849"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"T. Fiez","raw_affiliation_strings":["Department of ECE, Oregon State University, Corvallis, OR, USA"],"affiliations":[{"raw_affiliation_string":"Department of ECE, Oregon State University, Corvallis, OR, USA","institution_ids":["https://openalex.org/I131249849"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5087380835","display_name":"Kartikeya Mayaram","orcid":"https://orcid.org/0000-0003-0383-7589"},"institutions":[{"id":"https://openalex.org/I131249849","display_name":"Oregon State University","ror":"https://ror.org/00ysfqy60","country_code":"US","type":"education","lineage":["https://openalex.org/I131249849"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"K. Mayaram","raw_affiliation_strings":["Department of ECE, Oregon State University, Corvallis, OR, USA"],"affiliations":[{"raw_affiliation_string":"Department of ECE, Oregon State University, Corvallis, OR, USA","institution_ids":["https://openalex.org/I131249849"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5101149930"],"corresponding_institution_ids":["https://openalex.org/I131249849"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.63157798,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"36","issue":null,"first_page":"369","last_page":"372"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11096","display_name":"Aeroelasticity and Vibration Control","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11096","display_name":"Aeroelasticity and Vibration Control","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10221","display_name":"Composite Structure Analysis and Optimization","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11870","display_name":"Structural Analysis and Optimization","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/piezoelectricity","display_name":"Piezoelectricity","score":0.8105387687683105},{"id":"https://openalex.org/keywords/capacitor","display_name":"Capacitor","score":0.6011946201324463},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.593097984790802},{"id":"https://openalex.org/keywords/spice","display_name":"Spice","score":0.5830563902854919},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.5260025262832642},{"id":"https://openalex.org/keywords/pmut","display_name":"PMUT","score":0.5107989311218262},{"id":"https://openalex.org/keywords/solver","display_name":"Solver","score":0.5044094324111938},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.47345536947250366},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.4658665657043457},{"id":"https://openalex.org/keywords/power-integrity","display_name":"Power integrity","score":0.41445672512054443},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.41046178340911865},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.35108768939971924},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.30905386805534363},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.2894478142261505},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2828250229358673},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.21536847949028015},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.1473756730556488},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.1256105899810791},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.1138593852519989}],"concepts":[{"id":"https://openalex.org/C100082104","wikidata":"https://www.wikidata.org/wiki/Q183759","display_name":"Piezoelectricity","level":2,"score":0.8105387687683105},{"id":"https://openalex.org/C52192207","wikidata":"https://www.wikidata.org/wiki/Q5322","display_name":"Capacitor","level":3,"score":0.6011946201324463},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.593097984790802},{"id":"https://openalex.org/C2780077345","wikidata":"https://www.wikidata.org/wiki/Q16891888","display_name":"Spice","level":2,"score":0.5830563902854919},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.5260025262832642},{"id":"https://openalex.org/C57693265","wikidata":"https://www.wikidata.org/wiki/Q17105295","display_name":"PMUT","level":3,"score":0.5107989311218262},{"id":"https://openalex.org/C2778770139","wikidata":"https://www.wikidata.org/wiki/Q1966904","display_name":"Solver","level":2,"score":0.5044094324111938},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.47345536947250366},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.4658665657043457},{"id":"https://openalex.org/C2777561913","wikidata":"https://www.wikidata.org/wiki/Q19599527","display_name":"Power integrity","level":4,"score":0.41445672512054443},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.41046178340911865},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.35108768939971924},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.30905386805534363},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.2894478142261505},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2828250229358673},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.21536847949028015},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.1473756730556488},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.1256105899810791},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.1138593852519989},{"id":"https://openalex.org/C44938667","wikidata":"https://www.wikidata.org/wiki/Q4503810","display_name":"Signal integrity","level":3,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/isqed.2003.1194760","is_oa":false,"landing_page_url":"https://doi.org/10.1109/isqed.2003.1194760","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Fourth International Symposium on Quality Electronic Design, 2003. Proceedings.","raw_type":"proceedings-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.409.932","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.409.932","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www.cs.york.ac.uk/rts/docs/SIGDA-Compendium-1994-2004/papers/2003/isqed03/pdffiles/5b_3.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.8100000023841858}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W1551542124","https://openalex.org/W1679748759","https://openalex.org/W2008991407","https://openalex.org/W2017681369","https://openalex.org/W2064690237","https://openalex.org/W2106902319","https://openalex.org/W2116353269","https://openalex.org/W2167135674","https://openalex.org/W2316514014","https://openalex.org/W4240512288"],"related_works":["https://openalex.org/W2912807936","https://openalex.org/W2383309909","https://openalex.org/W2102304199","https://openalex.org/W2314521183","https://openalex.org/W2352652589","https://openalex.org/W138921638","https://openalex.org/W4245694902","https://openalex.org/W3156424550","https://openalex.org/W2795688685","https://openalex.org/W2348916807"],"abstract_inverted_index":{"In":[0],"this":[1,36],"paper,":[2],"an":[3],"algorithm":[4],"for":[5,21],"the":[6,27,43,47,51],"coupled":[7,55],"simulation":[8,58],"of":[9,35,41,59],"circuit":[10],"and":[11,46],"piezoelectric":[12,22,52,67],"laminate":[13],"devices":[14],"is":[15,24,38],"presented.":[16],"A":[17],"finite":[18],"element":[19],"solver":[20],"laminates":[23],"included":[25],"in":[26,50],"SPICE":[28],"framework":[29],"as":[30],"a":[31,39],"capacitor.":[32],"The":[33,54],"charge":[34],"capacitor":[37],"function":[40],"both":[42],"terminal":[44],"voltage":[45],"mechanical":[48],"strain":[49],"material.":[53],"simulator":[56],"allows":[57],"novel":[60],"micro":[61],"power":[62],"generation":[63],"circuits":[64],"based":[65],"on":[66],"laminates.":[68]},"counts_by_year":[],"updated_date":"2026-04-05T17:49:38.594831","created_date":"2025-10-10T00:00:00"}