{"id":"https://openalex.org/W2138570749","doi":"https://doi.org/10.1109/iscid.2009.185","title":"Study on Information Management System of Rapier Loom","display_name":"Study on Information Management System of Rapier Loom","publication_year":2009,"publication_date":"2009-01-01","ids":{"openalex":"https://openalex.org/W2138570749","doi":"https://doi.org/10.1109/iscid.2009.185","mag":"2138570749"},"language":"en","primary_location":{"id":"doi:10.1109/iscid.2009.185","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscid.2009.185","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 Second International Symposium on Computational Intelligence and Design","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5066055619","display_name":"Xiao Wei-bing","orcid":"https://orcid.org/0009-0008-0891-3089"},"institutions":[{"id":"https://openalex.org/I37461747","display_name":"Wuhan University","ror":"https://ror.org/033vjfk17","country_code":"CN","type":"education","lineage":["https://openalex.org/I37461747"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Xiao Weibing","raw_affiliation_strings":["Mechanical and electrical engineering College, Wuhan University of Science and Engineering, Wuhan, China","Mech. & Electr. Eng. Coll., Wuhan Univ. of Sci. & Eng., Wuhan, China"],"affiliations":[{"raw_affiliation_string":"Mechanical and electrical engineering College, Wuhan University of Science and Engineering, Wuhan, China","institution_ids":["https://openalex.org/I37461747"]},{"raw_affiliation_string":"Mech. & Electr. Eng. Coll., Wuhan Univ. of Sci. & Eng., Wuhan, China","institution_ids":["https://openalex.org/I37461747"]}]},{"author_position":"last","author":{"id":null,"display_name":"Mei Shunqi","orcid":null},"institutions":[{"id":"https://openalex.org/I37461747","display_name":"Wuhan University","ror":"https://ror.org/033vjfk17","country_code":"CN","type":"education","lineage":["https://openalex.org/I37461747"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Mei Shunqi","raw_affiliation_strings":["Mechanical and electrical engineering College, Wuhan University of Science and Engineering, Wuhan, China","Mech. & Electr. Eng. Coll., Wuhan Univ. of Sci. & Eng., Wuhan, China"],"affiliations":[{"raw_affiliation_string":"Mechanical and electrical engineering College, Wuhan University of Science and Engineering, Wuhan, China","institution_ids":["https://openalex.org/I37461747"]},{"raw_affiliation_string":"Mech. & Electr. Eng. Coll., Wuhan Univ. of Sci. & Eng., Wuhan, China","institution_ids":["https://openalex.org/I37461747"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5066055619"],"corresponding_institution_ids":["https://openalex.org/I37461747"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.12814753,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"6","issue":null,"first_page":"150","last_page":"152"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11595","display_name":"Textile materials and evaluations","score":0.8809000253677368,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11595","display_name":"Textile materials and evaluations","score":0.8809000253677368,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/loom","display_name":"LOOM","score":0.9912830591201782},{"id":"https://openalex.org/keywords/yarn","display_name":"Yarn","score":0.6343278884887695},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6171810030937195},{"id":"https://openalex.org/keywords/textile","display_name":"Textile","score":0.5589165091514587},{"id":"https://openalex.org/keywords/microcomputer","display_name":"Microcomputer","score":0.5038229823112488},{"id":"https://openalex.org/keywords/weaving","display_name":"Weaving","score":0.4706059396266937},{"id":"https://openalex.org/keywords/simulation","display_name":"Simulation","score":0.34222131967544556},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.3383951783180237},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.27032047510147095},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2597599923610687},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.19464510679244995},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.12496426701545715},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.0843377411365509},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.08149972558021545}],"concepts":[{"id":"https://openalex.org/C2778584943","wikidata":"https://www.wikidata.org/wiki/Q6459541","display_name":"LOOM","level":2,"score":0.9912830591201782},{"id":"https://openalex.org/C2778787235","wikidata":"https://www.wikidata.org/wiki/Q49007","display_name":"Yarn","level":2,"score":0.6343278884887695},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6171810030937195},{"id":"https://openalex.org/C164767435","wikidata":"https://www.wikidata.org/wiki/Q28823","display_name":"Textile","level":2,"score":0.5589165091514587},{"id":"https://openalex.org/C132090242","wikidata":"https://www.wikidata.org/wiki/Q32738","display_name":"Microcomputer","level":3,"score":0.5038229823112488},{"id":"https://openalex.org/C54525549","wikidata":"https://www.wikidata.org/wiki/Q2553445","display_name":"Weaving","level":2,"score":0.4706059396266937},{"id":"https://openalex.org/C44154836","wikidata":"https://www.wikidata.org/wiki/Q45045","display_name":"Simulation","level":1,"score":0.34222131967544556},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.3383951783180237},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.27032047510147095},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2597599923610687},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.19464510679244995},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.12496426701545715},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0843377411365509},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.08149972558021545},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iscid.2009.185","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iscid.2009.185","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 Second International Symposium on Computational Intelligence and Design","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":2,"referenced_works":["https://openalex.org/W2362402139","https://openalex.org/W2367920817"],"related_works":["https://openalex.org/W2575258119","https://openalex.org/W4230819241","https://openalex.org/W1987512196","https://openalex.org/W2348296977","https://openalex.org/W1995376137","https://openalex.org/W2056028772","https://openalex.org/W2499502399","https://openalex.org/W2356552547","https://openalex.org/W2386492862","https://openalex.org/W3136882269"],"abstract_inverted_index":{"In":[0,35],"order":[1],"to":[2,10,24,62],"guarantee":[3],"the":[4,12,38,43,63,81],"quality":[5],"of":[6,14,32,42,48,65,67,75,89,116],"textile":[7,68],"fabric":[8],"and":[9,20,50,53,70,73,87,93,98,102,113],"improve":[11],"efficiency":[13],"loom,":[15],"single-chip":[16],"microcomputer":[17],"MC68336,":[18],"sensors":[19],"display":[21,74],"are":[22,78],"utilized":[23],"form":[25],"a":[26,107],"comprehensive":[27],"information":[28,104],"management":[29],"system":[30,82],"(IMS)":[31],"rapier":[33,117],"loom.":[34],"this":[36],"system,":[37],"main":[39,100],"operating":[40],"parameters":[41,77,97],"loom":[44,118],"such":[45],"as":[46],"tension":[47],"warp":[49],"weft":[51,54],"yarns":[52],"density,":[55],"etc.":[56],"may":[57,119],"be":[58,120],"adjusted":[59],"conveniently":[60],"according":[61],"requirement":[64],"variety":[66],"fabric,":[69],"real-time":[71],"detection":[72],"these":[76],"available.":[79],"Besides,":[80],"also":[83],"provides":[84],"storage,":[85],"transmission":[86],"printing":[88],"test":[90],"data,":[91],"images":[92],"tables,":[94],"monitors":[95],"dynamic":[96],"controls":[99],"parameters,":[101],"manages":[103],"resource":[105],"in":[106],"unified":[108],"way.":[109],"Therefore,":[110],"high-efficiency,":[111],"flexible":[112],"comfortable":[114],"operation":[115],"realized.":[121]},"counts_by_year":[{"year":2021,"cited_by_count":1},{"year":2015,"cited_by_count":1}],"updated_date":"2026-04-16T08:26:57.006410","created_date":"2025-10-10T00:00:00"}