{"id":"https://openalex.org/W4390337067","doi":"https://doi.org/10.1109/icta60488.2023.10364265","title":"An Energy-Efficient Gain-Cell Embedded DRAM Design with Weight Encoding for CNN Applications","display_name":"An Energy-Efficient Gain-Cell Embedded DRAM Design with Weight Encoding for CNN Applications","publication_year":2023,"publication_date":"2023-10-27","ids":{"openalex":"https://openalex.org/W4390337067","doi":"https://doi.org/10.1109/icta60488.2023.10364265"},"language":"en","primary_location":{"id":"doi:10.1109/icta60488.2023.10364265","is_oa":false,"landing_page_url":"http://dx.doi.org/10.1109/icta60488.2023.10364265","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5055470393","display_name":"Tao Huang","orcid":"https://orcid.org/0000-0002-7645-4290"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Tao Huang","raw_affiliation_strings":["School of Integrated Circuits, Tsinghua University"],"affiliations":[{"raw_affiliation_string":"School of Integrated Circuits, Tsinghua University","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067582461","display_name":"Run Run","orcid":null},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Run Run","raw_affiliation_strings":["School of Integrated Circuits, Tsinghua University"],"affiliations":[{"raw_affiliation_string":"School of Integrated Circuits, Tsinghua University","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101565602","display_name":"Yi Hu","orcid":"https://orcid.org/0000-0003-2325-0873"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yi Hu","raw_affiliation_strings":["School of Integrated Circuits, Tsinghua University"],"affiliations":[{"raw_affiliation_string":"School of Integrated Circuits, Tsinghua University","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100451116","display_name":"Yin Li","orcid":"https://orcid.org/0000-0002-2635-6633"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Li Yin","raw_affiliation_strings":["School of Integrated Circuits, Tsinghua University"],"affiliations":[{"raw_affiliation_string":"School of Integrated Circuits, Tsinghua University","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102144520","display_name":"Liyang Pan","orcid":null},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Liyang Pan","raw_affiliation_strings":["School of Integrated Circuits, Tsinghua University"],"affiliations":[{"raw_affiliation_string":"School of Integrated Circuits, Tsinghua University","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101764544","display_name":"Guolin Li","orcid":"https://orcid.org/0000-0002-6825-0917"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Guolin Li","raw_affiliation_strings":["Tsinghua University,Department of Electronic Engineering","Department of Electronic Engineering, Tsinghua University"],"affiliations":[{"raw_affiliation_string":"Tsinghua University,Department of Electronic Engineering","institution_ids":["https://openalex.org/I99065089"]},{"raw_affiliation_string":"Department of Electronic Engineering, Tsinghua University","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100642396","display_name":"Xiang Xie","orcid":"https://orcid.org/0000-0002-6895-3145"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiang Xie","raw_affiliation_strings":["School of Integrated Circuits, Tsinghua University"],"affiliations":[{"raw_affiliation_string":"School of Integrated Circuits, Tsinghua University","institution_ids":["https://openalex.org/I99065089"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5055470393"],"corresponding_institution_ids":["https://openalex.org/I99065089"],"apc_list":null,"apc_paid":null,"fwci":0.2678,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.56285921,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"2"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10502","display_name":"Advanced Memory and Neural Computing","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10502","display_name":"Advanced Memory and Neural Computing","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12808","display_name":"Ferroelectric and Negative Capacitance Devices","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/dram","display_name":"Dram","score":0.82215416431427},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.7363346815109253},{"id":"https://openalex.org/keywords/encoding","display_name":"Encoding (memory)","score":0.712750256061554},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.40666937828063965},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.38325440883636475},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.34479236602783203},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.12087327241897583}],"concepts":[{"id":"https://openalex.org/C7366592","wikidata":"https://www.wikidata.org/wiki/Q1255620","display_name":"Dram","level":2,"score":0.82215416431427},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.7363346815109253},{"id":"https://openalex.org/C125411270","wikidata":"https://www.wikidata.org/wiki/Q18653","display_name":"Encoding (memory)","level":2,"score":0.712750256061554},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.40666937828063965},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.38325440883636475},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.34479236602783203},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.12087327241897583}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icta60488.2023.10364265","is_oa":false,"landing_page_url":"http://dx.doi.org/10.1109/icta60488.2023.10364265","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.8999999761581421,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W1491237044","https://openalex.org/W2002293402","https://openalex.org/W2522548197","https://openalex.org/W2800944932","https://openalex.org/W2884687835","https://openalex.org/W4225364593","https://openalex.org/W4285264221"],"related_works":["https://openalex.org/W3120961607","https://openalex.org/W4401568740","https://openalex.org/W2098207691","https://openalex.org/W3148568549","https://openalex.org/W1648516568","https://openalex.org/W361036515","https://openalex.org/W2269474412","https://openalex.org/W4386903460","https://openalex.org/W4211178602","https://openalex.org/W2433923775"],"abstract_inverted_index":{"In":[0],"the":[1,26,33,36,43,62,68,86],"inference":[2],"process":[3],"of":[4,20,25,35,38,46,64,75,92],"convolutional":[5],"neural":[6],"networks":[7],"(CNNs),":[8],"reading":[9,44,65,79],"weights":[10],"from":[11],"on-chip":[12],"memory":[13],"numerous":[14],"times":[15],"consumes":[16],"a":[17,73,90],"significant":[18],"amount":[19],"energy,":[21],"which":[22],"is":[23,55],"one":[24],"bottlenecks":[27],"for":[28,57,81],"low-power":[29],"design.":[30],"Based":[31],"on":[32],"analysis":[34],"characteristics":[37],"CNN":[39,58],"weight":[40,53],"distribution":[41],"and":[42],"mechanism":[45],"GC-eDRAM,":[47],"an":[48],"energy-efficient":[49],"GC-eDRAM":[50,70],"design":[51,71],"with":[52,89],"encoding":[54],"proposed":[56,69],"inferences.":[59],"By":[60],"minimizing":[61],"instances":[63],"bit":[66],"\u20181\u2019,":[67],"achieves":[72],"reduction":[74],"energy":[76],"dissipation":[77],"in":[78],"operations":[80],"CNNs,":[82],"as":[83],"indicated":[84],"by":[85],"post-simulation":[87],"results,":[88],"decrease":[91],"13.7%":[93],"to":[94],"16.4%.":[95]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1}],"updated_date":"2025-12-25T23:11:45.687758","created_date":"2025-10-10T00:00:00"}
