{"id":"https://openalex.org/W4385484910","doi":"https://doi.org/10.1109/icphm57936.2023.10193978","title":"Accurate Material Characterization of Wideband RF Signals via Registration-based Curve Fitting Model using Microstrip Transmission Line","display_name":"Accurate Material Characterization of Wideband RF Signals via Registration-based Curve Fitting Model using Microstrip Transmission Line","publication_year":2023,"publication_date":"2023-06-05","ids":{"openalex":"https://openalex.org/W4385484910","doi":"https://doi.org/10.1109/icphm57936.2023.10193978"},"language":"en","primary_location":{"id":"doi:10.1109/icphm57936.2023.10193978","is_oa":false,"landing_page_url":"http://dx.doi.org/10.1109/icphm57936.2023.10193978","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE International Conference on Prognostics and Health Management (ICPHM)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5063095462","display_name":"Subrata Mukherjee","orcid":"https://orcid.org/0000-0003-0993-0338"},"institutions":[{"id":"https://openalex.org/I87216513","display_name":"Michigan State University","ror":"https://ror.org/05hs6h993","country_code":"US","type":"education","lineage":["https://openalex.org/I87216513"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Subrata Mukherjee","raw_affiliation_strings":["Michigan State University,Electrical and Computer Engineering,East Lansing,USA","Electrical and Computer Engineering, Michigan State University, East Lansing, USA"],"affiliations":[{"raw_affiliation_string":"Michigan State University,Electrical and Computer Engineering,East Lansing,USA","institution_ids":["https://openalex.org/I87216513"]},{"raw_affiliation_string":"Electrical and Computer Engineering, Michigan State University, East Lansing, USA","institution_ids":["https://openalex.org/I87216513"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5083841259","display_name":"Deepak Kumar","orcid":"https://orcid.org/0000-0003-2976-9924"},"institutions":[{"id":"https://openalex.org/I87216513","display_name":"Michigan State University","ror":"https://ror.org/05hs6h993","country_code":"US","type":"education","lineage":["https://openalex.org/I87216513"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Deepak Kumar","raw_affiliation_strings":["Michigan State University,Electrical and Computer Engineering,East Lansing,USA","Electrical and Computer Engineering, Michigan State University, East Lansing, USA"],"affiliations":[{"raw_affiliation_string":"Michigan State University,Electrical and Computer Engineering,East Lansing,USA","institution_ids":["https://openalex.org/I87216513"]},{"raw_affiliation_string":"Electrical and Computer Engineering, Michigan State University, East Lansing, USA","institution_ids":["https://openalex.org/I87216513"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5057920750","display_name":"Obaid Elshafiey","orcid":"https://orcid.org/0000-0001-7537-6182"},"institutions":[{"id":"https://openalex.org/I87216513","display_name":"Michigan State University","ror":"https://ror.org/05hs6h993","country_code":"US","type":"education","lineage":["https://openalex.org/I87216513"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Obaid Elshafiey","raw_affiliation_strings":["Michigan State University,Electrical and Computer Engineering,East Lansing,USA","Electrical and Computer Engineering, Michigan State University, East Lansing, USA"],"affiliations":[{"raw_affiliation_string":"Michigan State University,Electrical and Computer Engineering,East Lansing,USA","institution_ids":["https://openalex.org/I87216513"]},{"raw_affiliation_string":"Electrical and Computer Engineering, Michigan State University, East Lansing, USA","institution_ids":["https://openalex.org/I87216513"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5090893424","display_name":"\u041b\u0430\u043b\u0438\u0442\u0430 \u0423\u0434\u043f\u0430","orcid":"https://orcid.org/0000-0003-2007-0244"},"institutions":[{"id":"https://openalex.org/I87216513","display_name":"Michigan State University","ror":"https://ror.org/05hs6h993","country_code":"US","type":"education","lineage":["https://openalex.org/I87216513"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Lalita Udpa","raw_affiliation_strings":["Michigan State University,Electrical and Computer Engineering,East Lansing,USA","Electrical and Computer Engineering, Michigan State University, East Lansing, USA"],"affiliations":[{"raw_affiliation_string":"Michigan State University,Electrical and Computer Engineering,East Lansing,USA","institution_ids":["https://openalex.org/I87216513"]},{"raw_affiliation_string":"Electrical and Computer Engineering, Michigan State University, East Lansing, USA","institution_ids":["https://openalex.org/I87216513"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5025525711","display_name":"Yiming Deng","orcid":"https://orcid.org/0000-0001-5958-3683"},"institutions":[{"id":"https://openalex.org/I87216513","display_name":"Michigan State University","ror":"https://ror.org/05hs6h993","country_code":"US","type":"education","lineage":["https://openalex.org/I87216513"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yiming Deng","raw_affiliation_strings":["Michigan State University,Electrical and Computer Engineering,East Lansing,USA","Electrical and Computer Engineering, Michigan State University, East Lansing, USA"],"affiliations":[{"raw_affiliation_string":"Michigan State University,Electrical and Computer Engineering,East Lansing,USA","institution_ids":["https://openalex.org/I87216513"]},{"raw_affiliation_string":"Electrical and Computer Engineering, Michigan State University, East Lansing, USA","institution_ids":["https://openalex.org/I87216513"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5063095462"],"corresponding_institution_ids":["https://openalex.org/I87216513"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.07621123,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"139","last_page":"145"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11607","display_name":"Microwave and Dielectric Measurement Techniques","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11607","display_name":"Microwave and Dielectric Measurement Techniques","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11312","display_name":"Soil Moisture and Remote Sensing","score":0.9948999881744385,"subfield":{"id":"https://openalex.org/subfields/2305","display_name":"Environmental Engineering"},"field":{"id":"https://openalex.org/fields/23","display_name":"Environmental Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12169","display_name":"Non-Destructive Testing Techniques","score":0.9933000206947327,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microstrip","display_name":"Microstrip","score":0.7402185201644897},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.611279308795929},{"id":"https://openalex.org/keywords/transmission-line","display_name":"Transmission line","score":0.5580807328224182},{"id":"https://openalex.org/keywords/wideband","display_name":"Wideband","score":0.5236658453941345},{"id":"https://openalex.org/keywords/dimensionality-reduction","display_name":"Dimensionality reduction","score":0.4992241859436035},{"id":"https://openalex.org/keywords/parametric-statistics","display_name":"Parametric statistics","score":0.490477055311203},{"id":"https://openalex.org/keywords/curve-fitting","display_name":"Curve fitting","score":0.4772227108478546},{"id":"https://openalex.org/keywords/parametric-model","display_name":"Parametric model","score":0.46539270877838135},{"id":"https://openalex.org/keywords/dissipation-factor","display_name":"Dissipation factor","score":0.45341476798057556},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.44751453399658203},{"id":"https://openalex.org/keywords/scattering-parameters","display_name":"Scattering parameters","score":0.4414253830909729},{"id":"https://openalex.org/keywords/permittivity","display_name":"Permittivity","score":0.43854591250419617},{"id":"https://openalex.org/keywords/experimental-data","display_name":"Experimental data","score":0.43504413962364197},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.40472638607025146},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.4034302830696106},{"id":"https://openalex.org/keywords/machine-learning","display_name":"Machine learning","score":0.363783061504364},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.29254084825515747},{"id":"https://openalex.org/keywords/dielectric","display_name":"Dielectric","score":0.29130464792251587},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.13425052165985107},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.12710723280906677},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.12098437547683716},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.10916492342948914}],"concepts":[{"id":"https://openalex.org/C123657345","wikidata":"https://www.wikidata.org/wiki/Q639055","display_name":"Microstrip","level":2,"score":0.7402185201644897},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.611279308795929},{"id":"https://openalex.org/C33441834","wikidata":"https://www.wikidata.org/wiki/Q693004","display_name":"Transmission line","level":2,"score":0.5580807328224182},{"id":"https://openalex.org/C2780202535","wikidata":"https://www.wikidata.org/wiki/Q4524457","display_name":"Wideband","level":2,"score":0.5236658453941345},{"id":"https://openalex.org/C70518039","wikidata":"https://www.wikidata.org/wiki/Q16000077","display_name":"Dimensionality reduction","level":2,"score":0.4992241859436035},{"id":"https://openalex.org/C117251300","wikidata":"https://www.wikidata.org/wiki/Q1849855","display_name":"Parametric statistics","level":2,"score":0.490477055311203},{"id":"https://openalex.org/C184389593","wikidata":"https://www.wikidata.org/wiki/Q603159","display_name":"Curve fitting","level":2,"score":0.4772227108478546},{"id":"https://openalex.org/C24574437","wikidata":"https://www.wikidata.org/wiki/Q7135228","display_name":"Parametric model","level":3,"score":0.46539270877838135},{"id":"https://openalex.org/C97274863","wikidata":"https://www.wikidata.org/wiki/Q1040795","display_name":"Dissipation factor","level":3,"score":0.45341476798057556},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.44751453399658203},{"id":"https://openalex.org/C195266298","wikidata":"https://www.wikidata.org/wiki/Q2165620","display_name":"Scattering parameters","level":2,"score":0.4414253830909729},{"id":"https://openalex.org/C168651791","wikidata":"https://www.wikidata.org/wiki/Q211569","display_name":"Permittivity","level":3,"score":0.43854591250419617},{"id":"https://openalex.org/C55037315","wikidata":"https://www.wikidata.org/wiki/Q5421151","display_name":"Experimental data","level":2,"score":0.43504413962364197},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.40472638607025146},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.4034302830696106},{"id":"https://openalex.org/C119857082","wikidata":"https://www.wikidata.org/wiki/Q2539","display_name":"Machine learning","level":1,"score":0.363783061504364},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.29254084825515747},{"id":"https://openalex.org/C133386390","wikidata":"https://www.wikidata.org/wiki/Q184996","display_name":"Dielectric","level":2,"score":0.29130464792251587},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.13425052165985107},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.12710723280906677},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.12098437547683716},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.10916492342948914},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icphm57936.2023.10193978","is_oa":false,"landing_page_url":"http://dx.doi.org/10.1109/icphm57936.2023.10193978","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE International Conference on Prognostics and Health Management (ICPHM)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":17,"referenced_works":["https://openalex.org/W1530463524","https://openalex.org/W2017977879","https://openalex.org/W2086349765","https://openalex.org/W2090382476","https://openalex.org/W2157220229","https://openalex.org/W2903136240","https://openalex.org/W3037531055","https://openalex.org/W3084352071","https://openalex.org/W3115323686","https://openalex.org/W3119024056","https://openalex.org/W3184040287","https://openalex.org/W3205497034","https://openalex.org/W4282946043","https://openalex.org/W4289831538","https://openalex.org/W4298186561","https://openalex.org/W6776399789","https://openalex.org/W6787803212"],"related_works":["https://openalex.org/W4390098279","https://openalex.org/W2594346618","https://openalex.org/W2184626740","https://openalex.org/W2073047817","https://openalex.org/W2007842048","https://openalex.org/W2665130065","https://openalex.org/W3041530634","https://openalex.org/W2990794959","https://openalex.org/W1488731879","https://openalex.org/W2054400618"],"abstract_inverted_index":{"Knowledge":[0],"of":[1,100,182,195,205,217,236,260],"the":[2,38,49,58,113,128,139,160,176,180,186,193,198,203,215,234,273],"electrical":[3],"properties,":[4],"such":[5],"as":[6,135],"complex":[7,151],"permittivity,":[8],"permeability":[9],"and":[10,102,106,130,219,246,271],"loss":[11],"tangent":[12],"measurements":[13],"is":[14,107,252,264],"rapidly":[15],"becoming":[16],"a":[17,33,43],"necessity":[18],"for":[19,42,96,241],"Nondestructive":[20],"Evaluation":[21],"(NDE)":[22],"based":[23,47,226,265],"material":[24,46,257],"characterization.":[25],"In":[26,163],"this":[27,164],"paper,":[28],"we":[29,82,143,154],"aim":[30],"to":[31,36,74,171,255],"provide":[32],"data-driven":[34],"approach":[35],"estimate":[37],"wideband":[39],"dielectric":[40],"permittivity":[41],"given":[44],"substrate":[45,101],"on":[48,78,109,118,159,227,266],"frequency":[50,140,161,187],"responses":[51],"from":[52,70,185],"microstrip":[53,103,114],"transmission":[54,131],"lines":[55],"fabricated":[56,117],"with":[57,127,150,173,210],"material.":[59],"We":[60,201,232],"demonstrate":[61],"registration-aided":[62],"machine":[63,207],"learning":[64,88,208],"models":[65,90,158,259],"that":[66,263,275],"adaptively":[67],"use":[68],"information":[69],"large":[71],"simulated":[72],"datasets":[73],"make":[75],"improved":[76],"predictions":[77],"experimental":[79,110,147,177,199,244],"data":[80,85,95,111,137,178,221,245],"where":[81,112,179],"have":[83,272],"acute":[84],"scarcity.":[86],"Machine":[87],"(ML)":[89],"are":[91,116,133,169,189,222,230],"trained":[92],"using":[93],"simulation":[94],"several":[97],"unique":[98],"combinations":[99],"line":[104,115],"dimensions":[105],"tested":[108],"eleven":[119],"different":[120],"unknown":[121],"substrates.":[122],"The":[123],"<tex>$S$</tex>":[124],"parameters":[125],"associated":[126],"reflection":[129],"coefficients":[132],"treated":[134],"functional":[136],"across":[138],"sweeps.":[141],"As":[142,214],"had":[144],"very":[145],"few":[146],"data,":[148],"along":[149],"non-parametric":[152],"methods,":[153],"also":[155],"consider":[156],"low-complexity":[157,212],"curves.":[162],"aspect,":[165],"dimensionality":[166],"reduction":[167],"techniques":[168,240],"considered":[170],"deal":[172],"situations":[174],"in":[175,197,281],"number":[181,194],"features":[183],"obtained":[184,247],"sweeps":[188],"much":[190],"higher":[191],"than":[192],"samples":[196],"data.":[200],"compare":[202],"efficacy":[204,235],"data-hungry":[206],"methods":[209],"these":[211],"models.":[213],"source":[216],"train":[218],"test":[220],"different,":[223],"registration":[224],"strategies":[225],"intercept":[228],"correction":[229],"implemented.":[231],"illustrate":[233],"registration-based":[237],"varied":[238],"ML":[239],"lab":[242],"generated":[243],"encouraging":[248],"results.":[249],"This":[250],"work":[251],"an":[253],"attempt":[254],"by-pass":[256],"characterization":[258],"electromagnetic":[261],"(EM)-physics":[262],"closed":[267],"form":[268],"mathematical":[269],"equations":[270],"limitations":[274],"they":[276],"can":[277],"only":[278],"be":[279],"applied":[280],"idealized":[282],"set-ups.":[283]},"counts_by_year":[],"updated_date":"2025-12-24T23:09:58.560324","created_date":"2025-10-10T00:00:00"}